JPWO2021117319A1 - - Google Patents

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Publication number
JPWO2021117319A1
JPWO2021117319A1 JP2021563758A JP2021563758A JPWO2021117319A1 JP WO2021117319 A1 JPWO2021117319 A1 JP WO2021117319A1 JP 2021563758 A JP2021563758 A JP 2021563758A JP 2021563758 A JP2021563758 A JP 2021563758A JP WO2021117319 A1 JPWO2021117319 A1 JP WO2021117319A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021563758A
Other languages
Japanese (ja)
Other versions
JP7546232B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021117319A1 publication Critical patent/JPWO2021117319A1/ja
Application granted granted Critical
Publication of JP7546232B2 publication Critical patent/JP7546232B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021563758A 2019-12-11 2020-09-29 部品撮像装置および部品実装装置 Active JP7546232B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019223373 2019-12-11
JP2019223374 2019-12-11
JP2019223374 2019-12-11
JP2019223373 2019-12-11
PCT/JP2020/036798 WO2021117319A1 (ja) 2019-12-11 2020-09-29 部品撮像装置および部品実装装置

Publications (2)

Publication Number Publication Date
JPWO2021117319A1 true JPWO2021117319A1 (zh) 2021-06-17
JP7546232B2 JP7546232B2 (ja) 2024-09-06

Family

ID=76329368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021563758A Active JP7546232B2 (ja) 2019-12-11 2020-09-29 部品撮像装置および部品実装装置

Country Status (3)

Country Link
JP (1) JP7546232B2 (zh)
CN (1) CN114747308A (zh)
WO (1) WO2021117319A1 (zh)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07162200A (ja) * 1993-12-04 1995-06-23 Tdk Corp 電子部品の装着方法及び装置
JP3129134B2 (ja) * 1995-02-23 2001-01-29 松下電器産業株式会社 チップの実装方法
JP4322092B2 (ja) * 2002-11-13 2009-08-26 富士機械製造株式会社 電子部品実装装置における校正方法および装置
JP4901451B2 (ja) * 2006-12-19 2012-03-21 Ｊｕｋｉ株式会社 部品実装装置
JP4903627B2 (ja) * 2007-04-24 2012-03-28 Ｊｕｋｉ株式会社 表面実装機、及び、そのカメラ位置補正方法
JP5471131B2 (ja) * 2009-07-31 2014-04-16 日本電気株式会社 電子部品実装装置および電子部品実装装置におけるカメラ位置補正方法
EP2838333B1 (en) * 2012-04-12 2019-08-21 FUJI Corporation Component mounting machine
WO2013153645A1 (ja) * 2012-04-12 2013-10-17 富士機械製造株式会社 撮像装置及び画像処理装置
JP6138127B2 (ja) * 2012-08-01 2017-05-31 富士機械製造株式会社 部品実装機
EP2978296B1 (en) * 2013-03-18 2019-08-21 FUJI Corporation Component mounting device and method of calibration in component mounting device
WO2015040696A1 (ja) * 2013-09-18 2015-03-26 富士機械製造株式会社 部品実装機
WO2015049721A1 (ja) * 2013-10-01 2015-04-09 富士機械製造株式会社 部品装着装置及び部品装着方法

Also Published As

Publication number Publication date
WO2021117319A1 (ja) 2021-06-17
CN114747308A (zh) 2022-07-12
JP7546232B2 (ja) 2024-09-06

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