JPWO2021048695A1 - - Google Patents

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Publication number
JPWO2021048695A1
JPWO2021048695A1 JP2021507447A JP2021507447A JPWO2021048695A1 JP WO2021048695 A1 JPWO2021048695 A1 JP WO2021048695A1 JP 2021507447 A JP2021507447 A JP 2021507447A JP 2021507447 A JP2021507447 A JP 2021507447A JP WO2021048695 A1 JPWO2021048695 A1 JP WO2021048695A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021507447A
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Japanese (ja)
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JP7596258B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021048695A1 publication Critical patent/JPWO2021048695A1/ja
Application granted granted Critical
Publication of JP7596258B2 publication Critical patent/JP7596258B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/71Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75Circuitry for providing, modifying or processing image signals from the pixel array
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/1365Matching; Classification
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/04166Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/042Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by opto-electronic means
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12Fingerprints or palmprints
    • G06V40/13Sensors therefor
    • G06V40/1318Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/616Noise processing, e.g. detecting, correcting, reducing or removing noise involving a correlated sampling function, e.g. correlated double sampling [CDS] or triple sampling
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/766Addressed sensors, e.g. MOS or CMOS sensors comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/198Contact-type image sensors [CIS]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/803Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Thin Film Transistor (AREA)
JP2021507447A 2019-09-13 2020-09-02 撮像装置、及びその駆動方法 Active JP7596258B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019167175 2019-09-13
JP2019167175 2019-09-13
PCT/IB2020/058145 WO2021048695A1 (ja) 2019-09-13 2020-09-02 撮像装置、及びその駆動方法

Publications (2)

Publication Number Publication Date
JPWO2021048695A1 true JPWO2021048695A1 (https=) 2021-03-18
JP7596258B2 JP7596258B2 (ja) 2024-12-09

Family

ID=74866629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021507447A Active JP7596258B2 (ja) 2019-09-13 2020-09-02 撮像装置、及びその駆動方法

Country Status (5)

Country Link
US (1) US12080095B2 (https=)
JP (1) JP7596258B2 (https=)
KR (1) KR20220058590A (https=)
CN (1) CN114391247A (https=)
WO (1) WO2021048695A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11900721B2 (en) 2019-09-27 2024-02-13 Semiconductor Energy Laboratory Co., Ltd. Electronic device and program
CN115552450A (zh) 2020-05-29 2022-12-30 株式会社半导体能源研究所 电子设备及电子设备的识别方法
TWI750991B (zh) * 2021-01-07 2021-12-21 友達光電股份有限公司 感測器
US12223761B2 (en) * 2022-09-05 2025-02-11 Himax Technologies Limited Display device and fingerprint sensing circuit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018182496A (ja) * 2017-04-11 2018-11-15 ソニーセミコンダクタソリューションズ株式会社 信号処理装置、及び、固体撮像装置
JP2018207488A (ja) * 2017-06-01 2018-12-27 パナソニックIpマネジメント株式会社 撮像装置
WO2019012369A1 (ja) * 2017-07-14 2019-01-17 株式会社半導体エネルギー研究所 撮像装置、及び電子機器

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3013584B2 (ja) * 1992-02-14 2000-02-28 ソニー株式会社 固体撮像装置
JP2011061270A (ja) * 2009-09-07 2011-03-24 Panasonic Corp 固体撮像装置
WO2011055638A1 (en) * 2009-11-06 2011-05-12 Semiconductor Energy Laboratory Co., Ltd. Display device
KR101029619B1 (ko) * 2009-12-30 2011-04-15 주식회사 하이닉스반도체 Cmos 이미지 센서
US8743258B2 (en) 2010-11-29 2014-06-03 Samsung Electronics Co., Ltd. Correlated double sampling circuit, method thereof and devices having the same
KR101976228B1 (ko) 2011-09-22 2019-05-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 광 검출 장치 및 광 검출 장치의 구동 방법
KR102210539B1 (ko) 2013-12-26 2021-02-01 삼성전자주식회사 상관 이중 샘플링 회로, 이를 포함하는 아날로그-디지털 컨버터, 및 이미지 센서
JP2016029795A (ja) 2014-07-18 2016-03-03 株式会社半導体エネルギー研究所 半導体装置、撮像装置及び電子機器
WO2016046685A1 (en) 2014-09-26 2016-03-31 Semiconductor Energy Laboratory Co., Ltd. Imaging device
JP6963463B2 (ja) 2016-11-10 2021-11-10 株式会社半導体エネルギー研究所 半導体装置、電子部品、及び電子機器
JP2019079415A (ja) 2017-10-26 2019-05-23 京セラ株式会社 電子機器、制御装置、制御プログラム及び電子機器の動作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018182496A (ja) * 2017-04-11 2018-11-15 ソニーセミコンダクタソリューションズ株式会社 信号処理装置、及び、固体撮像装置
JP2018207488A (ja) * 2017-06-01 2018-12-27 パナソニックIpマネジメント株式会社 撮像装置
WO2019012369A1 (ja) * 2017-07-14 2019-01-17 株式会社半導体エネルギー研究所 撮像装置、及び電子機器

Also Published As

Publication number Publication date
US12080095B2 (en) 2024-09-03
KR20220058590A (ko) 2022-05-09
WO2021048695A1 (ja) 2021-03-18
JP7596258B2 (ja) 2024-12-09
CN114391247A (zh) 2022-04-22
US20220292871A1 (en) 2022-09-15

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