JPWO2022019311A5 - - Google Patents

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Publication number
JPWO2022019311A5
JPWO2022019311A5 JP2022538028A JP2022538028A JPWO2022019311A5 JP WO2022019311 A5 JPWO2022019311 A5 JP WO2022019311A5 JP 2022538028 A JP2022538028 A JP 2022538028A JP 2022538028 A JP2022538028 A JP 2022538028A JP WO2022019311 A5 JPWO2022019311 A5 JP WO2022019311A5
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JP
Japan
Prior art keywords
laser
metal foil
laser cutting
less
foil according
Prior art date
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Application number
JP2022538028A
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English (en)
Japanese (ja)
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JP7328456B2 (ja
JPWO2022019311A1 (enExample
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Priority claimed from PCT/JP2021/027216 external-priority patent/WO2022019311A1/ja
Publication of JPWO2022019311A1 publication Critical patent/JPWO2022019311A1/ja
Publication of JPWO2022019311A5 publication Critical patent/JPWO2022019311A5/ja
Application granted granted Critical
Publication of JP7328456B2 publication Critical patent/JP7328456B2/ja
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JP2022538028A 2020-07-20 2021-07-20 金属箔のレーザ切断方法 Active JP7328456B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020123947 2020-07-20
JP2020123947 2020-07-20
PCT/JP2021/027216 WO2022019311A1 (ja) 2020-07-20 2021-07-20 金属箔のレーザ切断方法

Publications (3)

Publication Number Publication Date
JPWO2022019311A1 JPWO2022019311A1 (enExample) 2022-01-27
JPWO2022019311A5 true JPWO2022019311A5 (enExample) 2023-03-10
JP7328456B2 JP7328456B2 (ja) 2023-08-16

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ID=79729173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022538028A Active JP7328456B2 (ja) 2020-07-20 2021-07-20 金属箔のレーザ切断方法

Country Status (6)

Country Link
US (1) US20230150057A1 (enExample)
EP (1) EP4183516A4 (enExample)
JP (1) JP7328456B2 (enExample)
KR (1) KR102846492B1 (enExample)
CN (1) CN116157228A (enExample)
WO (1) WO2022019311A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024235475A1 (en) * 2023-05-18 2024-11-21 Corelase Oy Metal foil cutting with pulsed fiber laser beam

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6664498B2 (en) * 2001-12-04 2003-12-16 General Atomics Method and apparatus for increasing the material removal rate in laser machining
GB2445771A (en) * 2007-01-19 2008-07-23 Gsi Group Ltd A diode pumped CW laser
JP6018744B2 (ja) * 2011-11-02 2016-11-02 日酸Tanaka株式会社 レーザ切断方法及びレーザ切断装置
JP6806057B2 (ja) * 2015-06-24 2021-01-06 株式会社豊田自動織機 切断装置
JP2017084691A (ja) * 2015-10-30 2017-05-18 株式会社豊田自動織機 電極シートの製造方法、及び電極シート

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