JPWO2021131693A1 - - Google Patents

Info

Publication number
JPWO2021131693A1
JPWO2021131693A1 JP2021567191A JP2021567191A JPWO2021131693A1 JP WO2021131693 A1 JPWO2021131693 A1 JP WO2021131693A1 JP 2021567191 A JP2021567191 A JP 2021567191A JP 2021567191 A JP2021567191 A JP 2021567191A JP WO2021131693 A1 JPWO2021131693 A1 JP WO2021131693A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021567191A
Other languages
Japanese (ja)
Other versions
JP7001876B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021131693A1 publication Critical patent/JPWO2021131693A1/ja
Application granted granted Critical
Publication of JP7001876B2 publication Critical patent/JP7001876B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C04B35/111—Fine ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2021567191A 2019-12-26 2020-12-09 配線基板 Active JP7001876B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019237389 2019-12-26
JP2019237389 2019-12-26
PCT/JP2020/045787 WO2021131693A1 (fr) 2019-12-26 2020-12-09 Carte de câblage

Publications (2)

Publication Number Publication Date
JPWO2021131693A1 true JPWO2021131693A1 (fr) 2021-07-01
JP7001876B2 JP7001876B2 (ja) 2022-01-20

Family

ID=76575467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567191A Active JP7001876B2 (ja) 2019-12-26 2020-12-09 配線基板

Country Status (4)

Country Link
JP (1) JP7001876B2 (fr)
CN (1) CN114026968B (fr)
TW (1) TWI753709B (fr)
WO (1) WO2021131693A1 (fr)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5392465A (en) * 1977-01-24 1978-08-14 Nippon Electric Co Electronic circuit element board
JPS5478084A (en) * 1977-12-05 1979-06-21 Hitachi Ltd Electrode lead wire
JPS6252962A (ja) * 1985-09-02 1987-03-07 Hitachi Ltd 半導体装置
JP3645744B2 (ja) 1999-05-14 2005-05-11 京セラ株式会社 セラミック配線基板
JP4671500B2 (ja) * 2000-12-26 2011-04-20 京セラ株式会社 配線基板の製造方法
JP2003338578A (ja) * 2002-05-21 2003-11-28 Kyocera Corp 半導体素子搭載用基板
JP4897961B2 (ja) * 2006-12-08 2012-03-14 日本特殊陶業株式会社 電子部品検査用配線基板およびその製造方法
JP4885089B2 (ja) * 2007-08-08 2012-02-29 リバーエレテック株式会社 電子部品パッケージ及びその製造方法
JP5392465B2 (ja) 2008-11-25 2014-01-22 住友電気工業株式会社 マグネシウム合金部材
JP5478084B2 (ja) 2009-01-23 2014-04-23 オリンパス株式会社 画像処理システム、画像処理装置および画像処理端末
JP5967836B2 (ja) * 2012-03-14 2016-08-10 日本特殊陶業株式会社 セラミック基板およびその製造方法
US11024554B2 (en) * 2017-02-21 2021-06-01 Kyocera Corporation Wiring substrate, electronic device, and electronic module
JP6795441B2 (ja) * 2017-03-30 2020-12-02 日本特殊陶業株式会社 セラミック配線基板及びその製造方法
JP6252962B1 (ja) 2017-06-13 2017-12-27 上質空間株式会社 スタンド
JP2019054117A (ja) * 2017-09-15 2019-04-04 日本特殊陶業株式会社 配線基板、及びプレーナトランス

Also Published As

Publication number Publication date
TWI753709B (zh) 2022-01-21
WO2021131693A1 (fr) 2021-07-01
CN114026968B (zh) 2022-08-30
JP7001876B2 (ja) 2022-01-20
CN114026968A (zh) 2022-02-08
TW202133698A (zh) 2021-09-01

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