JPWO2021166073A1 - - Google Patents
Info
- Publication number
- JPWO2021166073A1 JPWO2021166073A1 JP2020547237A JP2020547237A JPWO2021166073A1 JP WO2021166073 A1 JPWO2021166073 A1 JP WO2021166073A1 JP 2020547237 A JP2020547237 A JP 2020547237A JP 2020547237 A JP2020547237 A JP 2020547237A JP WO2021166073 A1 JPWO2021166073 A1 JP WO2021166073A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/006307 WO2021166073A1 (ja) | 2020-02-18 | 2020-02-18 | Ｔｏ－ｃａｎ型光半導体モジュール |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021166073A1 true JPWO2021166073A1 (https=) | 2021-08-26 |
Family
ID=77390707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020547237A Pending JPWO2021166073A1 (https=) | 2020-02-18 | 2020-02-18 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2021166073A1 (https=) |
| WO (1) | WO2021166073A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023109210A1 (zh) * | 2021-12-17 | 2023-06-22 | 青岛海信宽带多媒体技术有限公司 | 光模块 |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050105911A1 (en) * | 2003-11-14 | 2005-05-19 | Yong-Chan Keh | TO-can type optical module |
| JP2006216839A (ja) * | 2005-02-04 | 2006-08-17 | Mitsubishi Electric Corp | 光モジュール |
| JP2007150182A (ja) * | 2005-11-30 | 2007-06-14 | Mitsubishi Electric Corp | 光素子用ステムとこれを用いた光半導体装置 |
| JP2009077365A (ja) * | 2007-08-29 | 2009-04-09 | Kyocera Corp | 信号端子と信号線路導体との接続構造および電子部品搭載用パッケージならびに電子装置 |
| JP2009152520A (ja) * | 2007-11-26 | 2009-07-09 | Kyocera Corp | 信号端子と信号線路導体との接続構造および電子部品搭載用パッケージならびに電子装置 |
| JP2010062512A (ja) * | 2008-07-02 | 2010-03-18 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
| JP2011061750A (ja) * | 2009-09-15 | 2011-03-24 | Nippon Telegr & Teleph Corp <Ntt> | 高周波線路の接続方法、構造及び当該構造を有するパッケージ |
| JP2016225457A (ja) * | 2015-05-29 | 2016-12-28 | 新光電気工業株式会社 | 半導体装置用ステム及び半導体装置 |
| JP2017050357A (ja) * | 2015-08-31 | 2017-03-09 | 日本オクラロ株式会社 | 光モジュール |
| JP2018186130A (ja) * | 2017-04-24 | 2018-11-22 | 日本オクラロ株式会社 | 光アセンブリ、光モジュール、及び光伝送装置 |
| WO2019082602A1 (ja) * | 2017-10-26 | 2019-05-02 | 京セラ株式会社 | 接合構造体、半導体パッケージおよび半導体装置 |
-
2020
- 2020-02-18 WO PCT/JP2020/006307 patent/WO2021166073A1/ja not_active Ceased
- 2020-02-18 JP JP2020547237A patent/JPWO2021166073A1/ja active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050105911A1 (en) * | 2003-11-14 | 2005-05-19 | Yong-Chan Keh | TO-can type optical module |
| JP2006216839A (ja) * | 2005-02-04 | 2006-08-17 | Mitsubishi Electric Corp | 光モジュール |
| JP2007150182A (ja) * | 2005-11-30 | 2007-06-14 | Mitsubishi Electric Corp | 光素子用ステムとこれを用いた光半導体装置 |
| JP2009077365A (ja) * | 2007-08-29 | 2009-04-09 | Kyocera Corp | 信号端子と信号線路導体との接続構造および電子部品搭載用パッケージならびに電子装置 |
| JP2009152520A (ja) * | 2007-11-26 | 2009-07-09 | Kyocera Corp | 信号端子と信号線路導体との接続構造および電子部品搭載用パッケージならびに電子装置 |
| JP2010062512A (ja) * | 2008-07-02 | 2010-03-18 | Kyocera Corp | 電子部品搭載用パッケージおよびそれを用いた電子装置 |
| JP2011061750A (ja) * | 2009-09-15 | 2011-03-24 | Nippon Telegr & Teleph Corp <Ntt> | 高周波線路の接続方法、構造及び当該構造を有するパッケージ |
| JP2016225457A (ja) * | 2015-05-29 | 2016-12-28 | 新光電気工業株式会社 | 半導体装置用ステム及び半導体装置 |
| JP2017050357A (ja) * | 2015-08-31 | 2017-03-09 | 日本オクラロ株式会社 | 光モジュール |
| JP2018186130A (ja) * | 2017-04-24 | 2018-11-22 | 日本オクラロ株式会社 | 光アセンブリ、光モジュール、及び光伝送装置 |
| WO2019082602A1 (ja) * | 2017-10-26 | 2019-05-02 | 京セラ株式会社 | 接合構造体、半導体パッケージおよび半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021166073A1 (ja) | 2021-08-26 |
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