JPWO2021229655A1 - - Google Patents

Info

Publication number
JPWO2021229655A1
JPWO2021229655A1 JP2020547026A JP2020547026A JPWO2021229655A1 JP WO2021229655 A1 JPWO2021229655 A1 JP WO2021229655A1 JP 2020547026 A JP2020547026 A JP 2020547026A JP 2020547026 A JP2020547026 A JP 2020547026A JP WO2021229655 A1 JPWO2021229655 A1 JP WO2021229655A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020547026A
Other versions
JP6833126B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP6833126B1 publication Critical patent/JP6833126B1/ja
Publication of JPWO2021229655A1 publication Critical patent/JPWO2021229655A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/006—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to using of neural networks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/23—Arrangements of two or more lasers not provided for in groups H01S3/02 - H01S3/22, e.g. tandem arrangements of separate active media
    • H01S3/2383—Parallel arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Laser Beam Processing (AREA)
JP2020547026A 2020-05-11 2020-05-11 レーザ加工装置 Active JP6833126B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/018865 WO2021229655A1 (ja) 2020-05-11 2020-05-11 レーザ加工装置

Publications (2)

Publication Number Publication Date
JP6833126B1 JP6833126B1 (ja) 2021-02-24
JPWO2021229655A1 true JPWO2021229655A1 (ja) 2021-11-18

Family

ID=74665127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020547026A Active JP6833126B1 (ja) 2020-05-11 2020-05-11 レーザ加工装置

Country Status (4)

Country Link
US (1) US20230125357A1 (ja)
JP (1) JP6833126B1 (ja)
DE (1) DE112020007175T5 (ja)
WO (1) WO2021229655A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022215127A1 (ja) * 2021-04-05 2022-10-13 三菱電機株式会社 レーザ加工装置、学習装置、および推論装置
JP7098090B1 (ja) * 2022-01-28 2022-07-08 三菱電機株式会社 レーザ装置およびレーザ加工機

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886787A (ja) * 1981-11-19 1983-05-24 Nippon Sekigaisen Kogyo Kk レ−ザ照射装置
JP4046852B2 (ja) * 1997-06-24 2008-02-13 株式会社アマダ レーザ加工機用支援装置及びこれを備えたレーザ加工機
JP2002210576A (ja) * 2001-01-16 2002-07-30 Nippon Steel Corp 合成ｙａｇレーザによる薄手鋼板の溶接方法
JP6244308B2 (ja) 2011-12-09 2017-12-06 ルーメンタム オペレーションズ エルエルシーＬｕｍｅｎｔｕｍ Ｏｐｅｒａｔｉｏｎｓ ＬＬＣ レーザービームのビームパラメータ積を変動させること
JP2016112609A (ja) * 2014-12-18 2016-06-23 パナソニックＩｐマネジメント株式会社 レーザ切断装置およびレーザ切断方法
WO2017134964A1 (ja) * 2016-02-05 2017-08-10 村田機械株式会社 レーザ加工機およびレーザ加工方法
JP6625914B2 (ja) * 2016-03-17 2019-12-25 ファナック株式会社 機械学習装置、レーザ加工システムおよび機械学習方法
JP2018132728A (ja) * 2017-02-17 2018-08-23 三菱電機株式会社 反射型回折格子、レーザ発振器およびレーザ加工機

Also Published As

Publication number Publication date
JP6833126B1 (ja) 2021-02-24
WO2021229655A1 (ja) 2021-11-18
DE112020007175T5 (de) 2023-03-16
US20230125357A1 (en) 2023-04-27

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