JPWO2021084913A1 - - Google Patents

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Publication number
JPWO2021084913A1
JPWO2021084913A1 JP2021554135A JP2021554135A JPWO2021084913A1 JP WO2021084913 A1 JPWO2021084913 A1 JP WO2021084913A1 JP 2021554135 A JP2021554135 A JP 2021554135A JP 2021554135 A JP2021554135 A JP 2021554135A JP WO2021084913 A1 JPWO2021084913 A1 JP WO2021084913A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021554135A
Other versions
JP7186307B2 (ja
JPWO2021084913A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021084913A1 publication Critical patent/JPWO2021084913A1/ja
Publication of JPWO2021084913A5 publication Critical patent/JPWO2021084913A5/ja
Application granted granted Critical
Publication of JP7186307B2 publication Critical patent/JP7186307B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
    • H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
JP2021554135A 2019-10-31 2020-09-07 配線モジュール、端子付きフレキシブルプリント基板及び蓄電モジュール Active JP7186307B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019198338 2019-10-31
JP2019198338 2019-10-31
PCT/JP2020/033709 WO2021084913A1 (ja) 2019-10-31 2020-09-07 フレキシブルプリント基板、配線モジュール、端子付きフレキシブルプリント基板及び蓄電モジュール

Publications (3)

Publication Number Publication Date
JPWO2021084913A1 true JPWO2021084913A1 (ja) 2021-05-06
JPWO2021084913A5 JPWO2021084913A5 (ja) 2022-05-26
JP7186307B2 JP7186307B2 (ja) 2022-12-08

Family

ID=75715039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554135A Active JP7186307B2 (ja) 2019-10-31 2020-09-07 配線モジュール、端子付きフレキシブルプリント基板及び蓄電モジュール

Country Status (4)

Country Link
US (1) US20220394855A1 (ja)
JP (1) JP7186307B2 (ja)
CN (1) CN114557140B (ja)
WO (1) WO2021084913A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023161744A (ja) * 2022-04-26 2023-11-08 株式会社オートネットワーク技術研究所 配線モジュール

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244541A (ja) * 1993-02-19 1994-09-02 Ricoh Co Ltd 回路基板装置
JP2010267903A (ja) * 2009-05-18 2010-11-25 Fujikura Ltd プリント回路基板における部品実装構造及び部品実装方法、並びにプリント回路基板
JP2013131528A (ja) * 2011-12-20 2013-07-04 Nippon Dempa Kogyo Co Ltd 表面実装型電子デバイスの実装方法とその実装基板
JP2018060612A (ja) * 2016-10-03 2018-04-12 株式会社オートネットワーク技術研究所 接続モジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4098556B2 (ja) * 2001-07-31 2008-06-11 ローム株式会社 端子板、この端子板を備えた回路基板、およびこの端子板の接続方法
WO2015107583A1 (ja) * 2014-01-17 2015-07-23 三洋電機株式会社 電源装置
JP6329027B2 (ja) * 2014-08-04 2018-05-23 ミネベアミツミ株式会社 フレキシブルプリント基板
JP6500258B2 (ja) * 2015-06-12 2019-04-17 北川工業株式会社 接触部材
JP6659253B2 (ja) * 2015-06-24 2020-03-04 住友電工プリントサーキット株式会社 フレキシブルプリント配線板及びフレキシブルプリント配線板の製造方法
US20170279104A1 (en) * 2016-03-22 2017-09-28 Faraday&Future Inc. Flexible circuit for vehicle battery
JP6612207B2 (ja) * 2016-12-19 2019-11-27 矢崎総業株式会社 導体モジュール
JP6939909B2 (ja) * 2018-01-23 2021-09-22 株式会社豊田自動織機 蓄電モジュール

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244541A (ja) * 1993-02-19 1994-09-02 Ricoh Co Ltd 回路基板装置
JP2010267903A (ja) * 2009-05-18 2010-11-25 Fujikura Ltd プリント回路基板における部品実装構造及び部品実装方法、並びにプリント回路基板
JP2013131528A (ja) * 2011-12-20 2013-07-04 Nippon Dempa Kogyo Co Ltd 表面実装型電子デバイスの実装方法とその実装基板
JP2018060612A (ja) * 2016-10-03 2018-04-12 株式会社オートネットワーク技術研究所 接続モジュール

Also Published As

Publication number Publication date
CN114557140B (zh) 2024-03-12
US20220394855A1 (en) 2022-12-08
JP7186307B2 (ja) 2022-12-08
CN114557140A (zh) 2022-05-27
WO2021084913A1 (ja) 2021-05-06

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