JPWO2021141067A1 - - Google Patents

Info

Publication number
JPWO2021141067A1
JPWO2021141067A1 JP2021522110A JP2021522110A JPWO2021141067A1 JP WO2021141067 A1 JPWO2021141067 A1 JP WO2021141067A1 JP 2021522110 A JP2021522110 A JP 2021522110A JP 2021522110 A JP2021522110 A JP 2021522110A JP WO2021141067 A1 JPWO2021141067 A1 JP WO2021141067A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021522110A
Other languages
Japanese (ja)
Other versions
JP6956926B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021141067A1 publication Critical patent/JPWO2021141067A1/ja
Application granted granted Critical
Publication of JP6956926B1 publication Critical patent/JP6956926B1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Surgical Instruments (AREA)
JP2021522110A 2020-01-07 2021-01-07 電磁波シールドフィルム Active JP6956926B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020000637 2020-01-07
JP2020000637 2020-01-07
PCT/JP2021/000263 WO2021141067A1 (ja) 2020-01-07 2021-01-07 電磁波シールドフィルム

Publications (2)

Publication Number Publication Date
JPWO2021141067A1 true JPWO2021141067A1 (zh) 2021-07-15
JP6956926B1 JP6956926B1 (ja) 2021-11-02

Family

ID=76788064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021522110A Active JP6956926B1 (ja) 2020-01-07 2021-01-07 電磁波シールドフィルム

Country Status (5)

Country Link
JP (1) JP6956926B1 (zh)
KR (1) KR102669973B1 (zh)
CN (1) CN114762470A (zh)
TW (1) TWI807242B (zh)
WO (1) WO2021141067A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102594352B1 (ko) * 2022-10-13 2023-10-26 주식회사 유라 전자파 차폐성능이 개선된 자동차용 고속통신 케이블 및 이의 제조방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02271697A (ja) * 1989-04-13 1990-11-06 Nitto Denko Corp 静電気、電磁波シールド材
JP2001185894A (ja) * 1999-10-12 2001-07-06 Bridgestone Corp 電磁波シールド性ガラス
JP4491929B2 (ja) * 2000-07-27 2010-06-30 株式会社ブリヂストン 電磁波シールド性光透過積層体、その製造方法及びその装着方法
JP2002246788A (ja) * 2000-12-12 2002-08-30 Nisshinbo Ind Inc 透視性電磁波シールド材
JP2005183652A (ja) * 2003-12-19 2005-07-07 Fuji Photo Film Co Ltd 電磁波シールド材およびその製造方法、並びに、ディスプレイ
JP5672201B2 (ja) 2011-09-07 2015-02-18 デクセリアルズ株式会社 異方性導電フィルム及び接続構造体の製造方法
WO2015068611A1 (ja) 2013-11-07 2015-05-14 東洋インキＳｃホールディングス株式会社 導電性接着剤、導電性接着シート、配線デバイス、および配線デバイスの製造方法
JP6512804B2 (ja) * 2014-12-05 2019-05-15 日東電工株式会社 透明導電性フィルム積層体及びその用途
JP6516108B2 (ja) * 2017-08-10 2019-05-22 東洋インキＳｃホールディングス株式会社 真空成形用電磁波シールド積層体、およびこれを用いた電磁波シールド成形体
JP6863908B2 (ja) * 2018-01-12 2021-04-21 タツタ電線株式会社 電磁波シールドフィルム

Also Published As

Publication number Publication date
CN114762470A (zh) 2022-07-15
WO2021141067A1 (ja) 2021-07-15
JP6956926B1 (ja) 2021-11-02
KR102669973B1 (ko) 2024-05-27
KR20220124684A (ko) 2022-09-14
TW202134051A (zh) 2021-09-16
TWI807242B (zh) 2023-07-01

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