JPWO2020261958A1 - - Google Patents

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Publication number
JPWO2020261958A1
JPWO2020261958A1 JP2021527618A JP2021527618A JPWO2020261958A1 JP WO2020261958 A1 JPWO2020261958 A1 JP WO2020261958A1 JP 2021527618 A JP2021527618 A JP 2021527618A JP 2021527618 A JP2021527618 A JP 2021527618A JP WO2020261958 A1 JPWO2020261958 A1 JP WO2020261958A1
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JP
Japan
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JP2021527618A
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JP7168084B2 (ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C08K7/20—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021527618A 2019-06-24 2020-06-08 高熱伝導性シリコーン組成物及びその硬化物 Active JP7168084B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019116127 2019-06-24
JP2019116127 2019-06-24
PCT/JP2020/022510 WO2020261958A1 (ja) 2019-06-24 2020-06-08 高熱伝導性シリコーン組成物及びその硬化物

Publications (2)

Publication Number Publication Date
JPWO2020261958A1 true JPWO2020261958A1 (ja) 2020-12-30
JP7168084B2 JP7168084B2 (ja) 2022-11-09

Family

ID=74059708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021527618A Active JP7168084B2 (ja) 2019-06-24 2020-06-08 高熱伝導性シリコーン組成物及びその硬化物

Country Status (6)

Country Link
US (1) US20220372359A1 (ja)
EP (1) EP3988607A4 (ja)
JP (1) JP7168084B2 (ja)
KR (1) KR20220024818A (ja)
CN (1) CN113993939A (ja)
WO (1) WO2020261958A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114213851A (zh) * 2021-07-22 2022-03-22 苏州桐力光电股份有限公司 一种有机硅网络原位插层堆叠氧化铝材料及制备方法
EP4206299A1 (en) * 2021-12-31 2023-07-05 Tianjin Laird Technologies Limited Novel low oil bleeding thermal gap pad material

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0888488A (ja) * 1994-09-20 1996-04-02 Tokai Rubber Ind Ltd 放熱シートおよびその製法
JP2016088838A (ja) * 2014-10-31 2016-05-23 堺化学工業株式会社 酸化マグネシウム粒子、その製造方法、放熱性フィラー、放熱性樹脂組成物、放熱性グリース及び放熱性塗料組成物
WO2018088416A1 (ja) * 2016-11-09 2018-05-17 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物、ならびに製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5565838A (en) 1978-11-13 1980-05-17 Matsushita Electric Ind Co Ltd Cooker
JPH05239358A (ja) 1992-03-02 1993-09-17 Toshiba Silicone Co Ltd 熱伝導性シリコーンゴム組成物
JP3127093B2 (ja) 1994-03-03 2001-01-22 信越化学工業株式会社 熱伝導性シリコーンゴム組成物
JP4610764B2 (ja) 2001-03-15 2011-01-12 電気化学工業株式会社 放熱スペーサー
KR100858836B1 (ko) 2001-05-14 2008-09-17 다우 코닝 도레이 캄파니 리미티드 열전도성 실리콘 조성물
JP2003342021A (ja) 2002-05-28 2003-12-03 Polymatech Co Ltd 酸化アルミニウム粉末組成物及びそれを含有する熱伝導性成形体
JP4193052B2 (ja) * 2003-08-25 2008-12-10 信越化学工業株式会社 高熱伝導性シリコーンゴム組成物並びに定着ロール及び定着ベルト
JP2005162555A (ja) 2003-12-04 2005-06-23 Tokuyama Corp 球状窒化アルミニウムおよび、その製法
JP4481019B2 (ja) 2004-01-21 2010-06-16 電気化学工業株式会社 混合粉末及びその用途
JP6075261B2 (ja) * 2013-10-02 2017-02-08 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
WO2020133374A1 (en) * 2018-12-29 2020-07-02 Dow Global Technologies Llc Thermally conductive composition containing mgo filler and methods and devices in which said composition is used
TW202031763A (zh) * 2019-01-25 2020-09-01 日商電化股份有限公司 填料組成物、聚矽氧樹脂組成物、以及散熱零件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0888488A (ja) * 1994-09-20 1996-04-02 Tokai Rubber Ind Ltd 放熱シートおよびその製法
JP2016088838A (ja) * 2014-10-31 2016-05-23 堺化学工業株式会社 酸化マグネシウム粒子、その製造方法、放熱性フィラー、放熱性樹脂組成物、放熱性グリース及び放熱性塗料組成物
WO2018088416A1 (ja) * 2016-11-09 2018-05-17 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物、ならびに製造方法

Also Published As

Publication number Publication date
KR20220024818A (ko) 2022-03-03
WO2020261958A1 (ja) 2020-12-30
CN113993939A (zh) 2022-01-28
EP3988607A1 (en) 2022-04-27
US20220372359A1 (en) 2022-11-24
JP7168084B2 (ja) 2022-11-09
EP3988607A4 (en) 2023-07-26

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