JPWO2021106811A1 - - Google Patents

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Publication number
JPWO2021106811A1
JPWO2021106811A1 JP2021561393A JP2021561393A JPWO2021106811A1 JP WO2021106811 A1 JPWO2021106811 A1 JP WO2021106811A1 JP 2021561393 A JP2021561393 A JP 2021561393A JP 2021561393 A JP2021561393 A JP 2021561393A JP WO2021106811 A1 JPWO2021106811 A1 JP WO2021106811A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021561393A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021106811A1 publication Critical patent/JPWO2021106811A1/ja
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/721Insulated-gate field-effect transistors [IGFET] having a gate-to-body connection, i.e. bulk dynamic threshold voltage IGFET 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/16Oxides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/63Vertical IGFETs
    • H10D30/635Vertical IGFETs having no inversion channels, e.g. vertical accumulation channel FETs [ACCUFET] or normally-on vertical IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/637Lateral IGFETs having no inversion channels, e.g. buried channel lateral IGFETs, normally-on lateral IGFETs or depletion-mode lateral IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/875Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being semiconductor metal oxide, e.g. InGaZnO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/605Source, drain, or gate electrodes for FETs comprising highly resistive materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/26Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
    • H10P14/265Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using solutions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3434Deposited materials, e.g. layers characterised by the chemical composition being oxide semiconductor materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3438Doping during depositing
    • H10P14/3441Conductivity type
    • H10P14/3444P-type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3438Doping during depositing
    • H10P14/3441Conductivity type
    • H10P14/3446Transition metal elements; Rare earth elements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thin Film Transistor (AREA)
JP2021561393A 2019-11-29 2020-11-20 Pending JPWO2021106811A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019217103 2019-11-29
PCT/JP2020/043519 WO2021106811A1 (ja) 2019-11-29 2020-11-20 半導体装置および半導体システム

Publications (1)

Publication Number Publication Date
JPWO2021106811A1 true JPWO2021106811A1 (https=) 2021-06-03

Family

ID=76130110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561393A Pending JPWO2021106811A1 (https=) 2019-11-29 2020-11-20

Country Status (5)

Country Link
US (1) US12284822B2 (https=)
JP (1) JPWO2021106811A1 (https=)
CN (1) CN114747020A (https=)
TW (1) TW202135317A (https=)
WO (1) WO2021106811A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021106810A1 (ja) * 2019-11-29 2021-06-03 株式会社Flosfia 半導体装置および半導体システム
JP7733284B2 (ja) * 2019-11-29 2025-09-03 株式会社Flosfia 半導体装置および半導体装置を有する半導体システム
JP2023044117A (ja) * 2021-09-17 2023-03-30 キオクシア株式会社 半導体装置、半導体記憶装置、及び半導体装置の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104568A (ja) * 2010-11-08 2012-05-31 Sumitomo Electric Ind Ltd 半導体装置およびその製造方法
WO2013035843A1 (ja) * 2011-09-08 2013-03-14 株式会社タムラ製作所 Ga2O3系半導体素子
JP2013058637A (ja) * 2011-09-08 2013-03-28 Tamura Seisakusho Co Ltd Ga2O3系半導体素子
JP2016051796A (ja) * 2014-08-29 2016-04-11 株式会社タムラ製作所 半導体素子及びその製造方法
JP2017128492A (ja) * 2016-01-15 2017-07-27 株式会社Flosfia 結晶性酸化物膜
JP2018186246A (ja) * 2017-04-27 2018-11-22 国立研究開発法人情報通信研究機構 Ga2O3系半導体素子
JP2019048766A (ja) * 2018-10-11 2019-03-28 国立研究開発法人物質・材料研究機構 α−Ga2O3単結晶、α−Ga2O3の製造方法、および、それを用いた半導体素子

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
JP3586939B2 (ja) 1994-12-22 2004-11-10 株式会社デンソー El素子およびその製造方法
FR2733228B1 (fr) 1995-04-20 1997-05-23 Rhone Poulenc Chimie Procede d'hydroxycarbonylation du butadiene
JP3912557B2 (ja) 1997-07-07 2007-05-09 株式会社ジーエス・ユアサコーポレーション 固体高分子型水電解セル
JP4831940B2 (ja) 2004-05-24 2011-12-07 株式会社光波 半導体素子の製造方法
JP2010165922A (ja) * 2009-01-16 2010-07-29 Idemitsu Kosan Co Ltd 電界効果型トランジスタ、電界効果型トランジスタの製造方法及び半導体素子の製造方法
US20140027762A1 (en) * 2012-07-27 2014-01-30 Semiconductor Energy Laboratory Co. Ltd. Semiconductor device
JP5581416B2 (ja) * 2013-04-03 2014-08-27 出光興産株式会社 結晶酸化物半導体、及びそれを用いてなる薄膜トランジスタ
US9379190B2 (en) * 2014-05-08 2016-06-28 Flosfia, Inc. Crystalline multilayer structure and semiconductor device
JP6349592B2 (ja) 2014-07-22 2018-07-04 株式会社Flosfia 半導体装置
WO2017017966A1 (ja) * 2015-07-30 2017-02-02 出光興産株式会社 結晶質酸化物半導体薄膜、結晶質酸化物半導体薄膜の製造方法及び薄膜トランジスタ
CN109643660B (zh) * 2016-08-31 2024-03-05 株式会社Flosfia p-型氧化物半导体及其制造方法
JP7187322B2 (ja) * 2017-02-01 2022-12-12 出光興産株式会社 結晶質酸化物半導体薄膜、積層体の製造方法、薄膜トランジスタ、薄膜トランジスタの製造方法、電子機器、車載用表示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012104568A (ja) * 2010-11-08 2012-05-31 Sumitomo Electric Ind Ltd 半導体装置およびその製造方法
WO2013035843A1 (ja) * 2011-09-08 2013-03-14 株式会社タムラ製作所 Ga2O3系半導体素子
JP2013058637A (ja) * 2011-09-08 2013-03-28 Tamura Seisakusho Co Ltd Ga2O3系半導体素子
JP2016051796A (ja) * 2014-08-29 2016-04-11 株式会社タムラ製作所 半導体素子及びその製造方法
JP2017128492A (ja) * 2016-01-15 2017-07-27 株式会社Flosfia 結晶性酸化物膜
JP2018186246A (ja) * 2017-04-27 2018-11-22 国立研究開発法人情報通信研究機構 Ga2O3系半導体素子
JP2019048766A (ja) * 2018-10-11 2019-03-28 国立研究開発法人物質・材料研究機構 α−Ga2O3単結晶、α−Ga2O3の製造方法、および、それを用いた半導体素子

Also Published As

Publication number Publication date
US12284822B2 (en) 2025-04-22
WO2021106811A1 (ja) 2021-06-03
CN114747020A (zh) 2022-07-12
TW202135317A (zh) 2021-09-16
US20220285543A1 (en) 2022-09-08

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