JPWO2021132174A1 - - Google Patents
Info
- Publication number
- JPWO2021132174A1 JPWO2021132174A1 JP2021567451A JP2021567451A JPWO2021132174A1 JP WO2021132174 A1 JPWO2021132174 A1 JP WO2021132174A1 JP 2021567451 A JP2021567451 A JP 2021567451A JP 2021567451 A JP2021567451 A JP 2021567451A JP WO2021132174 A1 JPWO2021132174 A1 JP WO2021132174A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019231634 | 2019-12-23 | ||
JP2019231634 | 2019-12-23 | ||
PCT/JP2020/047719 WO2021132174A1 (ja) | 2019-12-23 | 2020-12-21 | 電力変換装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021132174A1 true JPWO2021132174A1 (ja) | 2021-07-01 |
JP7301164B2 JP7301164B2 (ja) | 2023-06-30 |
Family
ID=76573254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021567451A Active JP7301164B2 (ja) | 2019-12-23 | 2020-12-21 | 電力変換装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7301164B2 (ja) |
CN (1) | CN114868327A (ja) |
WO (1) | WO2021132174A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001319992A (ja) * | 2000-02-28 | 2001-11-16 | Shinko Electric Ind Co Ltd | 配線基板、半導体装置及びそれらの製造方法 |
JP2002203692A (ja) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Works Ltd | 放電灯点灯装置及び照明器具 |
JP2008061282A (ja) * | 2006-08-29 | 2008-03-13 | Hitachi Ltd | 電力変換装置 |
JP2015207582A (ja) * | 2014-04-17 | 2015-11-19 | 三菱電機株式会社 | 電力半導体装置およびその製造方法 |
WO2017134776A1 (ja) * | 2016-02-03 | 2017-08-10 | 新電元工業株式会社 | 半導体装置及び半導体装置の製造方法 |
WO2019058473A1 (ja) * | 2017-09-21 | 2019-03-28 | 三菱電機株式会社 | 半導体装置およびこれを備えた電力変換装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008147432A (ja) * | 2006-12-11 | 2008-06-26 | Sharp Corp | 電子回路装置及び電力変換装置及び電子回路装置の製造方法 |
JP2015142018A (ja) * | 2014-01-29 | 2015-08-03 | 三菱電機株式会社 | 電力用半導体装置 |
JP6640165B2 (ja) * | 2017-09-29 | 2020-02-05 | 三菱電機株式会社 | 電力変換装置 |
-
2020
- 2020-12-21 CN CN202080087015.XA patent/CN114868327A/zh active Pending
- 2020-12-21 WO PCT/JP2020/047719 patent/WO2021132174A1/ja active Application Filing
- 2020-12-21 JP JP2021567451A patent/JP7301164B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001319992A (ja) * | 2000-02-28 | 2001-11-16 | Shinko Electric Ind Co Ltd | 配線基板、半導体装置及びそれらの製造方法 |
JP2002203692A (ja) * | 2000-12-28 | 2002-07-19 | Matsushita Electric Works Ltd | 放電灯点灯装置及び照明器具 |
JP2008061282A (ja) * | 2006-08-29 | 2008-03-13 | Hitachi Ltd | 電力変換装置 |
JP2015207582A (ja) * | 2014-04-17 | 2015-11-19 | 三菱電機株式会社 | 電力半導体装置およびその製造方法 |
WO2017134776A1 (ja) * | 2016-02-03 | 2017-08-10 | 新電元工業株式会社 | 半導体装置及び半導体装置の製造方法 |
WO2019058473A1 (ja) * | 2017-09-21 | 2019-03-28 | 三菱電機株式会社 | 半導体装置およびこれを備えた電力変換装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2021132174A1 (ja) | 2021-07-01 |
CN114868327A (zh) | 2022-08-05 |
JP7301164B2 (ja) | 2023-06-30 |
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