JPWO2021140904A1 - - Google Patents

Info

Publication number
JPWO2021140904A1
JPWO2021140904A1 JP2021569819A JP2021569819A JPWO2021140904A1 JP WO2021140904 A1 JPWO2021140904 A1 JP WO2021140904A1 JP 2021569819 A JP2021569819 A JP 2021569819A JP 2021569819 A JP2021569819 A JP 2021569819A JP WO2021140904 A1 JPWO2021140904 A1 JP WO2021140904A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021569819A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021140904A1 publication Critical patent/JPWO2021140904A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2021569819A 2020-01-10 2020-12-22 Pending JPWO2021140904A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020002840 2020-01-10
PCT/JP2020/047820 WO2021140904A1 (ja) 2020-01-10 2020-12-22 接触子、検査治具、検査装置、及び接触子の製造方法

Publications (1)

Publication Number Publication Date
JPWO2021140904A1 true JPWO2021140904A1 (ja) 2021-07-15

Family

ID=76788620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021569819A Pending JPWO2021140904A1 (ja) 2020-01-10 2020-12-22

Country Status (7)

Country Link
US (1) US20230349950A1 (ja)
EP (1) EP4089721A4 (ja)
JP (1) JPWO2021140904A1 (ja)
KR (1) KR20220127814A (ja)
CN (1) CN114930175A (ja)
TW (1) TWI776345B (ja)
WO (1) WO2021140904A1 (ja)

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5062619A (en) * 1989-04-03 1991-11-05 Nabeya Kogyo Co., Ltd. Non-linear spring
JPH08159195A (ja) * 1995-06-12 1996-06-18 Nabeya Kogyo Kk スプリング及びその製造方法
JPH11270604A (ja) * 1998-03-24 1999-10-05 Suncall Corp 樹脂製コイルばね
JP2003339139A (ja) * 2002-05-17 2003-11-28 Toshiba Tec Corp 電動機
JP4109021B2 (ja) * 2002-06-11 2008-06-25 オイレス工業株式会社 ばね内蔵型ダンパ
JP2005268090A (ja) * 2004-03-19 2005-09-29 Enplas Corp コンタクトピン及び電気部品用ソケット
JP4031007B2 (ja) 2005-07-15 2008-01-09 日本電子材料株式会社 垂直コイルスプリングプローブ及びこれを用いたプローブユニット
JP5624740B2 (ja) * 2009-07-30 2014-11-12 株式会社ヨコオ コンタクトプローブ及びソケット
WO2011013731A1 (ja) * 2009-07-30 2011-02-03 株式会社ヨコオ コンタクトプローブ及びソケット
KR101160843B1 (ko) * 2010-04-08 2012-06-29 박상량 인너 브릿지 타입의 스프링 프로브 핀
JP5480075B2 (ja) * 2010-09-07 2014-04-23 秀雄 西川 検査治具及び接触子
JP5861423B2 (ja) * 2011-12-06 2016-02-16 山一電機株式会社 コンタクトプローブ及びそれを備えた半導体素子用ソケット
JP5926587B2 (ja) * 2012-03-21 2016-05-25 株式会社エンプラス 電気接触子及び電気部品用ソケット
US8547128B1 (en) * 2012-05-06 2013-10-01 Jerzy Roman Sochor Contact probe with conductively coupled plungers
KR101525120B1 (ko) * 2013-11-08 2015-06-02 (주)아이윈 공차가 확대된 인너브릿지 타입 스프링 프로 브 핀
JP6411169B2 (ja) * 2014-10-22 2018-10-24 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
JP6610322B2 (ja) * 2016-02-15 2019-11-27 オムロン株式会社 プローブピンおよびそれを用いた検査装置
JP6740630B2 (ja) * 2016-02-15 2020-08-19 オムロン株式会社 プローブピンおよびこれを用いた検査装置
JP6682416B2 (ja) * 2016-10-12 2020-04-15 株式会社エクセディ 一方向クラッチ
US10656179B2 (en) * 2016-11-30 2020-05-19 Nidec-Read Corporation Contact terminal, inspection jig, and inspection device
HUP1700051A2 (hu) * 2017-02-02 2018-08-28 Equip Test Kft Kontaktáló eszköz, fejegység ahhoz, valamint eljárások kontaktáló eszköz és fejegység elõállítására
JP6980410B2 (ja) * 2017-05-23 2021-12-15 株式会社日本マイクロニクス プローブ
JP7098886B2 (ja) * 2017-07-04 2022-07-12 日本電産リード株式会社 接触端子、検査治具、及び検査装置
EP3888195A4 (en) * 2018-11-30 2022-08-03 Corning Optical Communications RF LLC COMPRESSABLE ELECTRICAL CONTACTS WITH DIVERSE CROSS-SECTIONS
JP7444077B2 (ja) * 2019-01-10 2024-03-06 ニデックアドバンステクノロジー株式会社 接触端子、検査治具、及び検査装置

Also Published As

Publication number Publication date
EP4089721A4 (en) 2024-02-14
KR20220127814A (ko) 2022-09-20
TW202141047A (zh) 2021-11-01
WO2021140904A1 (ja) 2021-07-15
US20230349950A1 (en) 2023-11-02
EP4089721A1 (en) 2022-11-16
CN114930175A (zh) 2022-08-19
TWI776345B (zh) 2022-09-01

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