JPWO2021246478A1 - - Google Patents
Info
- Publication number
- JPWO2021246478A1 JPWO2021246478A1 JP2022528888A JP2022528888A JPWO2021246478A1 JP WO2021246478 A1 JPWO2021246478 A1 JP WO2021246478A1 JP 2022528888 A JP2022528888 A JP 2022528888A JP 2022528888 A JP2022528888 A JP 2022528888A JP WO2021246478 A1 JPWO2021246478 A1 JP WO2021246478A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/22—Polybenzoxazoles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020098751 | 2020-06-05 | ||
| JP2020098751 | 2020-06-05 | ||
| PCT/JP2021/021166 WO2021246478A1 (ja) | 2020-06-05 | 2021-06-03 | 樹脂組成物及びその製造方法並びにパターン形成用組成物の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021246478A1 true JPWO2021246478A1 (https=) | 2021-12-09 |
| JP7595076B2 JP7595076B2 (ja) | 2024-12-05 |
Family
ID=78831264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022528888A Active JP7595076B2 (ja) | 2020-06-05 | 2021-06-03 | 樹脂組成物及びその製造方法並びにパターン形成用組成物の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7595076B2 (https=) |
| KR (1) | KR102800738B1 (https=) |
| CN (1) | CN115768832A (https=) |
| TW (1) | TWI899243B (https=) |
| WO (1) | WO2021246478A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5725329A (en) * | 1980-06-10 | 1982-02-10 | Siemens Ag | Radiation sensitive precursor of high heat- resistant polymer |
| JP2001075280A (ja) * | 1999-06-29 | 2001-03-23 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物、パターンの製造法及び電子部品 |
| JP2003209104A (ja) * | 2002-01-15 | 2003-07-25 | Hitachi Chemical Dupont Microsystems Ltd | 半導体装置及びその材料 |
| WO2017043474A1 (ja) * | 2015-09-11 | 2017-03-16 | 富士フイルム株式会社 | 複素環含有ポリマー前駆体材料の製造方法、および、その応用 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002249465A (ja) * | 2001-02-22 | 2002-09-06 | Mitsui Chemicals Inc | ３種の反応性基を有する新規な化合物 |
| JP2007331090A (ja) | 2006-05-15 | 2007-12-27 | Shin Kobe Electric Mach Co Ltd | 被研磨物保持材用板状体の製造法 |
| WO2010113588A1 (ja) * | 2009-04-02 | 2010-10-07 | コニカミノルタＩｊ株式会社 | インクジェットインク及び画像形成方法 |
| JP5597988B2 (ja) * | 2009-12-24 | 2014-10-01 | 三菱瓦斯化学株式会社 | 感光性・熱硬化性ポリイミド樹脂組成物及びその硬化物 |
| CN104870523B (zh) * | 2012-12-21 | 2017-10-31 | 日立化成杜邦微系统股份有限公司 | 聚酰亚胺前体、包含该聚酰亚胺前体的感光性树脂组合物、使用其的图案固化膜的制造方法和半导体装置 |
| CN104804351B (zh) * | 2014-01-27 | 2017-05-10 | 积水化成品工业株式会社 | 交联丙烯酸类树脂颗粒及其制造方法、树脂组合物以及包装物品 |
| JPWO2015118836A1 (ja) * | 2014-02-10 | 2017-03-23 | 日立化成デュポンマイクロシステムズ株式会社 | ポリイミド前駆体を含む樹脂組成物、硬化膜の製造方法及び電子部品 |
| KR20170066384A (ko) * | 2014-10-01 | 2017-06-14 | 갓코호우징 도쿄리카다이가쿠 | 감광성 수지 조성물 및 그 경화물 |
| WO2016158674A1 (ja) * | 2015-03-27 | 2016-10-06 | 東レ株式会社 | ジアミン化合物、それを用いた耐熱性樹脂または耐熱性樹脂前駆体 |
| JP6481032B2 (ja) * | 2015-06-30 | 2019-03-13 | 富士フイルム株式会社 | ネガ型感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス |
| JP6506198B2 (ja) * | 2015-11-17 | 2019-04-24 | 富士フイルム株式会社 | 感光性組成物、硬化物の製造方法、硬化膜、表示装置、及び、タッチパネル |
| KR102104806B1 (ko) * | 2016-01-29 | 2020-04-27 | 후지필름 가부시키가이샤 | 감광성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 적층체의 제조 방법, 및 반도체 디바이스 |
| JP6917570B2 (ja) | 2016-12-27 | 2021-08-11 | パナソニックＩｐマネジメント株式会社 | 発光装置 |
| KR102254366B1 (ko) * | 2017-03-28 | 2021-05-24 | 도레이 카부시키가이샤 | 감광성 수지 조성물, 경화막, 경화막을 구비하는 소자, 경화막을 구비하는 유기 el 표시 장치, 경화막의 제조 방법, 및 유기 el 표시 장치의 제조 방법 |
-
2021
- 2021-06-01 TW TW110119868A patent/TWI899243B/zh active
- 2021-06-03 KR KR1020227042233A patent/KR102800738B1/ko active Active
- 2021-06-03 JP JP2022528888A patent/JP7595076B2/ja active Active
- 2021-06-03 CN CN202180040286.4A patent/CN115768832A/zh active Pending
- 2021-06-03 WO PCT/JP2021/021166 patent/WO2021246478A1/ja not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5725329A (en) * | 1980-06-10 | 1982-02-10 | Siemens Ag | Radiation sensitive precursor of high heat- resistant polymer |
| JP2001075280A (ja) * | 1999-06-29 | 2001-03-23 | Hitachi Chemical Dupont Microsystems Ltd | 感光性樹脂組成物、パターンの製造法及び電子部品 |
| JP2003209104A (ja) * | 2002-01-15 | 2003-07-25 | Hitachi Chemical Dupont Microsystems Ltd | 半導体装置及びその材料 |
| WO2017043474A1 (ja) * | 2015-09-11 | 2017-03-16 | 富士フイルム株式会社 | 複素環含有ポリマー前駆体材料の製造方法、および、その応用 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102800738B1 (ko) | 2025-04-28 |
| KR20230005972A (ko) | 2023-01-10 |
| WO2021246478A1 (ja) | 2021-12-09 |
| CN115768832A (zh) | 2023-03-07 |
| JP7595076B2 (ja) | 2024-12-05 |
| TWI899243B (zh) | 2025-10-01 |
| TW202212423A (zh) | 2022-04-01 |
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