CN115244196A - 纯铜板、铜-陶瓷接合体、绝缘电路基板 - Google Patents

纯铜板、铜-陶瓷接合体、绝缘电路基板 Download PDF

Info

Publication number
CN115244196A
CN115244196A CN202180018288.3A CN202180018288A CN115244196A CN 115244196 A CN115244196 A CN 115244196A CN 202180018288 A CN202180018288 A CN 202180018288A CN 115244196 A CN115244196 A CN 115244196A
Authority
CN
China
Prior art keywords
less
pure copper
crystal grains
heat treatment
copper plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180018288.3A
Other languages
English (en)
Chinese (zh)
Inventor
松永裕隆
伊藤优树
森广行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of CN115244196A publication Critical patent/CN115244196A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Ceramic Engineering (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
CN202180018288.3A 2020-03-06 2021-03-05 纯铜板、铜-陶瓷接合体、绝缘电路基板 Pending CN115244196A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-038763 2020-03-06
JP2020038763 2020-03-06
PCT/JP2021/008812 WO2021177461A1 (ja) 2020-03-06 2021-03-05 純銅板、銅／セラミックス接合体、絶縁回路基板

Publications (1)

Publication Number Publication Date
CN115244196A true CN115244196A (zh) 2022-10-25

Family

ID=77614039

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180018288.3A Pending CN115244196A (zh) 2020-03-06 2021-03-05 纯铜板、铜-陶瓷接合体、绝缘电路基板

Country Status (7)

Country Link
US (1) US20230090953A1 (https=)
EP (1) EP4116449A4 (https=)
JP (1) JP7342957B2 (https=)
KR (1) KR20220149679A (https=)
CN (1) CN115244196A (https=)
TW (1) TW202138573A (https=)
WO (1) WO2021177461A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4116448A4 (en) * 2020-03-06 2024-03-27 Mitsubishi Materials Corporation PURE COPPER PLATE
JP7791019B2 (ja) * 2022-03-14 2025-12-23 Ｄｏｗａメタルテック株式会社 銅－セラミックス接合基板およびその製造方法
WO2024024909A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
WO2024024899A1 (ja) * 2022-07-29 2024-02-01 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7473066B2 (ja) * 2022-07-29 2024-04-23 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
JP7444324B2 (ja) * 2022-07-29 2024-03-06 三菱マテリアル株式会社 純銅材、絶縁基板、電子デバイス
EP4621086A1 (en) * 2024-03-19 2025-09-24 Chang Chun Petrochemical Co., Ltd. Copper foil, current collector and lithium ion secondary battery
US20250300189A1 (en) * 2024-03-19 2025-09-25 Chang Chun Petrochemical Co., Ltd. Copper foil, current collector and lithium ion secondary battery

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1262335A (zh) * 1999-01-18 2000-08-09 日矿金属株式会社 软性印刷电路基板用轧制铜箔及其制造方法
JP3838521B1 (ja) * 2005-12-27 2006-10-25 株式会社神戸製鋼所 高強度および優れた曲げ加工性を備えた銅合金およびその製造方法
JP2017075382A (ja) * 2015-10-16 2017-04-20 株式会社Ｓｈカッパープロダクツ 無酸素銅板、無酸素銅板の製造方法およびセラミック配線基板
JP2019178398A (ja) * 2018-03-30 2019-10-17 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
CN110462074A (zh) * 2017-03-31 2019-11-15 古河电气工业株式会社 用于带铜板的绝缘基板的铜板材及其制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62282797A (ja) * 1986-05-29 1987-12-08 Dowa Mining Co Ltd セラミツクス−銅直接接合用銅材
JPH062058A (ja) 1992-06-23 1994-01-11 Furukawa Electric Co Ltd:The 結晶粒成長抑制無酸素銅
US6478902B2 (en) * 1999-07-08 2002-11-12 Praxair S.T. Technology, Inc. Fabrication and bonding of copper sputter targets
JP4170977B2 (ja) * 2003-11-28 2008-10-22 日鉱金属株式会社 プレス打抜き性に優れた電子部品用素材
JP7121883B2 (ja) * 2018-04-09 2022-08-19 三菱マテリアル株式会社 スパッタリングターゲット材
JP7156868B2 (ja) 2018-09-03 2022-10-19 日本碍子株式会社 負極及び亜鉛二次電池
JP7451964B2 (ja) * 2019-01-16 2024-03-19 株式会社プロテリアル Ｃｕ合金板およびその製造方法
CN114269957B (zh) * 2019-09-27 2022-07-29 三菱综合材料株式会社 纯铜板
KR102927900B1 (ko) * 2020-03-06 2026-02-13 미쓰비시 마테리알 가부시키가이샤 순구리판
EP4116448A4 (en) * 2020-03-06 2024-03-27 Mitsubishi Materials Corporation PURE COPPER PLATE

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1262335A (zh) * 1999-01-18 2000-08-09 日矿金属株式会社 软性印刷电路基板用轧制铜箔及其制造方法
JP3838521B1 (ja) * 2005-12-27 2006-10-25 株式会社神戸製鋼所 高強度および優れた曲げ加工性を備えた銅合金およびその製造方法
JP2017075382A (ja) * 2015-10-16 2017-04-20 株式会社Ｓｈカッパープロダクツ 無酸素銅板、無酸素銅板の製造方法およびセラミック配線基板
CN110462074A (zh) * 2017-03-31 2019-11-15 古河电气工业株式会社 用于带铜板的绝缘基板的铜板材及其制造方法
JP2019178398A (ja) * 2018-03-30 2019-10-17 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー

Also Published As

Publication number Publication date
KR20220149679A (ko) 2022-11-08
WO2021177461A1 (ja) 2021-09-10
JPWO2021177461A1 (https=) 2021-09-10
TW202138573A (zh) 2021-10-16
US20230090953A1 (en) 2023-03-23
EP4116449A4 (en) 2024-03-20
JP7342957B2 (ja) 2023-09-12
EP4116449A1 (en) 2023-01-11

Similar Documents

Publication Publication Date Title
US12385110B2 (en) Pure copper plate
JP7020595B2 (ja) 純銅板
CN115244196A (zh) 纯铜板、铜-陶瓷接合体、绝缘电路基板
CN115210394B (zh) 纯铜板
CN114787400B (zh) 铜合金、铜合金塑性加工材、电子电气设备用组件、端子、汇流条及散热基板
CN114761590B (zh) 铜合金、铜合金塑性加工材、电子电气设备用组件、端子、汇流条及散热基板
JP6984799B1 (ja) 純銅板、銅／セラミックス接合体、絶縁回路基板
CN114761589B (zh) 铜合金、铜合金塑性加工材、电子电气设备用组件、端子、汇流条及散热基板
KR20230030578A (ko) 구리 합금, 구리 합금 소성 가공재, 전자·전기 기기용 부품, 단자, 버스 바, 리드 프레임, 방열 기판
WO2023127851A1 (ja) 銅合金異形条材、電子・電気機器用部品、端子、バスバー、リードフレーム、放熱基板
US12286698B2 (en) Pure copper material, insulating substrate, and electronic device
CN111440962A (zh) Cu合金板及其制造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20221025