JPWO2021206115A1 - - Google Patents

Info

Publication number
JPWO2021206115A1
JPWO2021206115A1 JP2022514103A JP2022514103A JPWO2021206115A1 JP WO2021206115 A1 JPWO2021206115 A1 JP WO2021206115A1 JP 2022514103 A JP2022514103 A JP 2022514103A JP 2022514103 A JP2022514103 A JP 2022514103A JP WO2021206115 A1 JPWO2021206115 A1 JP WO2021206115A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022514103A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021206115A1 publication Critical patent/JPWO2021206115A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
JP2022514103A 2020-04-10 2021-04-07 Pending JPWO2021206115A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020070801 2020-04-10
PCT/JP2021/014718 WO2021206115A1 (fr) 2020-04-10 2021-04-07 Composition adhésive, film adhésif, structure connectée et leur procédé de production

Publications (1)

Publication Number Publication Date
JPWO2021206115A1 true JPWO2021206115A1 (fr) 2021-10-14

Family

ID=78024142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022514103A Pending JPWO2021206115A1 (fr) 2020-04-10 2021-04-07

Country Status (5)

Country Link
JP (1) JPWO2021206115A1 (fr)
KR (1) KR20220162734A (fr)
CN (1) CN115349003B (fr)
TW (1) TW202140710A (fr)
WO (1) WO2021206115A1 (fr)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367076B2 (ja) 1994-10-24 2003-01-14 日立化成工業株式会社 電気部材の接続構造及び接続方法
JPH08148213A (ja) 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
JP4032439B2 (ja) * 1996-05-23 2008-01-16 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
US5865936A (en) * 1997-03-28 1999-02-02 National Starch And Chemical Investment Holding Corporation Rapid curing structural acrylic adhesive
JPH1150032A (ja) 1997-08-04 1999-02-23 Hitachi Chem Co Ltd 回路用接続部材及び回路板
KR100673778B1 (ko) * 2005-08-19 2007-01-24 제일모직주식회사 저온 속경화형 이방성 도전 필름용 조성물, 그로부터제조된 이방성 도전 필름 및 그 제조방법
KR20100119830A (ko) 2007-05-15 2010-11-10 히다치 가세고교 가부시끼가이샤 회로 접속 재료 및 회로 부재의 접속 구조
WO2009063827A1 (fr) 2007-11-12 2009-05-22 Hitachi Chemical Company, Ltd. Matériau de connexion de circuit et structure pour connecter un élément de circuit
JP2010077317A (ja) * 2008-09-26 2010-04-08 Three M Innovative Properties Co 接着剤組成物、接着フィルム及びその使用方法
JP2011100605A (ja) 2009-11-05 2011-05-19 Hitachi Chem Co Ltd 回路接続材料及び、これを用いた回路部材の接続構造
JP2012241063A (ja) * 2011-05-17 2012-12-10 Nitto Denko Corp 半導体装置製造用の接着シート
JP7153489B2 (ja) * 2018-07-09 2022-10-14 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板

Also Published As

Publication number Publication date
CN115349003A (zh) 2022-11-15
CN115349003B (zh) 2024-02-06
KR20220162734A (ko) 2022-12-08
WO2021206115A1 (fr) 2021-10-14
TW202140710A (zh) 2021-11-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240208