CN115768832A - 树脂组合物及其制造方法以及图案形成用组合物的制造方法 - Google Patents

树脂组合物及其制造方法以及图案形成用组合物的制造方法 Download PDF

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Publication number
CN115768832A
CN115768832A CN202180040286.4A CN202180040286A CN115768832A CN 115768832 A CN115768832 A CN 115768832A CN 202180040286 A CN202180040286 A CN 202180040286A CN 115768832 A CN115768832 A CN 115768832A
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compounds
resin
resin composition
formula
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铃木恭平
山口修平
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Fujifilm Corp
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
CN202180040286.4A 2020-06-05 2021-06-03 树脂组合物及其制造方法以及图案形成用组合物的制造方法 Pending CN115768832A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020098751 2020-06-05
JP2020-098751 2020-06-05
PCT/JP2021/021166 WO2021246478A1 (ja) 2020-06-05 2021-06-03 樹脂組成物及びその製造方法並びにパターン形成用組成物の製造方法

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Publication Number Publication Date
CN115768832A true CN115768832A (zh) 2023-03-07

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Country Link
JP (1) JP7595076B2 (https=)
KR (1) KR102800738B1 (https=)
CN (1) CN115768832A (https=)
TW (1) TWI899243B (https=)
WO (1) WO2021246478A1 (https=)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5725329A (en) * 1980-06-10 1982-02-10 Siemens Ag Radiation sensitive precursor of high heat- resistant polymer
JP2001075280A (ja) * 1999-06-29 2001-03-23 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造法及び電子部品
JP2002249465A (ja) * 2001-02-22 2002-09-06 Mitsui Chemicals Inc ３種の反応性基を有する新規な化合物
JP2003209104A (ja) * 2002-01-15 2003-07-25 Hitachi Chemical Dupont Microsystems Ltd 半導体装置及びその材料
WO2010113588A1 (ja) * 2009-04-02 2010-10-07 コニカミノルタＩｊ株式会社 インクジェットインク及び画像形成方法
JP2011132366A (ja) * 2009-12-24 2011-07-07 Mitsubishi Gas Chemical Co Inc 感光性・熱硬化性ポリイミド樹脂組成物及びその硬化物
CN104804351A (zh) * 2014-01-27 2015-07-29 积水化成品工业株式会社 交联丙烯酸类树脂颗粒及其制造方法、树脂组合物以及包装物品
CN104870523A (zh) * 2012-12-21 2015-08-26 日立化成杜邦微系统股份有限公司 聚酰亚胺前体、包含该聚酰亚胺前体的感光性树脂组合物、使用其的图案固化膜的制造方法和半导体装置
CN106462065A (zh) * 2014-02-10 2017-02-22 日立化成杜邦微系统股份有限公司 包含聚酰亚胺前体的树脂组合物、固化膜的制造方法和电子部件
WO2017043474A1 (ja) * 2015-09-11 2017-03-16 富士フイルム株式会社 複素環含有ポリマー前駆体材料の製造方法、および、その応用
CN106796394A (zh) * 2014-10-01 2017-05-31 学校法人东京理科大学 感光性树脂组合物及其固化物
CN107015434A (zh) * 2015-11-17 2017-08-04 富士胶片株式会社 感光性组合物、固化物制法、固化膜、显示装置及触控板
CN107428935A (zh) * 2015-03-27 2017-12-01 东丽株式会社 二胺化合物、使用其的耐热性树脂或耐热性树脂前体
CN110462513A (zh) * 2017-03-28 2019-11-15 东丽株式会社 感光性树脂组合物、固化膜、具备固化膜的元件、具备固化膜的有机el显示装置、固化膜的制造方法及有机el显示装置的制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007331090A (ja) 2006-05-15 2007-12-27 Shin Kobe Electric Mach Co Ltd 被研磨物保持材用板状体の製造法
JP6481032B2 (ja) * 2015-06-30 2019-03-13 富士フイルム株式会社 ネガ型感光性樹脂組成物、硬化膜、硬化膜の製造方法および半導体デバイス
KR102104806B1 (ko) * 2016-01-29 2020-04-27 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막, 적층체, 경화막의 제조 방법, 적층체의 제조 방법, 및 반도체 디바이스
JP6917570B2 (ja) 2016-12-27 2021-08-11 パナソニックＩｐマネジメント株式会社 発光装置

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5725329A (en) * 1980-06-10 1982-02-10 Siemens Ag Radiation sensitive precursor of high heat- resistant polymer
US4371685A (en) * 1980-06-10 1983-02-01 Siemens Aktiengesellschaft Radiation-reactive precursor stages of highly heat-resistant polymers
JP2001075280A (ja) * 1999-06-29 2001-03-23 Hitachi Chemical Dupont Microsystems Ltd 感光性樹脂組成物、パターンの製造法及び電子部品
JP2002249465A (ja) * 2001-02-22 2002-09-06 Mitsui Chemicals Inc ３種の反応性基を有する新規な化合物
JP2003209104A (ja) * 2002-01-15 2003-07-25 Hitachi Chemical Dupont Microsystems Ltd 半導体装置及びその材料
WO2010113588A1 (ja) * 2009-04-02 2010-10-07 コニカミノルタＩｊ株式会社 インクジェットインク及び画像形成方法
JP2011132366A (ja) * 2009-12-24 2011-07-07 Mitsubishi Gas Chemical Co Inc 感光性・熱硬化性ポリイミド樹脂組成物及びその硬化物
CN104870523A (zh) * 2012-12-21 2015-08-26 日立化成杜邦微系统股份有限公司 聚酰亚胺前体、包含该聚酰亚胺前体的感光性树脂组合物、使用其的图案固化膜的制造方法和半导体装置
CN104804351A (zh) * 2014-01-27 2015-07-29 积水化成品工业株式会社 交联丙烯酸类树脂颗粒及其制造方法、树脂组合物以及包装物品
CN106462065A (zh) * 2014-02-10 2017-02-22 日立化成杜邦微系统股份有限公司 包含聚酰亚胺前体的树脂组合物、固化膜的制造方法和电子部件
CN106796394A (zh) * 2014-10-01 2017-05-31 学校法人东京理科大学 感光性树脂组合物及其固化物
CN107428935A (zh) * 2015-03-27 2017-12-01 东丽株式会社 二胺化合物、使用其的耐热性树脂或耐热性树脂前体
WO2017043474A1 (ja) * 2015-09-11 2017-03-16 富士フイルム株式会社 複素環含有ポリマー前駆体材料の製造方法、および、その応用
CN107015434A (zh) * 2015-11-17 2017-08-04 富士胶片株式会社 感光性组合物、固化物制法、固化膜、显示装置及触控板
CN110462513A (zh) * 2017-03-28 2019-11-15 东丽株式会社 感光性树脂组合物、固化膜、具备固化膜的元件、具备固化膜的有机el显示装置、固化膜的制造方法及有机el显示装置的制造方法

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KR102800738B1 (ko) 2025-04-28
KR20230005972A (ko) 2023-01-10
JPWO2021246478A1 (https=) 2021-12-09
WO2021246478A1 (ja) 2021-12-09
JP7595076B2 (ja) 2024-12-05
TWI899243B (zh) 2025-10-01
TW202212423A (zh) 2022-04-01

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Application publication date: 20230307