JPWO2021171545A1 - - Google Patents
Info
- Publication number
- JPWO2021171545A1 JPWO2021171545A1 JP2022502767A JP2022502767A JPWO2021171545A1 JP WO2021171545 A1 JPWO2021171545 A1 JP WO2021171545A1 JP 2022502767 A JP2022502767 A JP 2022502767A JP 2022502767 A JP2022502767 A JP 2022502767A JP WO2021171545 A1 JPWO2021171545 A1 JP WO2021171545A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1003—Waveguide having a modified shape along the axis, e.g. branched, curved, tapered, voids
- H01S5/101—Curved waveguide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1003—Waveguide having a modified shape along the axis, e.g. branched, curved, tapered, voids
- H01S5/1014—Tapered waveguide, e.g. spotsize converter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1053—Comprising an active region having a varying composition or cross-section in a specific direction
- H01S5/1064—Comprising an active region having a varying composition or cross-section in a specific direction varying width along the optical axis
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/008260 WO2021171545A1 (ja) | 2020-02-28 | 2020-02-28 | 半導体レーザ装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021171545A1 true JPWO2021171545A1 (ja) | 2021-09-02 |
Family
ID=77491258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022502767A Pending JPWO2021171545A1 (ja) | 2020-02-28 | 2020-02-28 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230011072A1 (ja) |
JP (1) | JPWO2021171545A1 (ja) |
CN (1) | CN115152107A (ja) |
TW (1) | TW202133518A (ja) |
WO (1) | WO2021171545A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020116172A1 (ja) * | 2018-12-03 | 2020-06-11 | 古河電気工業株式会社 | 半導体レーザチップ実装サブマウントおよびその製造方法ならびに半導体レーザモジュール |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54135170U (ja) * | 1978-03-10 | 1979-09-19 | ||
JPS59154089A (ja) * | 1983-02-22 | 1984-09-03 | Sony Corp | 半導体レ−ザ− |
JPH0290585A (ja) * | 1988-09-27 | 1990-03-30 | Nec Corp | レーザ装置 |
JPH07191237A (ja) * | 1993-12-27 | 1995-07-28 | Rohm Co Ltd | 光通信用受発信モジュール |
JPH0923036A (ja) * | 1995-07-05 | 1997-01-21 | Nippon Telegr & Teleph Corp <Ntt> | 半導体レーザ |
WO1997024787A1 (fr) * | 1995-12-28 | 1997-07-10 | Matsushita Electric Industrial Co., Ltd. | Laser a semi-conducteur et procede de fabrication correspondant |
JPH11186659A (ja) * | 1997-12-22 | 1999-07-09 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子 |
JP2000312053A (ja) * | 1999-02-23 | 2000-11-07 | Mitsubishi Chemicals Corp | 半導体光デバイス装置 |
US6310995B1 (en) * | 1998-11-25 | 2001-10-30 | University Of Maryland | Resonantly coupled waveguides using a taper |
JP2002162528A (ja) * | 2000-09-13 | 2002-06-07 | Nippon Telegr & Teleph Corp <Ntt> | 平面型光回路及び光回路 |
US20020141682A1 (en) * | 2001-04-02 | 2002-10-03 | Sang-Wan Ryu | Spot-size converter integratrd laser diode and method for fabricating the same |
JP2005260223A (ja) * | 2004-03-08 | 2005-09-22 | Sumitomo Electric Ind Ltd | 光送信サブアセンブリ |
JP2011171606A (ja) * | 2010-02-19 | 2011-09-01 | Furukawa Electric Co Ltd:The | 半導体レーザおよび半導体レーザモジュール |
JP2011192909A (ja) * | 2010-03-16 | 2011-09-29 | Renesas Electronics Corp | 半導体レーザ、及びレーザパッケージ |
KR20140090031A (ko) * | 2013-01-08 | 2014-07-16 | 조호성 | To 캔 패키지 반사형 레이저 다이오드 모듈 |
WO2018117077A1 (ja) * | 2016-12-19 | 2018-06-28 | 古河電気工業株式会社 | 光集積素子および光送信機モジュール |
WO2019116547A1 (ja) * | 2017-12-15 | 2019-06-20 | 三菱電機株式会社 | 半導体レーザ装置および半導体レーザ装置の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3879521B2 (ja) * | 2001-04-23 | 2007-02-14 | オムロン株式会社 | 光学素子及び当該光学素子を用いた光トランシーバその他の光学装置 |
-
2020
- 2020-02-28 WO PCT/JP2020/008260 patent/WO2021171545A1/ja active Application Filing
- 2020-02-28 US US17/785,136 patent/US20230011072A1/en active Pending
- 2020-02-28 CN CN202080097388.5A patent/CN115152107A/zh active Pending
- 2020-02-28 JP JP2022502767A patent/JPWO2021171545A1/ja active Pending
- 2020-11-03 TW TW109138216A patent/TW202133518A/zh unknown
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54135170U (ja) * | 1978-03-10 | 1979-09-19 | ||
JPS59154089A (ja) * | 1983-02-22 | 1984-09-03 | Sony Corp | 半導体レ−ザ− |
JPH0290585A (ja) * | 1988-09-27 | 1990-03-30 | Nec Corp | レーザ装置 |
JPH07191237A (ja) * | 1993-12-27 | 1995-07-28 | Rohm Co Ltd | 光通信用受発信モジュール |
JPH0923036A (ja) * | 1995-07-05 | 1997-01-21 | Nippon Telegr & Teleph Corp <Ntt> | 半導体レーザ |
WO1997024787A1 (fr) * | 1995-12-28 | 1997-07-10 | Matsushita Electric Industrial Co., Ltd. | Laser a semi-conducteur et procede de fabrication correspondant |
JPH11186659A (ja) * | 1997-12-22 | 1999-07-09 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子 |
US6310995B1 (en) * | 1998-11-25 | 2001-10-30 | University Of Maryland | Resonantly coupled waveguides using a taper |
JP2000312053A (ja) * | 1999-02-23 | 2000-11-07 | Mitsubishi Chemicals Corp | 半導体光デバイス装置 |
JP2002162528A (ja) * | 2000-09-13 | 2002-06-07 | Nippon Telegr & Teleph Corp <Ntt> | 平面型光回路及び光回路 |
US20020141682A1 (en) * | 2001-04-02 | 2002-10-03 | Sang-Wan Ryu | Spot-size converter integratrd laser diode and method for fabricating the same |
JP2005260223A (ja) * | 2004-03-08 | 2005-09-22 | Sumitomo Electric Ind Ltd | 光送信サブアセンブリ |
JP2011171606A (ja) * | 2010-02-19 | 2011-09-01 | Furukawa Electric Co Ltd:The | 半導体レーザおよび半導体レーザモジュール |
JP2011192909A (ja) * | 2010-03-16 | 2011-09-29 | Renesas Electronics Corp | 半導体レーザ、及びレーザパッケージ |
KR20140090031A (ko) * | 2013-01-08 | 2014-07-16 | 조호성 | To 캔 패키지 반사형 레이저 다이오드 모듈 |
WO2018117077A1 (ja) * | 2016-12-19 | 2018-06-28 | 古河電気工業株式会社 | 光集積素子および光送信機モジュール |
WO2019116547A1 (ja) * | 2017-12-15 | 2019-06-20 | 三菱電機株式会社 | 半導体レーザ装置および半導体レーザ装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2021171545A1 (ja) | 2021-09-02 |
TW202133518A (zh) | 2021-09-01 |
US20230011072A1 (en) | 2023-01-12 |
CN115152107A (zh) | 2022-10-04 |
Similar Documents
Legal Events
Date | Code | Title | Description |
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A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220111 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230307 |
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Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20230905 |