JPWO2021065601A1 - - Google Patents

Info

Publication number
JPWO2021065601A1
JPWO2021065601A1 JP2021550643A JP2021550643A JPWO2021065601A1 JP WO2021065601 A1 JPWO2021065601 A1 JP WO2021065601A1 JP 2021550643 A JP2021550643 A JP 2021550643A JP 2021550643 A JP2021550643 A JP 2021550643A JP WO2021065601 A1 JPWO2021065601 A1 JP WO2021065601A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021550643A
Other versions
JP7330282B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021065601A1 publication Critical patent/JPWO2021065601A1/ja
Application granted granted Critical
Publication of JP7330282B2 publication Critical patent/JP7330282B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2021550643A 2019-09-30 2020-09-23 配線基板 Active JP7330282B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019178275 2019-09-30
JP2019178275 2019-09-30
PCT/JP2020/035743 WO2021065601A1 (ja) 2019-09-30 2020-09-23 配線基板

Publications (2)

Publication Number Publication Date
JPWO2021065601A1 true JPWO2021065601A1 (ja) 2021-04-08
JP7330282B2 JP7330282B2 (ja) 2023-08-21

Family

ID=75336442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021550643A Active JP7330282B2 (ja) 2019-09-30 2020-09-23 配線基板

Country Status (4)

Country Link
US (1) US20220418100A1 (ja)
JP (1) JP7330282B2 (ja)
TW (1) TWI763052B (ja)
WO (1) WO2021065601A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023145592A1 (ja) * 2022-01-31 2023-08-03 京セラ株式会社 配線基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001274545A (ja) * 2000-03-28 2001-10-05 Ngk Spark Plug Co Ltd セラミック回路基板およびその製造方法
JP2002185108A (ja) * 2000-12-11 2002-06-28 Kyocera Corp 配線基板
JP2002252447A (ja) * 2001-02-26 2002-09-06 Kyocera Corp 配線基板
JP2015216344A (ja) * 2014-04-21 2015-12-03 新光電気工業株式会社 配線基板及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003110209A (ja) * 2001-10-02 2003-04-11 Matsushita Electric Ind Co Ltd 電子部品
JP2016018806A (ja) * 2014-07-04 2016-02-01 新光電気工業株式会社 配線基板、配線基板の製造方法
JP5795415B1 (ja) * 2014-08-29 2015-10-14 新光電気工業株式会社 配線基板及びその製造方法
JP2017011251A (ja) * 2015-06-24 2017-01-12 京セラ株式会社 配線基板およびその製造方法
KR102472714B1 (ko) * 2017-07-14 2022-11-29 멜텍스 가부시키가이샤 구리 에칭액

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001274545A (ja) * 2000-03-28 2001-10-05 Ngk Spark Plug Co Ltd セラミック回路基板およびその製造方法
JP2002185108A (ja) * 2000-12-11 2002-06-28 Kyocera Corp 配線基板
JP2002252447A (ja) * 2001-02-26 2002-09-06 Kyocera Corp 配線基板
JP2015216344A (ja) * 2014-04-21 2015-12-03 新光電気工業株式会社 配線基板及びその製造方法

Also Published As

Publication number Publication date
TWI763052B (zh) 2022-05-01
TW202115832A (zh) 2021-04-16
US20220418100A1 (en) 2022-12-29
WO2021065601A1 (ja) 2021-04-08
JP7330282B2 (ja) 2023-08-21

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