JPWO2021177461A1 - - Google Patents

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Publication number
JPWO2021177461A1
JPWO2021177461A1 JP2021540095A JP2021540095A JPWO2021177461A1 JP WO2021177461 A1 JPWO2021177461 A1 JP WO2021177461A1 JP 2021540095 A JP2021540095 A JP 2021540095A JP 2021540095 A JP2021540095 A JP 2021540095A JP WO2021177461 A1 JPWO2021177461 A1 JP WO2021177461A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021540095A
Other languages
Japanese (ja)
Other versions
JPWO2021177461A5 (https=
JP7342957B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021177461A1 publication Critical patent/JPWO2021177461A1/ja
Publication of JPWO2021177461A5 publication Critical patent/JPWO2021177461A5/ja
Application granted granted Critical
Publication of JP7342957B2 publication Critical patent/JP7342957B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2021540095A 2020-03-06 2021-03-05 純銅板、銅／セラミックス接合体、絶縁回路基板 Active JP7342957B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020038763 2020-03-06
JP2020038763 2020-03-06
PCT/JP2021/008812 WO2021177461A1 (ja) 2020-03-06 2021-03-05 純銅板、銅／セラミックス接合体、絶縁回路基板

Publications (3)

Publication Number Publication Date
JPWO2021177461A1 true JPWO2021177461A1 (https=) 2021-09-10
JPWO2021177461A5 JPWO2021177461A5 (https=) 2023-03-20
JP7342957B2 JP7342957B2 (ja) 2023-09-12

Family

ID=77614039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021540095A Active JP7342957B2 (ja) 2020-03-06 2021-03-05 純銅板、銅／セラミックス接合体、絶縁回路基板

Country Status (7)

Country Link
US (1) US20230090953A1 (https=)
EP (1) EP4116449A4 (https=)
JP (1) JP7342957B2 (https=)
KR (1) KR20220149679A (https=)
CN (1) CN115244196A (https=)
TW (1) TW202138573A (https=)
WO (1) WO2021177461A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12264390B1 (en) * 2022-07-29 2025-04-01 Mitsubishi Materials Corporation Pure copper material, insulating substrate, and electronic device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI870562B (zh) * 2020-03-06 2025-01-21 日商三菱綜合材料股份有限公司 純銅板
JP7791019B2 (ja) * 2022-03-14 2025-12-23 Ｄｏｗａメタルテック株式会社 銅－セラミックス接合基板およびその製造方法
JP7473066B2 (ja) * 2022-07-29 2024-04-23 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7444324B2 (ja) * 2022-07-29 2024-03-06 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
WO2024024899A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP2025144558A (ja) * 2024-03-19 2025-10-02 長春石油化學股▲分▼有限公司 銅箔、集電体およびリチウムイオン二次電池
EP4621086A1 (en) * 2024-03-19 2025-09-24 Chang Chun Petrochemical Co., Ltd. Copper foil, current collector and lithium ion secondary battery

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282797A (ja) * 1986-05-29 1987-12-08 Dowa Mining Co Ltd セラミツクス−銅直接接合用銅材
JP2000212660A (ja) * 1999-01-18 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2005179775A (ja) * 2003-11-28 2005-07-07 Nikko Metal Manufacturing Co Ltd プレス打抜き性に優れた電子部品用素材
JP2019183256A (ja) * 2018-04-09 2019-10-24 三菱マテリアル株式会社 スパッタリングターゲット材

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062058A (ja) 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The 結晶粒成長抑制無酸素銅
US6478902B2 (en) * 1999-07-08 2002-11-12 Praxair S.T. Technology, Inc. Fabrication and bonding of copper sputter targets
JP3838521B1 (ja) * 2005-12-27 2006-10-25 株式会社神戸製鋼所 高強度および優れた曲げ加工性を備えた銅合金およびその製造方法
JP6734033B2 (ja) * 2015-10-16 2020-08-05 株式会社Ｓｈカッパープロダクツ 無酸素銅板、無酸素銅板の製造方法およびセラミック配線基板
CN110462074A (zh) * 2017-03-31 2019-11-15 古河电气工业株式会社 用于带铜板的绝缘基板的铜板材及其制造方法
JP7180101B2 (ja) * 2018-03-30 2022-11-30 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
JP7156868B2 (ja) 2018-09-03 2022-10-19 日本碍子株式会社 負極及び亜鉛二次電池
JP7451964B2 (ja) * 2019-01-16 2024-03-19 株式会社プロテリアル Ｃｕ合金板およびその製造方法
JP6973680B2 (ja) * 2019-09-27 2021-12-01 三菱マテリアル株式会社 純銅板
TWI870562B (zh) * 2020-03-06 2025-01-21 日商三菱綜合材料股份有限公司 純銅板
JP7020595B2 (ja) * 2020-03-06 2022-02-16 三菱マテリアル株式会社 純銅板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282797A (ja) * 1986-05-29 1987-12-08 Dowa Mining Co Ltd セラミツクス−銅直接接合用銅材
JP2000212660A (ja) * 1999-01-18 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2005179775A (ja) * 2003-11-28 2005-07-07 Nikko Metal Manufacturing Co Ltd プレス打抜き性に優れた電子部品用素材
JP2019183256A (ja) * 2018-04-09 2019-10-24 三菱マテリアル株式会社 スパッタリングターゲット材

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12264390B1 (en) * 2022-07-29 2025-04-01 Mitsubishi Materials Corporation Pure copper material, insulating substrate, and electronic device

Also Published As

Publication number Publication date
TW202138573A (zh) 2021-10-16
EP4116449A4 (en) 2024-03-20
US20230090953A1 (en) 2023-03-23
WO2021177461A1 (ja) 2021-09-10
EP4116449A1 (en) 2023-01-11
CN115244196A (zh) 2022-10-25
JP7342957B2 (ja) 2023-09-12
KR20220149679A (ko) 2022-11-08

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