JPWO2021111791A1 - - Google Patents

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Publication number
JPWO2021111791A1
JPWO2021111791A1 JP2021562512A JP2021562512A JPWO2021111791A1 JP WO2021111791 A1 JPWO2021111791 A1 JP WO2021111791A1 JP 2021562512 A JP2021562512 A JP 2021562512A JP 2021562512 A JP2021562512 A JP 2021562512A JP WO2021111791 A1 JPWO2021111791 A1 JP WO2021111791A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021562512A
Other versions
JP7154442B2 (ja
JPWO2021111791A5 (ja
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Publication date
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Publication of JPWO2021111791A1 publication Critical patent/JPWO2021111791A1/ja
Publication of JPWO2021111791A5 publication Critical patent/JPWO2021111791A5/ja
Application granted granted Critical
Publication of JP7154442B2 publication Critical patent/JP7154442B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
    • F28D1/0472—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being helically or spirally coiled
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D7/02—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being helically coiled
    • F28D7/024—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being helically coiled the conduits of only one medium being helically coiled tubes, the coils having a cylindrical configuration
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021562512A 2019-12-06 2020-11-04 ヒートシンク及びヒートシンクの製造方法 Active JP7154442B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019221661 2019-12-06
JP2019221661 2019-12-06
PCT/JP2020/041164 WO2021111791A1 (ja) 2019-12-06 2020-11-04 ヒートシンク及びヒートシンクの製造方法

Publications (3)

Publication Number Publication Date
JPWO2021111791A1 true JPWO2021111791A1 (ja) 2021-06-10
JPWO2021111791A5 JPWO2021111791A5 (ja) 2022-03-22
JP7154442B2 JP7154442B2 (ja) 2022-10-17

Family

ID=76222286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021562512A Active JP7154442B2 (ja) 2019-12-06 2020-11-04 ヒートシンク及びヒートシンクの製造方法

Country Status (5)

Country Link
US (1) US20220346270A1 (ja)
JP (1) JP7154442B2 (ja)
CN (1) CN114747002A (ja)
DE (1) DE112020005982T5 (ja)
WO (1) WO2021111791A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117542811B (zh) * 2024-01-10 2024-03-26 广东海洋大学 一种基于微纳结构的新型芯片冷却平台

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5340826A (en) * 1976-09-24 1978-04-13 Siemens Ag Coolant for thyristor
JP2001133174A (ja) * 1999-11-02 2001-05-18 Toyota Motor Corp 冷却体
JP2017069518A (ja) * 2015-10-02 2017-04-06 株式会社豊田自動織機 冷却器
EP3499562A1 (en) * 2017-12-12 2019-06-19 Rolls-Royce plc Thermal management device
JP2019201101A (ja) * 2018-05-16 2019-11-21 本田技研工業株式会社 冷却器

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US324120A (en) * 1885-08-11 Dlesex
US311839A (en) * 1885-02-03 kiekaldt
US1544929A (en) * 1922-12-01 1925-07-07 Doehler Die Casting Co Method of casting
CA1063097A (en) * 1976-01-26 1979-09-25 David F. Fijas Inner finned heat exchanger tube
US4209061A (en) * 1977-06-02 1980-06-24 Energy Dynamics, Inc. Heat exchanger
WO1984000207A1 (en) * 1982-06-29 1984-01-19 Zander & Ingestroem Tube heat exchanger
DE3320632A1 (de) * 1983-06-08 1984-12-13 Hoechst Ag, 6230 Frankfurt Waermeaustauscher
US5165472A (en) * 1991-03-18 1992-11-24 Louis Cloutier Heat exchanger with fluid injectors
JPH06275746A (ja) * 1993-03-18 1994-09-30 Hitachi Ltd 半導体装置
US5746269A (en) * 1996-02-08 1998-05-05 Advanced Mobile Telecommunication Technology Inc. Regenerative heat exchanger
JPH1046314A (ja) * 1996-08-06 1998-02-17 Kubota Corp 外面耐食管の製造方法
JP3556578B2 (ja) * 2000-06-29 2004-08-18 株式会社東芝 携帯形電子機器およびこの電子機器に用いる冷却装置
US6615911B1 (en) * 2002-03-07 2003-09-09 Delphi Technologies, Inc. High performance liquid-cooled heat sink with twisted tape inserts for electronics cooling
DE102006008033A1 (de) * 2006-02-21 2007-09-06 Siemens Ag Österreich Kühlkörper mit von Kühlmittel durchströmtem Rohr
CN103298320A (zh) * 2007-12-19 2013-09-11 集群系统公司 用于接触冷却电子模块的冷却系统
JP4985456B2 (ja) * 2008-02-20 2012-07-25 パナソニック株式会社 熱交換器
JP5079586B2 (ja) * 2008-04-25 2012-11-21 古河スカイ株式会社 独立した流路を有する金属多孔体
CN103547879B (zh) * 2011-03-07 2016-03-16 阿威德热合金有限公司 具有螺旋流体路径的热传递装置
KR101354814B1 (ko) * 2011-12-14 2014-01-27 삼성전기주식회사 반도체 패키지
JP2017523022A (ja) * 2014-08-07 2017-08-17 インサイト イノベーションズ， エルエルシー マイクロパターン化眼内インプラント
US11112183B2 (en) * 2016-01-14 2021-09-07 Hamilton Sundstrand Corporation Heat exchanger channels
US20180283795A1 (en) * 2017-03-28 2018-10-04 General Electric Company Tubular Array Heat Exchanger
US11747094B2 (en) * 2017-05-12 2023-09-05 The Boeing Company Hollow lattice thermal energy storage heat exchanger
JP7195542B2 (ja) * 2019-04-05 2022-12-26 富士電機株式会社 冷却器、半導体モジュール
WO2023079608A1 (ja) * 2021-11-04 2023-05-11 三菱電機株式会社 ヒートシンクおよびヒートシンクの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5340826A (en) * 1976-09-24 1978-04-13 Siemens Ag Coolant for thyristor
JP2001133174A (ja) * 1999-11-02 2001-05-18 Toyota Motor Corp 冷却体
JP2017069518A (ja) * 2015-10-02 2017-04-06 株式会社豊田自動織機 冷却器
EP3499562A1 (en) * 2017-12-12 2019-06-19 Rolls-Royce plc Thermal management device
JP2019201101A (ja) * 2018-05-16 2019-11-21 本田技研工業株式会社 冷却器

Also Published As

Publication number Publication date
DE112020005982T5 (de) 2022-09-15
US20220346270A1 (en) 2022-10-27
JP7154442B2 (ja) 2022-10-17
WO2021111791A1 (ja) 2021-06-10
CN114747002A (zh) 2022-07-12

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