JPWO2021048695A1 - - Google Patents
Info
- Publication number
- JPWO2021048695A1 JPWO2021048695A1 JP2021507447A JP2021507447A JPWO2021048695A1 JP WO2021048695 A1 JPWO2021048695 A1 JP WO2021048695A1 JP 2021507447 A JP2021507447 A JP 2021507447A JP 2021507447 A JP2021507447 A JP 2021507447A JP WO2021048695 A1 JPWO2021048695 A1 JP WO2021048695A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1365—Matching; Classification
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04166—Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/042—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/616—Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/766—Addressed sensors, e.g. MOS or CMOS sensors comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/198—Contact-type image sensors [CIS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
- H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Multimedia (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019167175 | 2019-09-13 | ||
| JP2019167175 | 2019-09-13 | ||
| PCT/IB2020/058145 WO2021048695A1 (ja) | 2019-09-13 | 2020-09-02 | 撮像装置、及びその駆動方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021048695A1 true JPWO2021048695A1 (https=) | 2021-03-18 |
| JP7596258B2 JP7596258B2 (ja) | 2024-12-09 |
Family
ID=74866629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021507447A Active JP7596258B2 (ja) | 2019-09-13 | 2020-09-02 | 撮像装置、及びその駆動方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12080095B2 (https=) |
| JP (1) | JP7596258B2 (https=) |
| KR (1) | KR20220058590A (https=) |
| CN (1) | CN114391247A (https=) |
| WO (1) | WO2021048695A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11900721B2 (en) | 2019-09-27 | 2024-02-13 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device and program |
| CN115552450A (zh) | 2020-05-29 | 2022-12-30 | 株式会社半导体能源研究所 | 电子设备及电子设备的识别方法 |
| TWI750991B (zh) * | 2021-01-07 | 2021-12-21 | 友達光電股份有限公司 | 感測器 |
| US12223761B2 (en) * | 2022-09-05 | 2025-02-11 | Himax Technologies Limited | Display device and fingerprint sensing circuit |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018182496A (ja) * | 2017-04-11 | 2018-11-15 | ソニーセミコンダクタソリューションズ株式会社 | 信号処理装置、及び、固体撮像装置 |
| JP2018207488A (ja) * | 2017-06-01 | 2018-12-27 | パナソニックIpマネジメント株式会社 | 撮像装置 |
| WO2019012369A1 (ja) * | 2017-07-14 | 2019-01-17 | 株式会社半導体エネルギー研究所 | 撮像装置、及び電子機器 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3013584B2 (ja) * | 1992-02-14 | 2000-02-28 | ソニー株式会社 | 固体撮像装置 |
| JP2011061270A (ja) * | 2009-09-07 | 2011-03-24 | Panasonic Corp | 固体撮像装置 |
| WO2011055638A1 (en) * | 2009-11-06 | 2011-05-12 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| KR101029619B1 (ko) * | 2009-12-30 | 2011-04-15 | 주식회사 하이닉스반도체 | Cmos 이미지 센서 |
| US8743258B2 (en) | 2010-11-29 | 2014-06-03 | Samsung Electronics Co., Ltd. | Correlated double sampling circuit, method thereof and devices having the same |
| KR101976228B1 (ko) | 2011-09-22 | 2019-05-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 광 검출 장치 및 광 검출 장치의 구동 방법 |
| KR102210539B1 (ko) | 2013-12-26 | 2021-02-01 | 삼성전자주식회사 | 상관 이중 샘플링 회로, 이를 포함하는 아날로그-디지털 컨버터, 및 이미지 센서 |
| JP2016029795A (ja) | 2014-07-18 | 2016-03-03 | 株式会社半導体エネルギー研究所 | 半導体装置、撮像装置及び電子機器 |
| WO2016046685A1 (en) | 2014-09-26 | 2016-03-31 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device |
| JP6963463B2 (ja) | 2016-11-10 | 2021-11-10 | 株式会社半導体エネルギー研究所 | 半導体装置、電子部品、及び電子機器 |
| JP2019079415A (ja) | 2017-10-26 | 2019-05-23 | 京セラ株式会社 | 電子機器、制御装置、制御プログラム及び電子機器の動作方法 |
-
2020
- 2020-09-02 WO PCT/IB2020/058145 patent/WO2021048695A1/ja not_active Ceased
- 2020-09-02 US US17/639,632 patent/US12080095B2/en active Active
- 2020-09-02 JP JP2021507447A patent/JP7596258B2/ja active Active
- 2020-09-02 KR KR1020227010920A patent/KR20220058590A/ko active Pending
- 2020-09-02 CN CN202080063763.4A patent/CN114391247A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018182496A (ja) * | 2017-04-11 | 2018-11-15 | ソニーセミコンダクタソリューションズ株式会社 | 信号処理装置、及び、固体撮像装置 |
| JP2018207488A (ja) * | 2017-06-01 | 2018-12-27 | パナソニックIpマネジメント株式会社 | 撮像装置 |
| WO2019012369A1 (ja) * | 2017-07-14 | 2019-01-17 | 株式会社半導体エネルギー研究所 | 撮像装置、及び電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| US12080095B2 (en) | 2024-09-03 |
| KR20220058590A (ko) | 2022-05-09 |
| WO2021048695A1 (ja) | 2021-03-18 |
| JP7596258B2 (ja) | 2024-12-09 |
| CN114391247A (zh) | 2022-04-22 |
| US20220292871A1 (en) | 2022-09-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230818 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20241105 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20241127 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7596258 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |