JPWO2021186790A1 - - Google Patents

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Publication number
JPWO2021186790A1
JPWO2021186790A1 JP2022508046A JP2022508046A JPWO2021186790A1 JP WO2021186790 A1 JPWO2021186790 A1 JP WO2021186790A1 JP 2022508046 A JP2022508046 A JP 2022508046A JP 2022508046 A JP2022508046 A JP 2022508046A JP WO2021186790 A1 JPWO2021186790 A1 JP WO2021186790A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022508046A
Other languages
Japanese (ja)
Other versions
JP7369363B2 (ja
JPWO2021186790A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021186790A1 publication Critical patent/JPWO2021186790A1/ja
Publication of JPWO2021186790A5 publication Critical patent/JPWO2021186790A5/ja
Application granted granted Critical
Publication of JP7369363B2 publication Critical patent/JP7369363B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
    • H03H9/02023—Characteristics of piezoelectric layers, e.g. cutting angles consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2022508046A 2020-03-19 2020-11-10 水晶振動素子、水晶振動子及び水晶発振器 Active JP7369363B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020049701 2020-03-19
JP2020049701 2020-03-19
PCT/JP2020/041942 WO2021186790A1 (ja) 2020-03-19 2020-11-10 水晶振動素子、水晶振動子及び水晶発振器

Publications (3)

Publication Number Publication Date
JPWO2021186790A1 true JPWO2021186790A1 (https=) 2021-09-23
JPWO2021186790A5 JPWO2021186790A5 (https=) 2022-09-21
JP7369363B2 JP7369363B2 (ja) 2023-10-26

Family

ID=77771171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022508046A Active JP7369363B2 (ja) 2020-03-19 2020-11-10 水晶振動素子、水晶振動子及び水晶発振器

Country Status (4)

Country Link
US (1) US20230006645A1 (https=)
JP (1) JP7369363B2 (https=)
DE (1) DE112020006422T5 (https=)
WO (1) WO2021186790A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116054776A (zh) * 2022-12-28 2023-05-02 北京无线电计量测试研究所 用于单粒子效应试验的晶振
CN117595826A (zh) * 2023-11-20 2024-02-23 陈庭毅 一种恒温晶体振荡器及其制造方法、电子设备
CN118797965B (zh) * 2024-09-12 2025-01-03 西安电子科技大学 一种石英谐振器线性度的优化设计方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297663A (ja) * 1994-04-28 1995-11-10 Meidensha Corp 厚みすべり水晶振動子の製造方法
JP2001244778A (ja) * 1999-12-22 2001-09-07 Toyo Commun Equip Co Ltd 高周波圧電振動子
JP2002246866A (ja) * 2001-02-20 2002-08-30 Citizen Watch Co Ltd 表面実装型圧電デバイスとその製造方法
JP2011061418A (ja) * 2009-09-09 2011-03-24 Nippon Dempa Kogyo Co Ltd 水晶振動片及び水晶振動デバイス
JP2011205166A (ja) * 2010-03-24 2011-10-13 Seiko Epson Corp 恒温型圧電発振器及びその製造方法
JP2014007538A (ja) * 2012-06-25 2014-01-16 Daishinku Corp 水晶振動デバイス
JP2019092148A (ja) * 2017-11-16 2019-06-13 日本電波工業株式会社 圧電振動片及び圧電デバイス

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003324332A (ja) 2002-02-28 2003-11-14 Toyo Commun Equip Co Ltd ２回回転ｙカット水晶振動子とこれを用いた発振器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297663A (ja) * 1994-04-28 1995-11-10 Meidensha Corp 厚みすべり水晶振動子の製造方法
JP2001244778A (ja) * 1999-12-22 2001-09-07 Toyo Commun Equip Co Ltd 高周波圧電振動子
JP2002246866A (ja) * 2001-02-20 2002-08-30 Citizen Watch Co Ltd 表面実装型圧電デバイスとその製造方法
JP2011061418A (ja) * 2009-09-09 2011-03-24 Nippon Dempa Kogyo Co Ltd 水晶振動片及び水晶振動デバイス
JP2011205166A (ja) * 2010-03-24 2011-10-13 Seiko Epson Corp 恒温型圧電発振器及びその製造方法
JP2014007538A (ja) * 2012-06-25 2014-01-16 Daishinku Corp 水晶振動デバイス
JP2019092148A (ja) * 2017-11-16 2019-06-13 日本電波工業株式会社 圧電振動片及び圧電デバイス

Also Published As

Publication number Publication date
US20230006645A1 (en) 2023-01-05
DE112020006422T5 (de) 2022-11-03
WO2021186790A1 (ja) 2021-09-23
JP7369363B2 (ja) 2023-10-26

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