JPWO2021215105A1 - - Google Patents

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Publication number
JPWO2021215105A1
JPWO2021215105A1 JP2022516866A JP2022516866A JPWO2021215105A1 JP WO2021215105 A1 JPWO2021215105 A1 JP WO2021215105A1 JP 2022516866 A JP2022516866 A JP 2022516866A JP 2022516866 A JP2022516866 A JP 2022516866A JP WO2021215105 A1 JPWO2021215105 A1 JP WO2021215105A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022516866A
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Japanese (ja)
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JP7668266B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021215105A1 publication Critical patent/JPWO2021215105A1/ja
Application granted granted Critical
Publication of JP7668266B2 publication Critical patent/JP7668266B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/771Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising storage means other than floating diffusion
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50Control of the SSIS exposure
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/616Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/65Noise processing, e.g. detecting, correcting, reducing or removing noise applied to reset noise, e.g. KTC noise related to CMOS structures by techniques other than CDS
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/79Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2022516866A 2020-04-21 2021-02-24 固体撮像素子 Active JP7668266B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020075184 2020-04-21
JP2020075184 2020-04-21
JP2020193108 2020-11-20
JP2020193108 2020-11-20
PCT/JP2021/006785 WO2021215105A1 (ja) 2020-04-21 2021-02-24 固体撮像素子

Publications (2)

Publication Number Publication Date
JPWO2021215105A1 true JPWO2021215105A1 (https=) 2021-10-28
JP7668266B2 JP7668266B2 (ja) 2025-04-24

Family

ID=78270585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022516866A Active JP7668266B2 (ja) 2020-04-21 2021-02-24 固体撮像素子

Country Status (7)

Country Link
US (2) US12047701B2 (https=)
EP (2) EP4580208A3 (https=)
JP (1) JP7668266B2 (https=)
KR (2) KR20230005146A (https=)
CN (2) CN119629501A (https=)
DE (1) DE112021002443T5 (https=)
WO (1) WO2021215105A1 (https=)

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US12452555B2 (en) * 2021-07-26 2025-10-21 Sony Semiconductor Solutions Corporation Solid-state imaging element
WO2023063024A1 (ja) * 2021-10-15 2023-04-20 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
JPWO2023085138A1 (https=) 2021-11-12 2023-05-19
JPWO2023157489A1 (https=) * 2022-02-21 2023-08-24
WO2023166854A1 (ja) * 2022-03-04 2023-09-07 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
CN119404515A (zh) * 2022-06-29 2025-02-07 索尼半导体解决方案公司 固态成像元件、成像装置和控制固态成像元件的方法
US20250338015A1 (en) * 2022-07-25 2025-10-30 Sony Semiconductor Solutions Corporation Solid-state imaging element and electronic apparatus
WO2024095630A1 (ja) * 2022-10-31 2024-05-10 ソニーセミコンダクタソリューションズ株式会社 撮像装置
TW202441974A (zh) 2023-03-24 2024-10-16 日商索尼半導體解決方案公司 光檢測裝置及電子機器
TW202441976A (zh) 2023-03-24 2024-10-16 日商索尼半導體解決方案公司 光檢測裝置及電子機器
TW202441975A (zh) * 2023-03-24 2024-10-16 日商索尼半導體解決方案公司 光檢測裝置及電子機器
JP2025162299A (ja) 2024-04-15 2025-10-27 キヤノン株式会社 光電変換装置
JP2025183549A (ja) 2024-06-05 2025-12-17 キヤノン株式会社 光電変換装置、機器

Citations (3)

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JP2009296423A (ja) * 2008-06-06 2009-12-17 Sony Corp 固体撮像装置、撮像装置、電子機器、ad変換装置、ad変換方法
JP2014096669A (ja) * 2012-11-08 2014-05-22 Canon Inc 光電変換装置の駆動方法、光電変換装置、光電変換システム
US20180063459A1 (en) * 2016-08-29 2018-03-01 Stmicroelectronics (Research & Development) Limited Pixel Circuit and Method of Operating the Same

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JP3907559B2 (ja) * 2002-09-04 2007-04-18 リコーエレメックス株式会社 Xdsl用通信アダプタ、回線網制御装置の屋外配線方法、遠隔監視システム、及びガス保安検針用システム
JP2004186790A (ja) * 2002-11-29 2004-07-02 Sony Corp 固体撮像装置及びその駆動方法
JP3951994B2 (ja) * 2003-09-16 2007-08-01 ソニー株式会社 固体撮像装置およびカメラシステム
JP5167677B2 (ja) 2007-04-12 2013-03-21 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法、固体撮像装置の信号処理方法および撮像装置
US20090091648A1 (en) * 2007-10-09 2009-04-09 Shengmin Lin Multi-resolution Image Sensor Array with High Image Quality Pixel Readout Circuitry
JP5359315B2 (ja) * 2009-01-28 2013-12-04 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および撮像装置
JP5369779B2 (ja) * 2009-03-12 2013-12-18 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法および電子機器
US20100271517A1 (en) * 2009-04-24 2010-10-28 Yannick De Wit In-pixel correlated double sampling pixel
JP4846076B1 (ja) * 2010-06-11 2011-12-28 株式会社ブルックマンテクノロジ 増幅型固体撮像装置
JP5299496B2 (ja) * 2011-11-24 2013-09-25 ソニー株式会社 固体撮像素子及びカメラ装置
TWI530183B (zh) 2011-12-08 2016-04-11 新力股份有限公司 An imaging element, a control method, and an imaging device
JP2014112760A (ja) * 2012-12-05 2014-06-19 Sony Corp 固体撮像装置および電子機器
US9843757B2 (en) 2015-06-24 2017-12-12 Stmicroelectronics (Research & Development) Limited Optical electronic device including enhanced global shutter pixel array and related methods
US9654712B2 (en) 2015-10-07 2017-05-16 Semiconductor Components Industries, Llc Pixels with a global shutter and high dynamic range
EP3493528B1 (en) * 2016-07-28 2021-05-26 Sony Semiconductor Solutions Corporation Image pickup element
TWI754696B (zh) * 2016-12-14 2022-02-11 日商索尼半導體解決方案公司 固體攝像元件及電子機器
US10070090B2 (en) * 2017-02-03 2018-09-04 SmartSens Technology (U.S.), Inc. Stacked image sensor pixel cell with selectable shutter modes and in-pixel CDS
JP2018186478A (ja) * 2017-04-25 2018-11-22 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
EP4535815A1 (en) * 2017-05-10 2025-04-09 Brillnics Singapore Pte. Ltd. Solid-state imaging device, method for driving solid-state imaging device, and electronic apparatus
US20200244900A1 (en) * 2019-01-28 2020-07-30 Semiconductor Components Industries, Llc Backside illuminated image sensors with pixels that have high dynamic range, dynamic charge overflow, and global shutter scanning

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009296423A (ja) * 2008-06-06 2009-12-17 Sony Corp 固体撮像装置、撮像装置、電子機器、ad変換装置、ad変換方法
JP2014096669A (ja) * 2012-11-08 2014-05-22 Canon Inc 光電変換装置の駆動方法、光電変換装置、光電変換システム
US20180063459A1 (en) * 2016-08-29 2018-03-01 Stmicroelectronics (Research & Development) Limited Pixel Circuit and Method of Operating the Same

Also Published As

Publication number Publication date
US20240340551A1 (en) 2024-10-10
WO2021215105A1 (ja) 2021-10-28
US12047701B2 (en) 2024-07-23
CN119629501A (zh) 2025-03-14
US12581218B2 (en) 2026-03-17
JP7668266B2 (ja) 2025-04-24
EP4142281A4 (en) 2023-09-20
KR20250004111A (ko) 2025-01-07
EP4142281A1 (en) 2023-03-01
EP4580208A2 (en) 2025-07-02
CN115398885A (zh) 2022-11-25
CN115398885B (zh) 2026-03-20
EP4142281B1 (en) 2025-05-21
EP4580208A3 (en) 2025-08-20
US20230188867A1 (en) 2023-06-15
DE112021002443T5 (de) 2023-02-23
KR20230005146A (ko) 2023-01-09

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