JPWO2021060065A1 - - Google Patents

Info

Publication number
JPWO2021060065A1
JPWO2021060065A1 JP2021548827A JP2021548827A JPWO2021060065A1 JP WO2021060065 A1 JPWO2021060065 A1 JP WO2021060065A1 JP 2021548827 A JP2021548827 A JP 2021548827A JP 2021548827 A JP2021548827 A JP 2021548827A JP WO2021060065 A1 JPWO2021060065 A1 JP WO2021060065A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021548827A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021060065A1 publication Critical patent/JPWO2021060065A1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
JP2021548827A 2019-09-27 2020-09-15 Pending JPWO2021060065A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019178084 2019-09-27
PCT/JP2020/034841 WO2021060065A1 (ja) 2019-09-27 2020-09-15 実装システム、ヘッドユニット及び撮像方法

Publications (1)

Publication Number Publication Date
JPWO2021060065A1 true JPWO2021060065A1 (de) 2021-04-01

Family

ID=75166926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021548827A Pending JPWO2021060065A1 (de) 2019-09-27 2020-09-15

Country Status (3)

Country Link
JP (1) JPWO2021060065A1 (de)
CN (1) CN114303361B (de)
WO (1) WO2021060065A1 (de)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3746127B2 (ja) * 1997-01-20 2006-02-15 Juki株式会社 部品搭載装置
JP4620262B2 (ja) * 2001-01-16 2011-01-26 富士機械製造株式会社 電子部品装着装置
JP4459847B2 (ja) * 2005-03-17 2010-04-28 パナソニック株式会社 部品装着ヘッド及び部品装着方法
CN104285508B (zh) * 2012-04-27 2017-10-24 雅马哈发动机株式会社 部件安装装置
JP2013251346A (ja) * 2012-05-30 2013-12-12 Juki Corp 電子部品実装装置
WO2014155583A1 (ja) * 2013-03-27 2014-10-02 株式会社日立製作所 部品実装装置および部品実装方法
WO2014174598A1 (ja) * 2013-04-24 2014-10-30 株式会社日立製作所 部品実装装置、実装ヘッド、および制御装置
JP2014216621A (ja) * 2013-04-30 2014-11-17 株式会社日立製作所 基板処理装置および基板処理方法
JP6259987B2 (ja) * 2013-07-12 2018-01-17 パナソニックIpマネジメント株式会社 部品実装装置
CN105100578A (zh) * 2014-05-05 2015-11-25 南昌欧菲光电技术有限公司 图像处理系统及其图像处理方法
CA2960427A1 (en) * 2014-10-07 2016-04-14 Nokia Technologies Oy Camera devices with a large field of view for stereo imaging
JP6584870B2 (ja) * 2014-12-17 2019-10-02 日本電産コパル株式会社 車載用画像認識装置、及びその製造方法
JP6571185B2 (ja) * 2015-06-19 2019-09-04 ヤマハ発動機株式会社 部品実装装置および部品実装方法
CN204795419U (zh) * 2015-07-22 2015-11-18 公安部第三研究所 一种流水线货物清晰拍照的反射摄像仪
JP7002831B2 (ja) * 2016-06-07 2022-01-20 株式会社Fuji 部品実装機
WO2019021365A1 (ja) * 2017-07-25 2019-01-31 ヤマハ発動機株式会社 部品実装装置
US11272651B2 (en) * 2017-09-28 2022-03-08 Yamaha Hatsudoki Kabushiki Kaisha Component mounting device, method of capturing image, and method of determining mounting sequence
CN109041568A (zh) * 2018-09-25 2018-12-18 苏州小工匠机器人有限公司 自动化贴片机
CN109379528A (zh) * 2018-12-20 2019-02-22 Oppo广东移动通信有限公司 成像方法、成像装置、电子装置及介质

Also Published As

Publication number Publication date
CN114303361B (zh) 2024-04-19
CN114303361A (zh) 2022-04-08
WO2021060065A1 (ja) 2021-04-01

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