JPWO2021107116A1 - - Google Patents

Info

Publication number
JPWO2021107116A1
JPWO2021107116A1 JP2021561562A JP2021561562A JPWO2021107116A1 JP WO2021107116 A1 JPWO2021107116 A1 JP WO2021107116A1 JP 2021561562 A JP2021561562 A JP 2021561562A JP 2021561562 A JP2021561562 A JP 2021561562A JP WO2021107116 A1 JPWO2021107116 A1 JP WO2021107116A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021561562A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021107116A1 publication Critical patent/JPWO2021107116A1/ja
Priority to JP2024103288A priority Critical patent/JP2024123240A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2021561562A 2019-11-29 2020-11-27 Pending JPWO2021107116A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024103288A JP2024123240A (ja) 2019-11-29 2024-06-26 印刷配線板および印刷配線板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019216629 2019-11-29
PCT/JP2020/044278 WO2021107116A1 (ja) 2019-11-29 2020-11-27 印刷配線板および印刷配線板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024103288A Division JP2024123240A (ja) 2019-11-29 2024-06-26 印刷配線板および印刷配線板の製造方法

Publications (1)

Publication Number Publication Date
JPWO2021107116A1 true JPWO2021107116A1 (ja) 2021-06-03

Family

ID=76130599

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021561562A Pending JPWO2021107116A1 (ja) 2019-11-29 2020-11-27
JP2024103288A Pending JP2024123240A (ja) 2019-11-29 2024-06-26 印刷配線板および印刷配線板の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024103288A Pending JP2024123240A (ja) 2019-11-29 2024-06-26 印刷配線板および印刷配線板の製造方法

Country Status (3)

Country Link
JP (2) JPWO2021107116A1 (ja)
TW (1) TWI788737B (ja)
WO (1) WO2021107116A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI850034B (zh) * 2023-07-21 2024-07-21 大陸商宏啟勝精密電子（秦皇島）有限公司 耐彎折線路板結構及其製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158887A (ja) * 2003-11-21 2005-06-16 Dept Corp 回路基板及びその製造方法
WO2010050627A1 (ja) * 2008-10-31 2010-05-06 太陽誘電株式会社 プリント配線板およびその製造方法
JP2012060056A (ja) * 2010-09-13 2012-03-22 Nec Corp 電子装置及び電子モジュール
WO2014125852A1 (ja) * 2013-02-14 2014-08-21 株式会社村田製作所 回路基板およびその製造方法
JP2014197596A (ja) * 2013-03-29 2014-10-16 京セラサーキットソリューションズ株式会社 多層配線基板及びその製造方法
JP2018200952A (ja) * 2017-05-26 2018-12-20 富士通株式会社 電子部品、電子部品の製造方法及び電子装置
JP2019046860A (ja) * 2017-08-30 2019-03-22 京セラ株式会社 印刷配線板およびその製造方法
JP2019121766A (ja) * 2018-01-11 2019-07-22 イビデン株式会社 プリント配線板およびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6778709B2 (ja) * 2018-03-29 2020-11-04 京セラ株式会社 印刷配線板の製造方法
TWM570577U (zh) * 2018-08-02 2018-11-21 興普科技股份有限公司 Cavity printed circuit board rubber structure

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158887A (ja) * 2003-11-21 2005-06-16 Dept Corp 回路基板及びその製造方法
WO2010050627A1 (ja) * 2008-10-31 2010-05-06 太陽誘電株式会社 プリント配線板およびその製造方法
JP2012060056A (ja) * 2010-09-13 2012-03-22 Nec Corp 電子装置及び電子モジュール
WO2014125852A1 (ja) * 2013-02-14 2014-08-21 株式会社村田製作所 回路基板およびその製造方法
JP2014197596A (ja) * 2013-03-29 2014-10-16 京セラサーキットソリューションズ株式会社 多層配線基板及びその製造方法
JP2018200952A (ja) * 2017-05-26 2018-12-20 富士通株式会社 電子部品、電子部品の製造方法及び電子装置
JP2019046860A (ja) * 2017-08-30 2019-03-22 京セラ株式会社 印刷配線板およびその製造方法
JP2019121766A (ja) * 2018-01-11 2019-07-22 イビデン株式会社 プリント配線板およびその製造方法

Also Published As

Publication number Publication date
WO2021107116A1 (ja) 2021-06-03
TW202130242A (zh) 2021-08-01
TWI788737B (zh) 2023-01-01
JP2024123240A (ja) 2024-09-10

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