JPWO2021033654A1 - - Google Patents

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Publication number
JPWO2021033654A1
JPWO2021033654A1 JP2021540932A JP2021540932A JPWO2021033654A1 JP WO2021033654 A1 JPWO2021033654 A1 JP WO2021033654A1 JP 2021540932 A JP2021540932 A JP 2021540932A JP 2021540932 A JP2021540932 A JP 2021540932A JP WO2021033654 A1 JPWO2021033654 A1 JP WO2021033654A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021540932A
Other versions
JP7160475B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021033654A1 publication Critical patent/JPWO2021033654A1/ja
Application granted granted Critical
Publication of JP7160475B2 publication Critical patent/JP7160475B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/36—Organic compounds containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Detergent Compositions (AREA)
JP2021540932A 2019-08-19 2020-08-17 洗浄用組成物、リンス液、洗浄キット、洗浄体の製造方法および半導体素子の製造方法 Active JP7160475B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019149910 2019-08-19
JP2019149910 2019-08-19
PCT/JP2020/030931 WO2021033654A1 (ja) 2019-08-19 2020-08-17 洗浄用組成物、リンス液、洗浄キット、洗浄体の製造方法および半導体素子の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021033654A1 true JPWO2021033654A1 (ja) 2021-02-25
JP7160475B2 JP7160475B2 (ja) 2022-10-25

Family

ID=74660928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021540932A Active JP7160475B2 (ja) 2019-08-19 2020-08-17 洗浄用組成物、リンス液、洗浄キット、洗浄体の製造方法および半導体素子の製造方法

Country Status (3)

Country Link
JP (1) JP7160475B2 (ja)
TW (1) TW202113060A (ja)
WO (1) WO2021033654A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115612573B (zh) * 2022-09-05 2023-10-13 圣戈班汇杰(杭州)新材料有限公司 一种固化硅酮胶的除胶剂配方及其使用方法
KR102587963B1 (ko) * 2023-02-24 2023-10-12 주식회사 비와이씨 솔더페이스트 잔사 제거에 효과적인 친환경 세정제조성물

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110146727A1 (en) * 2008-08-13 2011-06-23 Kalyankar Nikhil D Combinatorial approach to the development of cleaning formulations for glue removal in semiconductor applications
JP2014133855A (ja) * 2012-12-11 2014-07-24 Fujifilm Corp シロキサン樹脂の除去剤、それを用いたシロキサン樹脂の除去方法並びに半導体基板製品及び半導体素子の製造方法
KR20160123707A (ko) * 2015-04-17 2016-10-26 재원산업 주식회사 접착제 제거용 조성물 및 이를 이용한 박형 웨이퍼의 제조방법
WO2018021273A1 (ja) * 2016-07-29 2018-02-01 富士フイルム株式会社 キット、洗浄剤組成物および半導体素子の製造方法
JP2018046095A (ja) * 2016-09-13 2018-03-22 信越化学工業株式会社 ウエハ加工用仮接着材料、ウエハ加工体、及び薄型ウエハの製造方法
WO2018131628A1 (ja) * 2017-01-13 2018-07-19 富士フイルム株式会社 キット、半導体素子の製造方法および半導体素子の基板の洗浄方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110146727A1 (en) * 2008-08-13 2011-06-23 Kalyankar Nikhil D Combinatorial approach to the development of cleaning formulations for glue removal in semiconductor applications
JP2014133855A (ja) * 2012-12-11 2014-07-24 Fujifilm Corp シロキサン樹脂の除去剤、それを用いたシロキサン樹脂の除去方法並びに半導体基板製品及び半導体素子の製造方法
KR20160123707A (ko) * 2015-04-17 2016-10-26 재원산업 주식회사 접착제 제거용 조성물 및 이를 이용한 박형 웨이퍼의 제조방법
WO2018021273A1 (ja) * 2016-07-29 2018-02-01 富士フイルム株式会社 キット、洗浄剤組成物および半導体素子の製造方法
JP2018046095A (ja) * 2016-09-13 2018-03-22 信越化学工業株式会社 ウエハ加工用仮接着材料、ウエハ加工体、及び薄型ウエハの製造方法
WO2018131628A1 (ja) * 2017-01-13 2018-07-19 富士フイルム株式会社 キット、半導体素子の製造方法および半導体素子の基板の洗浄方法

Also Published As

Publication number Publication date
JP7160475B2 (ja) 2022-10-25
TW202113060A (zh) 2021-04-01
WO2021033654A1 (ja) 2021-02-25

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