JPWO2021044575A1 - - Google Patents

Info

Publication number
JPWO2021044575A1
JPWO2021044575A1 JP2021543886A JP2021543886A JPWO2021044575A1 JP WO2021044575 A1 JPWO2021044575 A1 JP WO2021044575A1 JP 2021543886 A JP2021543886 A JP 2021543886A JP 2021543886 A JP2021543886 A JP 2021543886A JP WO2021044575 A1 JPWO2021044575 A1 JP WO2021044575A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021543886A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021044575A1 publication Critical patent/JPWO2021044575A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0407—Liquid cooling, e.g. by water
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • H01S3/0401—Arrangements for thermal management of optical elements being part of laser resonator, e.g. windows, mirrors, lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021543886A 2019-09-05 2019-09-05 Pending JPWO2021044575A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/034957 WO2021044575A1 (ja) 2019-09-05 2019-09-05 冷却装置

Publications (1)

Publication Number Publication Date
JPWO2021044575A1 true JPWO2021044575A1 (https=) 2021-03-11

Family

ID=74852722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021543886A Pending JPWO2021044575A1 (https=) 2019-09-05 2019-09-05

Country Status (3)

Country Link
US (1) US20220320812A1 (https=)
JP (1) JPWO2021044575A1 (https=)
WO (1) WO2021044575A1 (https=)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60120401U (ja) * 1984-01-25 1985-08-14 株式会社日立製作所 反射ミラ−
JP2005142242A (ja) * 2003-11-05 2005-06-02 Japan Science & Technology Agency 固体レーザー装置
JP2005520289A (ja) * 2002-03-08 2005-07-07 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 液体金属アノードを有するｘ線発生装置
US20100118902A1 (en) * 2008-11-12 2010-05-13 Metal Industries Research & Development Centre Unitized cooling module for laser diode array
JP2011054675A (ja) * 2009-08-31 2011-03-17 Hamamatsu Photonics Kk 固体レーザ装置
JP2011165870A (ja) * 2010-02-09 2011-08-25 Toyota Motor Corp パワーモジュール
JP2011529251A (ja) * 2008-07-26 2011-12-01 エルジー・ケム・リミテッド 優れた冷却効率の中型又は大型のバッテリーパックケース
JP2013041051A (ja) * 2011-08-12 2013-02-28 Gigaphoton Inc 波長変換装置、固体レーザ装置およびレーザシステム
JP2015185601A (ja) * 2014-03-20 2015-10-22 三菱重工業株式会社 レーザ発振冷却装置
CN105281198A (zh) * 2014-05-30 2016-01-27 中国科学院理化技术研究所 一种半导体激光器的热管理装置
JP2017207235A (ja) * 2016-05-18 2017-11-24 株式会社Ｎｔｔファシリティーズ 発熱体冷却システム
JP2019079908A (ja) * 2017-10-24 2019-05-23 三菱電機株式会社 冷却装置及びこれを備えた半導体モジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070020107A1 (en) * 2005-06-29 2007-01-25 Ioan Sauciuc High pressure pump for cooling electronics
US7307841B2 (en) * 2005-07-28 2007-12-11 Delphi Technologies, Inc. Electronic package and method of cooling electronics
JP5644767B2 (ja) * 2009-09-29 2014-12-24 日本電気株式会社 電子機器装置の熱輸送構造
JP5515947B2 (ja) * 2010-03-29 2014-06-11 株式会社豊田自動織機 冷却装置
US20120145361A1 (en) * 2010-12-13 2012-06-14 Nuventix Inc. Apparatus and method for enhanced heat transfer
US20130068606A1 (en) * 2011-09-15 2013-03-21 Heatcraft Refrigeration Products Llc Fluid agitator for use in an immersion cooler
US10729040B2 (en) * 2015-09-14 2020-07-28 Mitsubishi Electric Corporation Cooler, power conversion apparatus, and cooling system
JP6939481B2 (ja) * 2017-11-30 2021-09-22 富士通株式会社 冷却ジャケット及び電子機器

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60120401U (ja) * 1984-01-25 1985-08-14 株式会社日立製作所 反射ミラ−
JP2005520289A (ja) * 2002-03-08 2005-07-07 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 液体金属アノードを有するｘ線発生装置
JP2005142242A (ja) * 2003-11-05 2005-06-02 Japan Science & Technology Agency 固体レーザー装置
JP2011529251A (ja) * 2008-07-26 2011-12-01 エルジー・ケム・リミテッド 優れた冷却効率の中型又は大型のバッテリーパックケース
US20100118902A1 (en) * 2008-11-12 2010-05-13 Metal Industries Research & Development Centre Unitized cooling module for laser diode array
JP2011054675A (ja) * 2009-08-31 2011-03-17 Hamamatsu Photonics Kk 固体レーザ装置
JP2011165870A (ja) * 2010-02-09 2011-08-25 Toyota Motor Corp パワーモジュール
JP2013041051A (ja) * 2011-08-12 2013-02-28 Gigaphoton Inc 波長変換装置、固体レーザ装置およびレーザシステム
JP2015185601A (ja) * 2014-03-20 2015-10-22 三菱重工業株式会社 レーザ発振冷却装置
CN105281198A (zh) * 2014-05-30 2016-01-27 中国科学院理化技术研究所 一种半导体激光器的热管理装置
JP2017207235A (ja) * 2016-05-18 2017-11-24 株式会社Ｎｔｔファシリティーズ 発熱体冷却システム
JP2019079908A (ja) * 2017-10-24 2019-05-23 三菱電機株式会社 冷却装置及びこれを備えた半導体モジュール

Also Published As

Publication number Publication date
US20220320812A1 (en) 2022-10-06
WO2021044575A1 (ja) 2021-03-11

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