JPWO2021065074A1 - - Google Patents

Info

Publication number
JPWO2021065074A1
JPWO2021065074A1 JP2021551132A JP2021551132A JPWO2021065074A1 JP WO2021065074 A1 JPWO2021065074 A1 JP WO2021065074A1 JP 2021551132 A JP2021551132 A JP 2021551132A JP 2021551132 A JP2021551132 A JP 2021551132A JP WO2021065074 A1 JPWO2021065074 A1 JP WO2021065074A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021551132A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021065074A1 publication Critical patent/JPWO2021065074A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/25Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/066Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385Acrylic polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
JP2021551132A 2019-10-04 2020-05-22 Pending JPWO2021065074A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019183566 2019-10-04
PCT/JP2020/020331 WO2021065074A1 (en) 2019-10-04 2020-05-22 Adhesive sheet

Publications (1)

Publication Number Publication Date
JPWO2021065074A1 true JPWO2021065074A1 (en) 2021-04-08

Family

ID=75337973

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2021551130A Pending JPWO2021065072A1 (en) 2019-10-04 2020-05-22
JP2021551132A Pending JPWO2021065074A1 (en) 2019-10-04 2020-05-22
JP2021551129A Pending JPWO2021065071A1 (en) 2019-10-04 2020-05-22
JP2021551131A Pending JPWO2021065073A1 (en) 2019-10-04 2020-05-22
JP2021551128A Pending JPWO2021065070A1 (en) 2019-10-04 2020-05-22

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2021551130A Pending JPWO2021065072A1 (en) 2019-10-04 2020-05-22

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2021551129A Pending JPWO2021065071A1 (en) 2019-10-04 2020-05-22
JP2021551131A Pending JPWO2021065073A1 (en) 2019-10-04 2020-05-22
JP2021551128A Pending JPWO2021065070A1 (en) 2019-10-04 2020-05-22

Country Status (5)

Country Link
JP (5) JPWO2021065072A1 (en)
KR (3) KR20220080093A (en)
CN (3) CN114514295B (en)
TW (3) TW202116947A (en)
WO (5) WO2021065072A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023047592A1 (en) * 2021-09-27 2023-03-30 株式会社レゾナック Method for manufacturing semiconductor device

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3723278B2 (en) * 1996-05-21 2005-12-07 日東電工株式会社 Resist removal adhesive sheet and resist removal method
JP2006152072A (en) * 2004-11-26 2006-06-15 Teijin Chem Ltd Anti-static film for producing semiconductor and method for producing the same
JP2009064975A (en) * 2007-09-06 2009-03-26 Nitto Denko Corp Dicing adhesive sheet and dicing method
JP5069662B2 (en) * 2007-11-12 2012-11-07 リンテック株式会社 Adhesive sheet
WO2010058646A1 (en) 2008-11-21 2010-05-27 インターナショナル・ビジネス・マシーンズ・コーポレーション Semiconductor package and method for manufacturing same
JP2010229342A (en) * 2009-03-27 2010-10-14 Lintec Corp Adhesive for optical use, adhesive sheet for optical use, and optical member with adhesive
WO2012124389A1 (en) * 2011-03-17 2012-09-20 リンテック株式会社 Energy-ray-curable adhesive agent and adhesive sheet
JP2014043548A (en) * 2012-07-31 2014-03-13 Nitto Denko Corp Adhesive composition, adhesive layer, adhesive sheet and optical film
JP6207192B2 (en) * 2013-03-25 2017-10-04 リンテック株式会社 Adhesive sheet for semiconductor processing
JP6377322B2 (en) * 2013-05-30 2018-08-22 住友化学株式会社 Optical film laminate and composite polarizing plate using the same
SG11201600047XA (en) * 2013-07-05 2016-02-26 Lintec Corp Dicing sheet
DE112015001075T5 (en) * 2014-03-03 2016-11-24 Lintec Corporation Semiconductor-related element processing film and method of making chips using the film
JP6156443B2 (en) * 2014-08-13 2017-07-05 Jsr株式会社 LAMINATE AND SUBSTRATE PROCESSING METHOD
KR102449502B1 (en) * 2015-03-03 2022-09-30 린텍 가부시키가이샤 Sheet for semiconductor processing
JPWO2018003312A1 (en) 2016-06-30 2019-04-18 リンテック株式会社 Semiconductor processing sheet
CN114085624B (en) * 2016-12-07 2023-11-17 三菱化学株式会社 Pressure-sensitive adhesive sheet and method for producing same
JP6791792B2 (en) * 2017-03-23 2020-11-25 リンテック株式会社 Adhesive film and its manufacturing method
WO2018181511A1 (en) * 2017-03-31 2018-10-04 リンテック株式会社 Method for delaminating adhesive sheet
JP6350845B1 (en) * 2018-01-29 2018-07-04 サイデン化学株式会社 Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive
JP7256787B2 (en) * 2018-03-07 2023-04-12 リンテック株式会社 Adhesive sheet
JP2018115333A (en) * 2018-03-20 2018-07-26 リンテック株式会社 Adhesive tape and method for producing semiconductor device
JP2018115331A (en) * 2018-03-20 2018-07-26 リンテック株式会社 Pressure-sensitive adhesive tape and production method of semiconductor device

Also Published As

Publication number Publication date
TW202122533A (en) 2021-06-16
KR20220080093A (en) 2022-06-14
WO2021065072A1 (en) 2021-04-08
TW202122532A (en) 2021-06-16
TW202122534A (en) 2021-06-16
JPWO2021065070A1 (en) 2021-04-08
KR20220075341A (en) 2022-06-08
JPWO2021065072A1 (en) 2021-04-08
WO2021065074A1 (en) 2021-04-08
WO2021065070A1 (en) 2021-04-08
CN114514296A (en) 2022-05-17
CN114514295A (en) 2022-05-17
CN114514296B (en) 2024-03-29
JPWO2021065073A1 (en) 2021-04-08
CN114514295B (en) 2024-02-06
WO2021065073A1 (en) 2021-04-08
TW202115214A (en) 2021-04-16
KR20220080092A (en) 2022-06-14
CN114502679A (en) 2022-05-13
TW202116947A (en) 2021-05-01
JPWO2021065071A1 (en) 2021-04-08
WO2021065071A1 (en) 2021-04-08

Similar Documents

Publication Publication Date Title
BR112019017762A2 (en)
BR112021018450A2 (en)
BR112021017939A2 (en)
BR112021017892A2 (en)
BR112019016141A2 (en)
BR112021017738A2 (en)
BR112021017782A2 (en)
BR112019016138A2 (en)
BR112019016142A2 (en)
BR112021018168A2 (en)
AU2020104490A5 (en)
BR112021008711A2 (en)
BR112021018452A2 (en)
BR112021018584A2 (en)
BR112021012348A2 (en)
BR112021018250A2 (en)
BR112021018084A2 (en)
BR112021018093A2 (en)
BR112021013128A2 (en)
BR112021018484A2 (en)
BR112021017732A2 (en)
JPWO2021065073A1 (en)
BR112021017949A2 (en)
BR112021017983A2 (en)
AT524962A5 (en)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230309

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240402

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240529