JPWO2021235530A1 - - Google Patents
Info
- Publication number
- JPWO2021235530A1 JPWO2021235530A1 JP2022524543A JP2022524543A JPWO2021235530A1 JP WO2021235530 A1 JPWO2021235530 A1 JP WO2021235530A1 JP 2022524543 A JP2022524543 A JP 2022524543A JP 2022524543 A JP2022524543 A JP 2022524543A JP WO2021235530 A1 JPWO2021235530 A1 JP WO2021235530A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
- C01P2004/32—Spheres
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020088468 | 2020-05-20 | ||
| PCT/JP2021/019250 WO2021235530A1 (en) | 2020-05-20 | 2021-05-20 | Spherical crystalline silica particles and method for producing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021235530A1 true JPWO2021235530A1 (en) | 2021-11-25 |
Family
ID=78708593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022524543A Pending JPWO2021235530A1 (en) | 2020-05-20 | 2021-05-20 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2021235530A1 (en) |
| KR (1) | KR20230011937A (en) |
| CN (1) | CN115697907A (en) |
| TW (1) | TW202200499A (en) |
| WO (1) | WO2021235530A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023112928A1 (en) * | 2021-12-13 | 2023-06-22 | 日鉄ケミカル＆マテリアル株式会社 | Spherical crystalline silica particles, method for producing same, and resin composite composition and resin composite containing same |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002020111A (en) | 2000-06-29 | 2002-01-23 | Kyocera Corp | Porous powder and method for producing the same |
| JP4969632B2 (en) * | 2009-10-14 | 2012-07-04 | 信越石英株式会社 | Silica powder and silica container and method for producing them |
| CN103114333B (en) * | 2012-12-18 | 2016-08-03 | 常州英中纳米科技有限公司 | The preparation method of monocrystalline spherical silica particle |
| JP6347653B2 (en) * | 2014-04-21 | 2018-06-27 | 新日鉄住金マテリアルズ株式会社 | Method for producing spherical particles |
| TWI672267B (en) * | 2014-08-25 | 2019-09-21 | 日商日鐵化學材料股份有限公司 | Spherical crystalline cerium oxide particle and method of producing the same |
| US10844259B2 (en) * | 2016-04-22 | 2020-11-24 | Jgc Catalysts And Chemicals Ltd. | Silica-based composite fine particle dispersion and method for manufacturing same |
| JP7112179B2 (en) * | 2016-10-19 | 2022-08-03 | 日鉄ケミカル＆マテリアル株式会社 | Spherical siliceous powder for semiconductor encapsulant and method for producing the same |
| SG11201909287YA (en) * | 2017-04-05 | 2019-11-28 | Nippon Steel Chemical & Material Co Ltd | Spherical crystalline silica particles and method for producing same |
| JP6934344B2 (en) * | 2017-07-18 | 2021-09-15 | デンカ株式会社 | Powder for spherical silica filler and its manufacturing method |
| JP7017362B2 (en) * | 2017-10-04 | 2022-02-08 | 日鉄ケミカル＆マテリアル株式会社 | Spherical crystalline silica particles and their manufacturing method |
-
2021
- 2021-05-20 WO PCT/JP2021/019250 patent/WO2021235530A1/en active Application Filing
- 2021-05-20 KR KR1020227039520A patent/KR20230011937A/en unknown
- 2021-05-20 JP JP2022524543A patent/JPWO2021235530A1/ja active Pending
- 2021-05-20 CN CN202180036714.6A patent/CN115697907A/en active Pending
- 2021-05-20 TW TW110118341A patent/TW202200499A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20230011937A (en) | 2023-01-25 |
| TW202200499A (en) | 2022-01-01 |
| WO2021235530A1 (en) | 2021-11-25 |
| CN115697907A (en) | 2023-02-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220927 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240419 |