JPWO2021065243A5 - - Google Patents

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JPWO2021065243A5
JPWO2021065243A5 JP2021550419A JP2021550419A JPWO2021065243A5 JP WO2021065243 A5 JPWO2021065243 A5 JP WO2021065243A5 JP 2021550419 A JP2021550419 A JP 2021550419A JP 2021550419 A JP2021550419 A JP 2021550419A JP WO2021065243 A5 JPWO2021065243 A5 JP WO2021065243A5
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Japan
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JP2021550419A
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JPWO2021065243A1 (ja
JP7541247B2 (ja
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Priority claimed from PCT/JP2020/031631 external-priority patent/WO2021065243A1/ja
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Figure 2021065243000001
JP2021550419A 2019-10-04 2020-08-21 導電性樹脂組成物 Active JP7541247B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019183650 2019-10-04
JP2019183650 2019-10-04
PCT/JP2020/031631 WO2021065243A1 (ja) 2019-10-04 2020-08-21 導電性樹脂組成物

Publications (3)

Publication Number Publication Date
JPWO2021065243A1 JPWO2021065243A1 (ja) 2021-04-08
JPWO2021065243A5 true JPWO2021065243A5 (ja) 2022-06-13
JP7541247B2 JP7541247B2 (ja) 2024-08-28

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ID=75338182

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JP2021550419A Active JP7541247B2 (ja) 2019-10-04 2020-08-21 導電性樹脂組成物

Country Status (5)

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US (1) US12104060B2 (ja)
JP (1) JP7541247B2 (ja)
KR (1) KR20220079531A (ja)
CN (1) CN114450352B (ja)
WO (1) WO2021065243A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3831908A1 (en) * 2018-08-01 2021-06-09 Shin-Etsu Chemical Co., Ltd. Silicone adhesive agent composition, and adhesive tape or adhesive film using same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1280351C (zh) * 2000-12-07 2006-10-18 钟渊化学工业株式会社 半导电性树脂组合物及半导电性部件
JP3922342B2 (ja) 2001-01-17 2007-05-30 信越化学工業株式会社 電気接点材料用又は電磁波シールド材料用導電性シリコーンゴム組成物及び電気接点材料用又は電磁波シールド材料用導電性部品
JP2004331742A (ja) 2003-05-02 2004-11-25 Shin Etsu Chem Co Ltd 付加反応硬化型導電性シリコーンゴム組成物及びその硬化方法並びにその硬化物
JP2007154100A (ja) * 2005-12-07 2007-06-21 Canon Inc 樹脂用導電剤、導電性樹脂組成物及び導電性樹脂組成物の製造方法
EP1878767A1 (en) * 2006-07-12 2008-01-16 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone grease composition and cured product thereof
JP2008038137A (ja) * 2006-07-12 2008-02-21 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物およびその硬化物
TW200925199A (en) 2007-10-11 2009-06-16 Dow Corning Toray Co Ltd Metal particle dispersion structure, microparticles comprising this structure, articles coated with this structure, and methods of producing the preceding
JP5182515B2 (ja) 2008-12-25 2013-04-17 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN101624471A (zh) * 2009-03-06 2010-01-13 上海锐朗光电材料有限公司 一种热固化现场成型高导电硅橡胶组合物及其应用
CN102220012B (zh) * 2011-06-08 2012-10-31 北京工业大学 电磁屏蔽用单组分挤出成型导电橡胶及其制备方法
JP5511872B2 (ja) * 2012-03-19 2014-06-04 日本バルカー工業株式会社 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート
WO2016017344A1 (ja) * 2014-07-30 2016-02-04 住友精化株式会社 シリコーン樹脂組成物、シリコーン樹脂硬化物、及び、光半導体素子封止体
WO2016116959A1 (ja) * 2015-01-19 2016-07-28 京セラケミカル株式会社 導電性樹脂組成物および半導体装置
JP6791672B2 (ja) * 2016-07-22 2020-11-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性ポリシロキサン組成物
KR102506730B1 (ko) * 2018-02-06 2023-03-06 미쓰비시 마테리알 가부시키가이샤 은 피복 수지 입자

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