JPWO2021125014A1 - - Google Patents

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Publication number
JPWO2021125014A1
JPWO2021125014A1 JP2021565517A JP2021565517A JPWO2021125014A1 JP WO2021125014 A1 JPWO2021125014 A1 JP WO2021125014A1 JP 2021565517 A JP2021565517 A JP 2021565517A JP 2021565517 A JP2021565517 A JP 2021565517A JP WO2021125014 A1 JPWO2021125014 A1 JP WO2021125014A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021565517A
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JP7254214B2 (ja
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Publication of JPWO2021125014A1 publication Critical patent/JPWO2021125014A1/ja
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Publication of JP7254214B2 publication Critical patent/JP7254214B2/ja
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Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/18Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/30Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302Sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/88Mounts; Supports; Enclosures; Casings
    • H10N30/883Further insulation means against electrical, physical or chemical damage, e.g. protective coatings
JP2021565517A 2019-12-20 2020-12-09 フォースセンサ Active JP7254214B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019230804 2019-12-20
JP2019230804 2019-12-20
PCT/JP2020/045846 WO2021125014A1 (ja) 2019-12-20 2020-12-09 フォースセンサ

Publications (2)

Publication Number Publication Date
JPWO2021125014A1 true JPWO2021125014A1 (ja) 2021-06-24
JP7254214B2 JP7254214B2 (ja) 2023-04-07

Family

ID=76476594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021565517A Active JP7254214B2 (ja) 2019-12-20 2020-12-09 フォースセンサ

Country Status (5)

Country Link
US (1) US20220307927A1 (ja)
JP (1) JP7254214B2 (ja)
CN (1) CN114930138A (ja)
DE (1) DE112020006261T5 (ja)
WO (1) WO2021125014A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05118935A (ja) * 1991-10-23 1993-05-14 Copal Electron Co Ltd マイクロロードセル
JP2003222559A (ja) * 2002-01-30 2003-08-08 Toyota Central Res & Dev Lab Inc 力検知素子及び圧力検知センサ
JP2006220564A (ja) * 2005-02-10 2006-08-24 Hokuriku Electric Ind Co Ltd 半導体力センサ
JP2007043017A (ja) * 2005-08-05 2007-02-15 Murata Mfg Co Ltd 半導体センサ装置
JP2012088084A (ja) * 2010-10-15 2012-05-10 Olympus Corp 触覚センサユニット
JP2015161531A (ja) * 2014-02-26 2015-09-07 アルプス電気株式会社 荷重検出装置及び前記荷重検出装置を用いた電子機器
US20160273977A1 (en) * 2013-10-30 2016-09-22 Honeywell International Inc. Force sensor with gap-controlled over-force protection
US20170234744A1 (en) * 2016-02-16 2017-08-17 GlobalMEMS Co., Ltd. Mems force sensor and force sensing apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5118935B2 (ja) 2007-10-22 2013-01-16 株式会社ニフコ 収納式アームレスト装置
JPWO2011065250A1 (ja) * 2009-11-25 2013-04-11 アルプス電気株式会社 フォースセンサ
JP4585615B1 (ja) 2010-02-03 2010-11-24 株式会社オーギャ 入力装置
JP5357100B2 (ja) 2010-04-09 2013-12-04 アルプス電気株式会社 フォースセンサパッケージ及びその製造方法
JP5715412B2 (ja) * 2010-12-28 2015-05-07 アルプス電気株式会社 荷重センサの製造方法
CN106461474B (zh) 2014-06-27 2019-04-30 北陆电气工业株式会社 力检测器
CN107097689B (zh) * 2016-02-22 2019-07-12 株式会社藤仓 载荷检测传感器单元
JP6665588B2 (ja) * 2016-03-02 2020-03-13 オムロン株式会社 圧力センサ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05118935A (ja) * 1991-10-23 1993-05-14 Copal Electron Co Ltd マイクロロードセル
JP2003222559A (ja) * 2002-01-30 2003-08-08 Toyota Central Res & Dev Lab Inc 力検知素子及び圧力検知センサ
JP2006220564A (ja) * 2005-02-10 2006-08-24 Hokuriku Electric Ind Co Ltd 半導体力センサ
JP2007043017A (ja) * 2005-08-05 2007-02-15 Murata Mfg Co Ltd 半導体センサ装置
JP2012088084A (ja) * 2010-10-15 2012-05-10 Olympus Corp 触覚センサユニット
US20160273977A1 (en) * 2013-10-30 2016-09-22 Honeywell International Inc. Force sensor with gap-controlled over-force protection
JP2015161531A (ja) * 2014-02-26 2015-09-07 アルプス電気株式会社 荷重検出装置及び前記荷重検出装置を用いた電子機器
US20170234744A1 (en) * 2016-02-16 2017-08-17 GlobalMEMS Co., Ltd. Mems force sensor and force sensing apparatus

Also Published As

Publication number Publication date
US20220307927A1 (en) 2022-09-29
DE112020006261T5 (de) 2022-09-29
JP7254214B2 (ja) 2023-04-07
CN114930138A (zh) 2022-08-19
WO2021125014A1 (ja) 2021-06-24

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