JPWO2022034769A1 - - Google Patents

Info

Publication number
JPWO2022034769A1
JPWO2022034769A1 JP2022542607A JP2022542607A JPWO2022034769A1 JP WO2022034769 A1 JPWO2022034769 A1 JP WO2022034769A1 JP 2022542607 A JP2022542607 A JP 2022542607A JP 2022542607 A JP2022542607 A JP 2022542607A JP WO2022034769 A1 JPWO2022034769 A1 JP WO2022034769A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022542607A
Other versions
JP7493039B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022034769A1 publication Critical patent/JPWO2022034769A1/ja
Application granted granted Critical
Publication of JP7493039B2 publication Critical patent/JP7493039B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
JP2022542607A 2020-08-12 2021-07-13 構造体、構造体の製造方法、接合体の製造方法及びデバイスの製造方法 Active JP7493039B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020136412 2020-08-12
JP2020136412 2020-08-12
PCT/JP2021/026279 WO2022034769A1 (ja) 2020-08-12 2021-07-13 構造体、構造体の製造方法、接合体の製造方法及びデバイスの製造方法

Publications (2)

Publication Number Publication Date
JPWO2022034769A1 true JPWO2022034769A1 (ja) 2022-02-17
JP7493039B2 JP7493039B2 (ja) 2024-05-30

Family

ID=80247200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022542607A Active JP7493039B2 (ja) 2020-08-12 2021-07-13 構造体、構造体の製造方法、接合体の製造方法及びデバイスの製造方法

Country Status (4)

Country Link
JP (1) JP7493039B2 (ja)
CN (1) CN116057681A (ja)
TW (1) TW202209352A (ja)
WO (1) WO2022034769A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129407A (ja) * 2008-11-28 2010-06-10 Japan Aviation Electronics Industry Ltd 電気接続部材
JP5363377B2 (ja) * 2010-02-19 2013-12-11 新光電気工業株式会社 配線基板及びその製造方法
JP6375249B2 (ja) * 2015-03-02 2018-08-15 新光電気工業株式会社 配線基板及びその製造方法、半導体パッケージ
WO2017150058A1 (ja) 2016-02-29 2017-09-08 富士フイルム株式会社 異方導電性接合部材、半導体デバイス、半導体パッケージおよび半導体デバイスの製造方法
JP6600285B2 (ja) * 2016-08-31 2019-10-30 富士フイルム株式会社 多層配線基板の製造方法

Also Published As

Publication number Publication date
TW202209352A (zh) 2022-03-01
JP7493039B2 (ja) 2024-05-30
WO2022034769A1 (ja) 2022-02-17
CN116057681A (zh) 2023-05-02

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