JPWO2021019932A1 - - Google Patents

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Publication number
JPWO2021019932A1
JPWO2021019932A1 JP2021536650A JP2021536650A JPWO2021019932A1 JP WO2021019932 A1 JPWO2021019932 A1 JP WO2021019932A1 JP 2021536650 A JP2021536650 A JP 2021536650A JP 2021536650 A JP2021536650 A JP 2021536650A JP WO2021019932 A1 JPWO2021019932 A1 JP WO2021019932A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021536650A
Other versions
JPWO2021019932A5 (ja
JP7359210B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021019932A1 publication Critical patent/JPWO2021019932A1/ja
Publication of JPWO2021019932A5 publication Critical patent/JPWO2021019932A5/ja
Application granted granted Critical
Publication of JP7359210B2 publication Critical patent/JP7359210B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/21—Crystal tuning forks
    • H03H9/215—Crystal tuning forks consisting of quartz

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2021536650A 2019-07-29 2020-06-12 水晶振動子、電子部品及び電子装置 Active JP7359210B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019138921 2019-07-29
JP2019138921 2019-07-29
PCT/JP2020/023184 WO2021019932A1 (ja) 2019-07-29 2020-06-12 水晶振動子、電子部品及び電子装置

Publications (3)

Publication Number Publication Date
JPWO2021019932A1 true JPWO2021019932A1 (ja) 2021-02-04
JPWO2021019932A5 JPWO2021019932A5 (ja) 2022-04-01
JP7359210B2 JP7359210B2 (ja) 2023-10-11

Family

ID=74228563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021536650A Active JP7359210B2 (ja) 2019-07-29 2020-06-12 水晶振動子、電子部品及び電子装置

Country Status (4)

Country Link
US (1) US20220140815A1 (ja)
JP (1) JP7359210B2 (ja)
CN (1) CN114208034A (ja)
WO (1) WO2021019932A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09328671A (ja) * 1996-06-10 1997-12-22 Denso Corp 導電性接着剤及び電子部品搭載装置
JPH11236545A (ja) * 1998-02-23 1999-08-31 Mitsubishi Electric Corp 導電性接着剤およびそれを用いてなる半導体装置
JP2002324432A (ja) * 2001-04-26 2002-11-08 Hitachi Chem Co Ltd 異方導電材テープ
WO2009022574A1 (ja) * 2007-08-10 2009-02-19 Asahi Kasei E-Materials Corporation 接着剤及び接合体
JP2014101480A (ja) * 2012-11-22 2014-06-05 Dow Corning Toray Co Ltd 潤滑被膜用塗料組成物
JP2015170939A (ja) * 2014-03-06 2015-09-28 セイコーエプソン株式会社 振動デバイスの製造方法
WO2018212184A1 (ja) * 2017-05-17 2018-11-22 株式会社村田製作所 圧電振動子の製造方法
WO2019097852A1 (ja) * 2017-11-14 2019-05-23 株式会社高木化学研究所 分離安定性に優れたフィラー充填高熱伝導性分散液組成物、前記分散液組成物の製造方法、前記分散液組成物を用いたフィラー充填高熱伝導性材料、前記材料の製造方法、及び前記材料を用いて得られる成形品

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4300984B2 (ja) 2003-11-10 2009-07-22 マックス株式会社 綴じ処理装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09328671A (ja) * 1996-06-10 1997-12-22 Denso Corp 導電性接着剤及び電子部品搭載装置
JPH11236545A (ja) * 1998-02-23 1999-08-31 Mitsubishi Electric Corp 導電性接着剤およびそれを用いてなる半導体装置
JP2002324432A (ja) * 2001-04-26 2002-11-08 Hitachi Chem Co Ltd 異方導電材テープ
WO2009022574A1 (ja) * 2007-08-10 2009-02-19 Asahi Kasei E-Materials Corporation 接着剤及び接合体
JP2014101480A (ja) * 2012-11-22 2014-06-05 Dow Corning Toray Co Ltd 潤滑被膜用塗料組成物
JP2015170939A (ja) * 2014-03-06 2015-09-28 セイコーエプソン株式会社 振動デバイスの製造方法
WO2018212184A1 (ja) * 2017-05-17 2018-11-22 株式会社村田製作所 圧電振動子の製造方法
WO2019097852A1 (ja) * 2017-11-14 2019-05-23 株式会社高木化学研究所 分離安定性に優れたフィラー充填高熱伝導性分散液組成物、前記分散液組成物の製造方法、前記分散液組成物を用いたフィラー充填高熱伝導性材料、前記材料の製造方法、及び前記材料を用いて得られる成形品

Also Published As

Publication number Publication date
WO2021019932A1 (ja) 2021-02-04
US20220140815A1 (en) 2022-05-05
CN114208034A (zh) 2022-03-18
JP7359210B2 (ja) 2023-10-11

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