JPWO2021246478A1 - - Google Patents

Info

Publication number
JPWO2021246478A1
JPWO2021246478A1 JP2022528888A JP2022528888A JPWO2021246478A1 JP WO2021246478 A1 JPWO2021246478 A1 JP WO2021246478A1 JP 2022528888 A JP2022528888 A JP 2022528888A JP 2022528888 A JP2022528888 A JP 2022528888A JP WO2021246478 A1 JPWO2021246478 A1 JP WO2021246478A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022528888A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021246478A1 publication Critical patent/JPWO2021246478A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
JP2022528888A 2020-06-05 2021-06-03 Pending JPWO2021246478A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020098751 2020-06-05
PCT/JP2021/021166 WO2021246478A1 (ja) 2020-06-05 2021-06-03 樹脂組成物及びその製造方法並びにパターン形成用組成物の製造方法

Publications (1)

Publication Number Publication Date
JPWO2021246478A1 true JPWO2021246478A1 (zh) 2021-12-09

Family

ID=78831264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022528888A Pending JPWO2021246478A1 (zh) 2020-06-05 2021-06-03

Country Status (5)

Country Link
JP (1) JPWO2021246478A1 (zh)
KR (1) KR20230005972A (zh)
CN (1) CN115768832A (zh)
TW (1) TW202212423A (zh)
WO (1) WO2021246478A1 (zh)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3021748A1 (de) * 1980-06-10 1981-12-17 Siemens AG, 1000 Berlin und 8000 München Strahlungsreaktive vorstufen hochwaermebestaendiger polymerer
JPH07331090A (ja) 1994-06-06 1995-12-19 Japan Carlit Co Ltd:The 感温変色樹脂組成物とそれを用いた建築用部材
JP4399949B2 (ja) * 1999-06-29 2010-01-20 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターンの製造法及び電子部品
JP2002249465A (ja) * 2001-02-22 2002-09-06 Mitsui Chemicals Inc ３種の反応性基を有する新規な化合物
JP2003209104A (ja) * 2002-01-15 2003-07-25 Hitachi Chemical Dupont Microsystems Ltd 半導体装置及びその材料
JP5724871B2 (ja) * 2009-04-02 2015-05-27 コニカミノルタ株式会社 インクジェットインク及び画像形成方法
JP5597988B2 (ja) * 2009-12-24 2014-10-01 三菱瓦斯化学株式会社 感光性・熱硬化性ポリイミド樹脂組成物及びその硬化物
WO2014097633A1 (ja) * 2012-12-21 2014-06-26 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置
CN104804351B (zh) * 2014-01-27 2017-05-10 积水化成品工业株式会社 交联丙烯酸类树脂颗粒及其制造方法、树脂组合物以及包装物品
KR20160124082A (ko) * 2014-02-10 2016-10-26 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 폴리이미드 전구체를 포함하는 수지 조성물, 경화막의 제조 방법 및 전자 부품
DE112015004514T5 (de) * 2014-10-01 2017-08-17 Nipponkayaku Kabushikikaisha Fotoempfindliche harzzusammensetzung und deren ausgehärtetes produkt
CN107428935B (zh) * 2015-03-27 2019-04-02 东丽株式会社 二胺化合物、使用其的耐热性树脂或耐热性树脂前体
WO2017043474A1 (ja) * 2015-09-11 2017-03-16 富士フイルム株式会社 複素環含有ポリマー前駆体材料の製造方法、および、その応用
JP6506198B2 (ja) * 2015-11-17 2019-04-24 富士フイルム株式会社 感光性組成物、硬化物の製造方法、硬化膜、表示装置、及び、タッチパネル
JP6917570B2 (ja) 2016-12-27 2021-08-11 パナソニックＩｐマネジメント株式会社 発光装置
JP6891880B2 (ja) * 2017-03-28 2021-06-18 東レ株式会社 感光性樹脂組成物、硬化膜、硬化膜を具備する素子、硬化膜を具備する有機ｅｌ表示装置、硬化膜の製造方法、および有機ｅｌ表示装置の製造方法

Also Published As

Publication number Publication date
CN115768832A (zh) 2023-03-07
TW202212423A (zh) 2022-04-01
KR20230005972A (ko) 2023-01-10
WO2021246478A1 (ja) 2021-12-09

Similar Documents

Publication Publication Date Title
BR112023012656A2 (zh)
BR112021014123A2 (zh)
JPWO2021172420A1 (zh)
JPWO2021246457A1 (zh)
BR102021018859A2 (zh)
BR102021015500A2 (zh)
BR102021007058A2 (zh)
BR102020022030A2 (zh)
JPWO2022259933A1 (zh)
JPWO2022172962A1 (zh)
BR112023011610A2 (zh)
BR112023011539A2 (zh)
BR112023008976A2 (zh)
BR112023009656A2 (zh)
BR112023006729A2 (zh)
BR102021020147A2 (zh)
BR102021018926A2 (zh)
BR102021018167A2 (zh)
BR102021017576A2 (zh)
BR102021016837A2 (zh)
BR102021016551A2 (zh)
BR102021016375A2 (zh)
BR102021016200A2 (zh)
BR102021016176A2 (zh)
BR102021015566A2 (zh)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20221114

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231219

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20240207

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240411