JPWO2021095474A1 - - Google Patents
Info
- Publication number
- JPWO2021095474A1 JPWO2021095474A1 JP2021555973A JP2021555973A JPWO2021095474A1 JP WO2021095474 A1 JPWO2021095474 A1 JP WO2021095474A1 JP 2021555973 A JP2021555973 A JP 2021555973A JP 2021555973 A JP2021555973 A JP 2021555973A JP WO2021095474 A1 JPWO2021095474 A1 JP WO2021095474A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/011—Manufacture or treatment of electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/50—PIN diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019206571 | 2019-11-14 | ||
| PCT/JP2020/039625 WO2021095474A1 (ja) | 2019-11-14 | 2020-10-21 | 結晶性酸化物のエッチング方法およびトレンチ形成方法ならびに半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021095474A1 true JPWO2021095474A1 (https=) | 2021-05-20 |
Family
ID=75911350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021555973A Pending JPWO2021095474A1 (https=) | 2019-11-14 | 2020-10-21 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2021095474A1 (https=) |
| WO (1) | WO2021095474A1 (https=) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000103689A (ja) * | 1998-09-28 | 2000-04-11 | Kyocera Corp | アルミナ質焼結体およびその製造方法、並びに耐プラズマ部材 |
| JP2007335505A (ja) * | 2006-06-13 | 2007-12-27 | Canon Inc | 酸化物半導体膜のドライエッチング方法 |
| JP2013077817A (ja) * | 2011-09-16 | 2013-04-25 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP2013179127A (ja) * | 2012-02-28 | 2013-09-09 | National Institute Of Advanced Industrial & Technology | 電子デバイスの製造方法及び薄膜トランジスタ |
| JP2015227279A (ja) * | 2014-05-08 | 2015-12-17 | 株式会社Flosfia | 結晶性積層構造体および半導体装置 |
| JP2016208024A (ja) * | 2015-04-15 | 2016-12-08 | 株式会社半導体エネルギー研究所 | 電極及び半導体装置の作製方法 |
| JP2017224794A (ja) * | 2016-06-17 | 2017-12-21 | ラピスセミコンダクタ株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2018093207A (ja) * | 2014-07-22 | 2018-06-14 | 株式会社Flosfia | 結晶性半導体膜および板状体ならびに半導体装置 |
| JP2018142655A (ja) * | 2017-02-28 | 2018-09-13 | 株式会社タムラ製作所 | ショットキーバリアダイオード |
| JP2018170306A (ja) * | 2017-03-29 | 2018-11-01 | Tdk株式会社 | 酸化ガリウム半導体装置の製造方法 |
| JP2019048766A (ja) * | 2018-10-11 | 2019-03-28 | 国立研究開発法人物質・材料研究機構 | α−Ga2O3単結晶、α−Ga2O3の製造方法、および、それを用いた半導体素子 |
-
2020
- 2020-10-21 JP JP2021555973A patent/JPWO2021095474A1/ja active Pending
- 2020-10-21 WO PCT/JP2020/039625 patent/WO2021095474A1/ja not_active Ceased
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000103689A (ja) * | 1998-09-28 | 2000-04-11 | Kyocera Corp | アルミナ質焼結体およびその製造方法、並びに耐プラズマ部材 |
| JP2007335505A (ja) * | 2006-06-13 | 2007-12-27 | Canon Inc | 酸化物半導体膜のドライエッチング方法 |
| JP2013077817A (ja) * | 2011-09-16 | 2013-04-25 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP2013179127A (ja) * | 2012-02-28 | 2013-09-09 | National Institute Of Advanced Industrial & Technology | 電子デバイスの製造方法及び薄膜トランジスタ |
| JP2015227279A (ja) * | 2014-05-08 | 2015-12-17 | 株式会社Flosfia | 結晶性積層構造体および半導体装置 |
| JP2018093207A (ja) * | 2014-07-22 | 2018-06-14 | 株式会社Flosfia | 結晶性半導体膜および板状体ならびに半導体装置 |
| JP2016208024A (ja) * | 2015-04-15 | 2016-12-08 | 株式会社半導体エネルギー研究所 | 電極及び半導体装置の作製方法 |
| JP2017224794A (ja) * | 2016-06-17 | 2017-12-21 | ラピスセミコンダクタ株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2018142655A (ja) * | 2017-02-28 | 2018-09-13 | 株式会社タムラ製作所 | ショットキーバリアダイオード |
| JP2018170306A (ja) * | 2017-03-29 | 2018-11-01 | Tdk株式会社 | 酸化ガリウム半導体装置の製造方法 |
| JP2019048766A (ja) * | 2018-10-11 | 2019-03-28 | 国立研究開発法人物質・材料研究機構 | α−Ga2O3単結晶、α−Ga2O3の製造方法、および、それを用いた半導体素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021095474A1 (ja) | 2021-05-20 |
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