JPWO2021193480A1 - - Google Patents
Info
- Publication number
- JPWO2021193480A1 JPWO2021193480A1 JP2022510455A JP2022510455A JPWO2021193480A1 JP WO2021193480 A1 JPWO2021193480 A1 JP WO2021193480A1 JP 2022510455 A JP2022510455 A JP 2022510455A JP 2022510455 A JP2022510455 A JP 2022510455A JP WO2021193480 A1 JPWO2021193480 A1 JP WO2021193480A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020056120 | 2020-03-26 | ||
| JP2020056120 | 2020-03-26 | ||
| PCT/JP2021/011557 WO2021193480A1 (ja) | 2020-03-26 | 2021-03-21 | 基板処理装置、半導体装置の製造方法およびプログラム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021193480A1 true JPWO2021193480A1 (https=) | 2021-09-30 |
| JPWO2021193480A5 JPWO2021193480A5 (https=) | 2022-11-22 |
| JP7329679B2 JP7329679B2 (ja) | 2023-08-18 |
Family
ID=77891776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022510455A Active JP7329679B2 (ja) | 2020-03-26 | 2021-03-21 | 基板処理装置、半導体装置の製造方法およびプログラム |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7329679B2 (https=) |
| WO (1) | WO2021193480A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006086392A (ja) * | 2004-09-17 | 2006-03-30 | Tokyo Electron Ltd | 半導体製造装置及びそのメンテナンス方法 |
| JP2009016799A (ja) * | 2007-06-07 | 2009-01-22 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| WO2017033979A1 (ja) * | 2015-08-26 | 2017-03-02 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
-
2021
- 2021-03-21 WO PCT/JP2021/011557 patent/WO2021193480A1/ja not_active Ceased
- 2021-03-21 JP JP2022510455A patent/JP7329679B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006086392A (ja) * | 2004-09-17 | 2006-03-30 | Tokyo Electron Ltd | 半導体製造装置及びそのメンテナンス方法 |
| JP2009016799A (ja) * | 2007-06-07 | 2009-01-22 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| WO2017033979A1 (ja) * | 2015-08-26 | 2017-03-02 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置およびプログラム |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7329679B2 (ja) | 2023-08-18 |
| WO2021193480A1 (ja) | 2021-09-30 |
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