JPWO2021106811A1 - - Google Patents
Info
- Publication number
- JPWO2021106811A1 JPWO2021106811A1 JP2021561393A JP2021561393A JPWO2021106811A1 JP WO2021106811 A1 JPWO2021106811 A1 JP WO2021106811A1 JP 2021561393 A JP2021561393 A JP 2021561393A JP 2021561393 A JP2021561393 A JP 2021561393A JP WO2021106811 A1 JPWO2021106811 A1 JP WO2021106811A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/721—Insulated-gate field-effect transistors [IGFET] having a gate-to-body connection, i.e. bulk dynamic threshold voltage IGFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/63—Vertical IGFETs
- H10D30/635—Vertical IGFETs having no inversion channels, e.g. vertical accumulation channel FETs [ACCUFET] or normally-on vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/637—Lateral IGFETs having no inversion channels, e.g. buried channel lateral IGFETs, normally-on lateral IGFETs or depletion-mode lateral IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/875—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being semiconductor metal oxide, e.g. InGaZnO
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/605—Source, drain, or gate electrodes for FETs comprising highly resistive materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/26—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
- H10P14/265—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using solutions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3434—Deposited materials, e.g. layers characterised by the chemical composition being oxide semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3444—P-type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3446—Transition metal elements; Rare earth elements
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019217103 | 2019-11-29 | ||
| PCT/JP2020/043519 WO2021106811A1 (ja) | 2019-11-29 | 2020-11-20 | 半導体装置および半導体システム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021106811A1 true JPWO2021106811A1 (https=) | 2021-06-03 |
Family
ID=76130110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021561393A Pending JPWO2021106811A1 (https=) | 2019-11-29 | 2020-11-20 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12284822B2 (https=) |
| JP (1) | JPWO2021106811A1 (https=) |
| CN (1) | CN114747020A (https=) |
| TW (1) | TW202135317A (https=) |
| WO (1) | WO2021106811A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021106810A1 (ja) * | 2019-11-29 | 2021-06-03 | 株式会社Flosfia | 半導体装置および半導体システム |
| JP7733284B2 (ja) * | 2019-11-29 | 2025-09-03 | 株式会社Flosfia | 半導体装置および半導体装置を有する半導体システム |
| JP2023044117A (ja) * | 2021-09-17 | 2023-03-30 | キオクシア株式会社 | 半導体装置、半導体記憶装置、及び半導体装置の製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012104568A (ja) * | 2010-11-08 | 2012-05-31 | Sumitomo Electric Ind Ltd | 半導体装置およびその製造方法 |
| WO2013035843A1 (ja) * | 2011-09-08 | 2013-03-14 | 株式会社タムラ製作所 | Ga2O3系半導体素子 |
| JP2013058637A (ja) * | 2011-09-08 | 2013-03-28 | Tamura Seisakusho Co Ltd | Ga2O3系半導体素子 |
| JP2016051796A (ja) * | 2014-08-29 | 2016-04-11 | 株式会社タムラ製作所 | 半導体素子及びその製造方法 |
| JP2017128492A (ja) * | 2016-01-15 | 2017-07-27 | 株式会社Flosfia | 結晶性酸化物膜 |
| JP2018186246A (ja) * | 2017-04-27 | 2018-11-22 | 国立研究開発法人情報通信研究機構 | Ga2O3系半導体素子 |
| JP2019048766A (ja) * | 2018-10-11 | 2019-03-28 | 国立研究開発法人物質・材料研究機構 | α−Ga2O3単結晶、α−Ga2O3の製造方法、および、それを用いた半導体素子 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3586939B2 (ja) | 1994-12-22 | 2004-11-10 | 株式会社デンソー | El素子およびその製造方法 |
| FR2733228B1 (fr) | 1995-04-20 | 1997-05-23 | Rhone Poulenc Chimie | Procede d'hydroxycarbonylation du butadiene |
| JP3912557B2 (ja) | 1997-07-07 | 2007-05-09 | 株式会社ジーエス・ユアサコーポレーション | 固体高分子型水電解セル |
| JP4831940B2 (ja) | 2004-05-24 | 2011-12-07 | 株式会社光波 | 半導体素子の製造方法 |
| JP2010165922A (ja) * | 2009-01-16 | 2010-07-29 | Idemitsu Kosan Co Ltd | 電界効果型トランジスタ、電界効果型トランジスタの製造方法及び半導体素子の製造方法 |
| US20140027762A1 (en) * | 2012-07-27 | 2014-01-30 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device |
| JP5581416B2 (ja) * | 2013-04-03 | 2014-08-27 | 出光興産株式会社 | 結晶酸化物半導体、及びそれを用いてなる薄膜トランジスタ |
| US9379190B2 (en) * | 2014-05-08 | 2016-06-28 | Flosfia, Inc. | Crystalline multilayer structure and semiconductor device |
| JP6349592B2 (ja) | 2014-07-22 | 2018-07-04 | 株式会社Flosfia | 半導体装置 |
| WO2017017966A1 (ja) * | 2015-07-30 | 2017-02-02 | 出光興産株式会社 | 結晶質酸化物半導体薄膜、結晶質酸化物半導体薄膜の製造方法及び薄膜トランジスタ |
| CN109643660B (zh) * | 2016-08-31 | 2024-03-05 | 株式会社Flosfia | p-型氧化物半导体及其制造方法 |
| JP7187322B2 (ja) * | 2017-02-01 | 2022-12-12 | 出光興産株式会社 | 結晶質酸化物半導体薄膜、積層体の製造方法、薄膜トランジスタ、薄膜トランジスタの製造方法、電子機器、車載用表示装置 |
-
2020
- 2020-11-20 JP JP2021561393A patent/JPWO2021106811A1/ja active Pending
- 2020-11-20 WO PCT/JP2020/043519 patent/WO2021106811A1/ja not_active Ceased
- 2020-11-20 CN CN202080082446.7A patent/CN114747020A/zh active Pending
- 2020-11-24 TW TW109141115A patent/TW202135317A/zh unknown
-
2022
- 2022-05-27 US US17/826,724 patent/US12284822B2/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012104568A (ja) * | 2010-11-08 | 2012-05-31 | Sumitomo Electric Ind Ltd | 半導体装置およびその製造方法 |
| WO2013035843A1 (ja) * | 2011-09-08 | 2013-03-14 | 株式会社タムラ製作所 | Ga2O3系半導体素子 |
| JP2013058637A (ja) * | 2011-09-08 | 2013-03-28 | Tamura Seisakusho Co Ltd | Ga2O3系半導体素子 |
| JP2016051796A (ja) * | 2014-08-29 | 2016-04-11 | 株式会社タムラ製作所 | 半導体素子及びその製造方法 |
| JP2017128492A (ja) * | 2016-01-15 | 2017-07-27 | 株式会社Flosfia | 結晶性酸化物膜 |
| JP2018186246A (ja) * | 2017-04-27 | 2018-11-22 | 国立研究開発法人情報通信研究機構 | Ga2O3系半導体素子 |
| JP2019048766A (ja) * | 2018-10-11 | 2019-03-28 | 国立研究開発法人物質・材料研究機構 | α−Ga2O3単結晶、α−Ga2O3の製造方法、および、それを用いた半導体素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| US12284822B2 (en) | 2025-04-22 |
| WO2021106811A1 (ja) | 2021-06-03 |
| CN114747020A (zh) | 2022-07-12 |
| TW202135317A (zh) | 2021-09-16 |
| US20220285543A1 (en) | 2022-09-08 |
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