JPWO2021221118A1 - - Google Patents

Info

Publication number
JPWO2021221118A1
JPWO2021221118A1 JP2022518127A JP2022518127A JPWO2021221118A1 JP WO2021221118 A1 JPWO2021221118 A1 JP WO2021221118A1 JP 2022518127 A JP2022518127 A JP 2022518127A JP 2022518127 A JP2022518127 A JP 2022518127A JP WO2021221118 A1 JPWO2021221118 A1 JP WO2021221118A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022518127A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021221118A1 publication Critical patent/JPWO2021221118A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2022518127A 2020-04-30 2021-04-28 Pending JPWO2021221118A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020080827 2020-04-30
PCT/JP2021/017021 WO2021221118A1 (ja) 2020-04-30 2021-04-28 樹脂組成物およびこれを用いたフィルム

Publications (1)

Publication Number Publication Date
JPWO2021221118A1 true JPWO2021221118A1 (de) 2021-11-04

Family

ID=78332394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022518127A Pending JPWO2021221118A1 (de) 2020-04-30 2021-04-28

Country Status (5)

Country Link
JP (1) JPWO2021221118A1 (de)
KR (1) KR20230004443A (de)
CN (1) CN115461411A (de)
TW (1) TW202206547A (de)
WO (1) WO2021221118A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7471984B2 (ja) 2020-09-30 2024-04-22 太陽ホールディングス株式会社 樹脂組成物およびこれを用いたフィルム
KR102647312B1 (ko) * 2022-07-18 2024-03-13 코오롱인더스트리 주식회사 광학 필름 및 이를 포함하는 표시장치
WO2024019472A1 (ko) * 2022-07-18 2024-01-25 코오롱인더스트리 주식회사 광학 필름 및 이를 포함하는 표시장치
JP2024017216A (ja) * 2022-07-27 2024-02-08 住友化学株式会社 ポリイミド系フィルム
WO2024071912A1 (ko) * 2022-09-29 2024-04-04 코오롱인더스트리 주식회사 탄성이력이 개선된 광학필름
WO2024082221A1 (en) * 2022-10-20 2024-04-25 Huawei Technologies Co., Ltd. Specification resin composition and film prepared therefrom
WO2024128683A1 (ko) * 2022-12-14 2024-06-20 코오롱인더스트리 주식회사 우수한 내눌림성을 갖는 광학 필름 및 이를 포함하는 표시장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002053883A (ja) * 2000-08-07 2002-02-19 Toyota Motor Corp 摺動部材用組成物
KR20050034643A (ko) * 2002-08-07 2005-04-14 데이진 가부시키가이샤 열가소성 수지 조성물과 성형체
JP2004149687A (ja) * 2002-10-31 2004-05-27 Teijin Ltd 被覆繊維状酸化アルミニウムフィラー及びこれを含む熱可塑性樹脂組成物
JP4634093B2 (ja) * 2004-08-09 2011-02-16 アクロス株式会社 摺動部材用組成物
JP2007238750A (ja) * 2006-03-08 2007-09-20 Nichias Corp 樹脂ペースト及び伝熱構造体
JP2010037451A (ja) * 2008-08-06 2010-02-18 Daikin Ind Ltd 摺動部材
WO2016060213A1 (ja) 2014-10-17 2016-04-21 三菱瓦斯化学株式会社 ポリイミド樹脂組成物、ポリイミドフィルム及び積層体
JP6834440B2 (ja) * 2016-12-12 2021-02-24 コニカミノルタ株式会社 ポリイミドフィルムおよび当該フィルムを用いる表示装置
WO2019044045A1 (ja) * 2017-08-28 2019-03-07 関東電化工業株式会社 熱伝導性粒子充填ファイバー

Also Published As

Publication number Publication date
TW202206547A (zh) 2022-02-16
WO2021221118A1 (ja) 2021-11-04
KR20230004443A (ko) 2023-01-06
CN115461411A (zh) 2022-12-09

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Legal Events

Date Code Title Description
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Effective date: 20240322