JPWO2021039137A1 - - Google Patents

Info

Publication number
JPWO2021039137A1
JPWO2021039137A1 JP2021542602A JP2021542602A JPWO2021039137A1 JP WO2021039137 A1 JPWO2021039137 A1 JP WO2021039137A1 JP 2021542602 A JP2021542602 A JP 2021542602A JP 2021542602 A JP2021542602 A JP 2021542602A JP WO2021039137 A1 JPWO2021039137 A1 JP WO2021039137A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021542602A
Other versions
JP7288511B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021039137A1 publication Critical patent/JPWO2021039137A1/ja
Application granted granted Critical
Publication of JP7288511B2 publication Critical patent/JP7288511B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/36—Organic compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C23G1/16—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions using inhibitors
    • C23G1/18—Organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
    • C23G1/20—Other heavy metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Emergency Medicine (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2021542602A 2019-08-23 2020-07-08 洗浄剤組成物 Active JP7288511B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019152672 2019-08-23
JP2019152672 2019-08-23
PCT/JP2020/026639 WO2021039137A1 (ja) 2019-08-23 2020-07-08 洗浄剤組成物

Publications (2)

Publication Number Publication Date
JPWO2021039137A1 true JPWO2021039137A1 (ja) 2021-03-04
JP7288511B2 JP7288511B2 (ja) 2023-06-07

Family

ID=74685834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021542602A Active JP7288511B2 (ja) 2019-08-23 2020-07-08 洗浄剤組成物

Country Status (4)

Country Link
JP (1) JP7288511B2 (ja)
CN (1) CN114341328A (ja)
TW (1) TW202108753A (ja)
WO (1) WO2021039137A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022190699A1 (ja) * 2021-03-11 2022-09-15 富士フイルム株式会社 薬液、処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005307187A (ja) * 2004-03-19 2005-11-04 Air Products & Chemicals Inc 化学的機械的平坦化後用のアルカリ性洗浄組成物
JP2012072267A (ja) * 2010-09-28 2012-04-12 Sanyo Chem Ind Ltd 電子材料用洗浄剤
WO2018043440A1 (ja) * 2016-08-31 2018-03-08 富士フイルム株式会社 処理液、基板の洗浄方法、半導体デバイスの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6494627B2 (ja) 2013-12-06 2019-04-03 フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド 表面上の残渣を除去するための洗浄用製剤
JP6542393B2 (ja) 2016-01-05 2019-07-10 富士フイルム株式会社 処理液、基板の洗浄方法および半導体デバイスの製造方法
WO2017119244A1 (ja) 2016-01-05 2017-07-13 富士フイルム株式会社 処理液、基板の洗浄方法、および、半導体デバイスの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005307187A (ja) * 2004-03-19 2005-11-04 Air Products & Chemicals Inc 化学的機械的平坦化後用のアルカリ性洗浄組成物
JP2012072267A (ja) * 2010-09-28 2012-04-12 Sanyo Chem Ind Ltd 電子材料用洗浄剤
WO2018043440A1 (ja) * 2016-08-31 2018-03-08 富士フイルム株式会社 処理液、基板の洗浄方法、半導体デバイスの製造方法

Also Published As

Publication number Publication date
WO2021039137A1 (ja) 2021-03-04
JP7288511B2 (ja) 2023-06-07
CN114341328A (zh) 2022-04-12
TW202108753A (zh) 2021-03-01

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