JPWO2021106809A1 - - Google Patents

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Publication number
JPWO2021106809A1
JPWO2021106809A1 JP2021561391A JP2021561391A JPWO2021106809A1 JP WO2021106809 A1 JPWO2021106809 A1 JP WO2021106809A1 JP 2021561391 A JP2021561391 A JP 2021561391A JP 2021561391 A JP2021561391 A JP 2021561391A JP WO2021106809 A1 JPWO2021106809 A1 JP WO2021106809A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021561391A
Other languages
Japanese (ja)
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JP7733284B2 (ja
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Publication of JPWO2021106809A1 publication Critical patent/JPWO2021106809A1/ja
Application granted granted Critical
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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/875Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being semiconductor metal oxide, e.g. InGaZnO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326Deposition processes
    • H10P14/6342Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/692Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6938Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
    • H10P14/6939Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
JP2021561391A 2019-11-29 2020-11-20 半導体装置および半導体装置を有する半導体システム Active JP7733284B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019217101 2019-11-29
JP2019217100 2019-11-29
JP2019217100 2019-11-29
JP2019217101 2019-11-29
PCT/JP2020/043517 WO2021106809A1 (ja) 2019-11-29 2020-11-20 半導体装置および半導体装置を有する半導体システム

Publications (2)

Publication Number Publication Date
JPWO2021106809A1 true JPWO2021106809A1 (https=) 2021-06-03
JP7733284B2 JP7733284B2 (ja) 2025-09-03

Family

ID=76130218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561391A Active JP7733284B2 (ja) 2019-11-29 2020-11-20 半導体装置および半導体装置を有する半導体システム

Country Status (5)

Country Link
US (1) US20220293740A1 (https=)
JP (1) JP7733284B2 (https=)
CN (1) CN114747021B (https=)
TW (1) TW202135315A (https=)
WO (1) WO2021106809A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021157719A1 (ja) * 2020-02-07 2021-08-12 株式会社Flosfia 半導体素子および半導体装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008226907A (ja) * 2007-03-08 2008-09-25 Ritsumeikan 窒化物半導体積層構造およびその形成方法、ならびに窒化物半導体素子およびその製造方法
JP2012104568A (ja) * 2010-11-08 2012-05-31 Sumitomo Electric Ind Ltd 半導体装置およびその製造方法
WO2013035843A1 (ja) * 2011-09-08 2013-03-14 株式会社タムラ製作所 Ga2O3系半導体素子
JP2013058637A (ja) * 2011-09-08 2013-03-28 Tamura Seisakusho Co Ltd Ga2O3系半導体素子
JP2016051796A (ja) * 2014-08-29 2016-04-11 株式会社タムラ製作所 半導体素子及びその製造方法
JP2017128492A (ja) * 2016-01-15 2017-07-27 株式会社Flosfia 結晶性酸化物膜
JP2018186246A (ja) * 2017-04-27 2018-11-22 国立研究開発法人情報通信研究機構 Ga2O3系半導体素子
JP2019048766A (ja) * 2018-10-11 2019-03-28 国立研究開発法人物質・材料研究機構 α−Ga2O3単結晶、α−Ga2O3の製造方法、および、それを用いた半導体素子

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040077813A (ko) * 2002-02-19 2004-09-06 호야 가부시키가이샤 전계효과트랜지스터형 발광소자
JP5105044B2 (ja) * 2006-05-09 2012-12-19 株式会社ブリヂストン 酸化物トランジスタ及びその製造方法
US20100295042A1 (en) * 2008-01-23 2010-11-25 Idemitsu Kosan Co., Ltd. Field-effect transistor, method for manufacturing field-effect transistor, display device using field-effect transistor, and semiconductor device
KR101932576B1 (ko) * 2010-09-13 2018-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
CN103022149B (zh) * 2012-12-14 2015-06-10 京东方科技集团股份有限公司 薄膜晶体管、阵列基板及制造方法和显示器件
JP5536920B1 (ja) * 2013-03-04 2014-07-02 株式会社タムラ製作所 Ga2O3系単結晶基板、及びその製造方法
KR102089314B1 (ko) * 2013-05-14 2020-04-14 엘지디스플레이 주식회사 산화물 박막 트랜지스터 및 그 제조방법
JP6284140B2 (ja) * 2013-06-17 2018-02-28 株式会社タムラ製作所 Ga2O3系半導体素子
EP2942804B1 (en) * 2014-05-08 2017-07-12 Flosfia Inc. Crystalline multilayer structure and semiconductor device
JP2019102652A (ja) * 2017-12-04 2019-06-24 三菱電機株式会社 薄膜トランジスタ基板および薄膜トランジスタ基板の製造方法
WO2020204006A1 (ja) * 2019-03-29 2020-10-08 株式会社Flosfia 結晶、結晶性酸化物半導体、結晶性酸化物半導体を含む半導体膜、結晶および/または半導体膜を含む半導体装置および半導体装置を含むシステム
US11380763B2 (en) * 2019-04-29 2022-07-05 Arizona Board Of Regents On Behalf Of Arizona State University Contact structures for n-type diamond
JPWO2021106811A1 (https=) * 2019-11-29 2021-06-03
WO2021106810A1 (ja) * 2019-11-29 2021-06-03 株式会社Flosfia 半導体装置および半導体システム

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008226907A (ja) * 2007-03-08 2008-09-25 Ritsumeikan 窒化物半導体積層構造およびその形成方法、ならびに窒化物半導体素子およびその製造方法
JP2012104568A (ja) * 2010-11-08 2012-05-31 Sumitomo Electric Ind Ltd 半導体装置およびその製造方法
WO2013035843A1 (ja) * 2011-09-08 2013-03-14 株式会社タムラ製作所 Ga2O3系半導体素子
JP2013058637A (ja) * 2011-09-08 2013-03-28 Tamura Seisakusho Co Ltd Ga2O3系半導体素子
JP2016051796A (ja) * 2014-08-29 2016-04-11 株式会社タムラ製作所 半導体素子及びその製造方法
JP2017128492A (ja) * 2016-01-15 2017-07-27 株式会社Flosfia 結晶性酸化物膜
JP2018186246A (ja) * 2017-04-27 2018-11-22 国立研究開発法人情報通信研究機構 Ga2O3系半導体素子
JP2019048766A (ja) * 2018-10-11 2019-03-28 国立研究開発法人物質・材料研究機構 α−Ga2O3単結晶、α−Ga2O3の製造方法、および、それを用いた半導体素子

Also Published As

Publication number Publication date
TW202135315A (zh) 2021-09-16
WO2021106809A1 (ja) 2021-06-03
CN114747021B (zh) 2026-03-17
CN114747021A (zh) 2022-07-12
JP7733284B2 (ja) 2025-09-03
US20220293740A1 (en) 2022-09-15

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