JPWO2021149469A1 - - Google Patents

Info

Publication number
JPWO2021149469A1
JPWO2021149469A1 JP2021573042A JP2021573042A JPWO2021149469A1 JP WO2021149469 A1 JPWO2021149469 A1 JP WO2021149469A1 JP 2021573042 A JP2021573042 A JP 2021573042A JP 2021573042 A JP2021573042 A JP 2021573042A JP WO2021149469 A1 JPWO2021149469 A1 JP WO2021149469A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021573042A
Other versions
JP7318746B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021149469A1 publication Critical patent/JPWO2021149469A1/ja
Application granted granted Critical
Publication of JP7318746B2 publication Critical patent/JP7318746B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H03H9/02622—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves of the surface, including back surface
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02157—Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2021573042A 2020-01-20 2020-12-28 弾性波装置 Active JP7318746B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020006608 2020-01-20
JP2020006608 2020-01-20
PCT/JP2020/049242 WO2021149469A1 (ja) 2020-01-20 2020-12-28 弾性波装置

Publications (2)

Publication Number Publication Date
JPWO2021149469A1 true JPWO2021149469A1 (ja) 2021-07-29
JP7318746B2 JP7318746B2 (ja) 2023-08-01

Family

ID=76993338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021573042A Active JP7318746B2 (ja) 2020-01-20 2020-12-28 弾性波装置

Country Status (3)

Country Link
US (1) US20220345105A1 (ja)
JP (1) JP7318746B2 (ja)
WO (1) WO2021149469A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012257019A (ja) * 2011-06-08 2012-12-27 Murata Mfg Co Ltd 弾性波装置
JP2014110457A (ja) * 2012-11-30 2014-06-12 Kyocera Corp 弾性波素子、分波器および通信モジュール
WO2015005267A1 (ja) * 2013-07-08 2015-01-15 株式会社村田製作所 弾性波装置
WO2016052129A1 (ja) * 2014-09-30 2016-04-07 株式会社村田製作所 弾性波装置及びその製造方法
WO2018096783A1 (ja) * 2016-11-22 2018-05-31 株式会社村田製作所 弾性波装置、フロントエンド回路および通信装置
JP2019021997A (ja) * 2017-07-12 2019-02-07 京セラ株式会社 弾性波素子、分波器および通信装置
WO2019111893A1 (ja) * 2017-12-06 2019-06-13 株式会社村田製作所 弾性波装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012257019A (ja) * 2011-06-08 2012-12-27 Murata Mfg Co Ltd 弾性波装置
JP2014110457A (ja) * 2012-11-30 2014-06-12 Kyocera Corp 弾性波素子、分波器および通信モジュール
WO2015005267A1 (ja) * 2013-07-08 2015-01-15 株式会社村田製作所 弾性波装置
WO2016052129A1 (ja) * 2014-09-30 2016-04-07 株式会社村田製作所 弾性波装置及びその製造方法
WO2018096783A1 (ja) * 2016-11-22 2018-05-31 株式会社村田製作所 弾性波装置、フロントエンド回路および通信装置
JP2019021997A (ja) * 2017-07-12 2019-02-07 京セラ株式会社 弾性波素子、分波器および通信装置
WO2019111893A1 (ja) * 2017-12-06 2019-06-13 株式会社村田製作所 弾性波装置

Also Published As

Publication number Publication date
WO2021149469A1 (ja) 2021-07-29
US20220345105A1 (en) 2022-10-27
JP7318746B2 (ja) 2023-08-01

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