JPWO2020246366A1 - - Google Patents
Info
- Publication number
- JPWO2020246366A1 JPWO2020246366A1 JP2021524803A JP2021524803A JPWO2020246366A1 JP WO2020246366 A1 JPWO2020246366 A1 JP WO2020246366A1 JP 2021524803 A JP2021524803 A JP 2021524803A JP 2021524803 A JP2021524803 A JP 2021524803A JP WO2020246366 A1 JPWO2020246366 A1 JP WO2020246366A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
- G06N3/094—Adversarial learning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20084—Artificial neural networks [ANN]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Quality & Reliability (AREA)
- Artificial Intelligence (AREA)
- Computing Systems (AREA)
- Biophysics (AREA)
- Computational Linguistics (AREA)
- Data Mining & Analysis (AREA)
- Evolutionary Computation (AREA)
- Molecular Biology (AREA)
- Biomedical Technology (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Software Systems (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Analysis (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Image Processing (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022211579A JP7471387B2 (ja) | 2019-06-06 | 2022-12-28 | モデル作成装置、モデル作成方法及びコンピュータプログラム |
| JP2024062566A JP7678183B2 (ja) | 2019-06-06 | 2024-04-09 | 基板検査装置 |
| JP2025076127A JP2025111766A (ja) | 2019-06-06 | 2025-05-01 | 基板検査装置 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019106292 | 2019-06-06 | ||
| JP2019106292 | 2019-06-06 | ||
| JP2020074213 | 2020-04-17 | ||
| JP2020074213 | 2020-04-17 | ||
| PCT/JP2020/021160 WO2020246366A1 (ja) | 2019-06-06 | 2020-05-28 | 基板検査装置、基板検査システム及び基板検査方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022211579A Division JP7471387B2 (ja) | 2019-06-06 | 2022-12-28 | モデル作成装置、モデル作成方法及びコンピュータプログラム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020246366A1 true JPWO2020246366A1 (https=) | 2020-12-10 |
| JPWO2020246366A5 JPWO2020246366A5 (https=) | 2022-02-21 |
| JP7204911B2 JP7204911B2 (ja) | 2023-01-16 |
Family
ID=73652946
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021524803A Active JP7204911B2 (ja) | 2019-06-06 | 2020-05-28 | 基板検査装置、基板検査システム及び基板検査方法 |
| JP2022211579A Active JP7471387B2 (ja) | 2019-06-06 | 2022-12-28 | モデル作成装置、モデル作成方法及びコンピュータプログラム |
| JP2024062566A Active JP7678183B2 (ja) | 2019-06-06 | 2024-04-09 | 基板検査装置 |
| JP2025076127A Pending JP2025111766A (ja) | 2019-06-06 | 2025-05-01 | 基板検査装置 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022211579A Active JP7471387B2 (ja) | 2019-06-06 | 2022-12-28 | モデル作成装置、モデル作成方法及びコンピュータプログラム |
| JP2024062566A Active JP7678183B2 (ja) | 2019-06-06 | 2024-04-09 | 基板検査装置 |
| JP2025076127A Pending JP2025111766A (ja) | 2019-06-06 | 2025-05-01 | 基板検査装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12243213B2 (https=) |
| JP (4) | JP7204911B2 (https=) |
| KR (1) | KR20220019717A (https=) |
| CN (2) | CN113994255B (https=) |
| TW (3) | TWI845690B (https=) |
| WO (1) | WO2020246366A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12106468B2 (en) * | 2019-10-02 | 2024-10-01 | Prospection Solutions, LLC | Foreign material inspection system |
| JP7431694B2 (ja) * | 2020-07-28 | 2024-02-15 | キヤノン株式会社 | 情報処理装置、膜形成装置、物品の製造方法、およびプログラム |
| JP2022189284A (ja) | 2021-06-11 | 2022-12-22 | 東京エレクトロン株式会社 | 基板検査装置、基板検査方法及び記憶媒体 |
| US20220404716A1 (en) * | 2021-06-17 | 2022-12-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Inspection tool for a semiconductor processing tool and methods of use |
| KR20240117592A (ko) * | 2021-12-10 | 2024-08-01 | 도쿄엘렉트론가부시키가이샤 | 기판 검사 방법, 기판 검사 프로그램 및 기판 검사 장치 |
| US20250045906A1 (en) * | 2021-12-21 | 2025-02-06 | Tokyo Electron Limited | Information processing method, information processing apparatus, and storage medium |
| US12386340B2 (en) * | 2022-02-25 | 2025-08-12 | Globalwafers Co., Ltd. | Systems and methods for generating post-polishing topography for enhanced wafer manufacturing |
| US20240230755A9 (en) * | 2022-10-20 | 2024-07-11 | Mediatek Inc. | Outlier Integrated Circuit Detection Method and Outlier Integrated Circuit Detection System by Using Machine Learning Frameworks |
| JP2024110453A (ja) * | 2023-02-03 | 2024-08-16 | 株式会社Ｓｃｒｅｅｎホールディングス | 検査装置および検査方法 |
| WO2025041661A1 (ja) * | 2023-08-23 | 2025-02-27 | 東京エレクトロン株式会社 | 基板検査装置、基板検査方法、及び記憶媒体 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018056575A (ja) * | 2017-11-13 | 2018-04-05 | 東京エレクトロン株式会社 | 基板処理システム |
| WO2018211891A1 (ja) * | 2017-05-18 | 2018-11-22 | 住友電気工業株式会社 | 異変検出装置及び異変検出方法 |
| JPWO2020050072A1 (ja) * | 2018-09-03 | 2021-08-26 | 株式会社Preferred Networks | 推論方法、推論装置、モデルの生成方法及び学習装置 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08136466A (ja) * | 1994-11-10 | 1996-05-31 | Dainippon Screen Mfg Co Ltd | 画像パターン検査装置 |
| US7860675B2 (en) * | 2004-11-05 | 2010-12-28 | Nec Corporation | Pattern inspection apparatus, pattern inspection method, and pattern inspection program |
| JP2008002935A (ja) * | 2006-06-22 | 2008-01-10 | Tokyo Seimitsu Co Ltd | 外観検査方法及び外観検査装置 |
| JP4448181B2 (ja) | 2008-03-18 | 2010-04-07 | アドバンスド・マスク・インスペクション・テクノロジー株式会社 | パターン検査方法、パターン検査装置及びプログラム |
| NL2003716A (en) * | 2008-11-24 | 2010-05-26 | Brion Tech Inc | Harmonic resist model for use in a lithographic apparatus and a device manufacturing method. |
| JP6004956B2 (ja) * | 2013-01-29 | 2016-10-12 | 株式会社日立ハイテクノロジーズ | パターン評価装置、及び、パターン評価装置を備えた外観検査装置 |
| KR101939288B1 (ko) * | 2014-02-12 | 2019-01-16 | 에이에스엠엘 네델란즈 비.브이. | 프로세스 윈도우를 최적화하는 방법 |
| JP6251647B2 (ja) | 2014-07-15 | 2017-12-20 | 株式会社ニューフレアテクノロジー | マスク検査装置及びマスク検査方法 |
| US10514614B2 (en) * | 2015-02-13 | 2019-12-24 | Asml Netherlands B.V. | Process variability aware adaptive inspection and metrology |
| JP6244329B2 (ja) | 2015-05-12 | 2017-12-06 | 東京エレクトロン株式会社 | 基板の検査方法、基板処理システム及びコンピュータ記憶媒体 |
| US9915625B2 (en) * | 2016-01-04 | 2018-03-13 | Kla-Tencor Corp. | Optical die to database inspection |
| US10043261B2 (en) * | 2016-01-11 | 2018-08-07 | Kla-Tencor Corp. | Generating simulated output for a specimen |
| US10395356B2 (en) * | 2016-05-25 | 2019-08-27 | Kla-Tencor Corp. | Generating simulated images from input images for semiconductor applications |
| US10395362B2 (en) * | 2017-04-07 | 2019-08-27 | Kla-Tencor Corp. | Contour based defect detection |
| JP7002949B2 (ja) * | 2018-01-22 | 2022-01-20 | 株式会社日立ハイテク | 画像評価方法及び画像評価装置 |
| CN109543720B (zh) * | 2018-10-30 | 2023-10-27 | 东华大学 | 一种基于对抗生成网络的晶圆图缺陷模式识别方法 |
-
2020
- 2020-05-26 TW TW109117460A patent/TWI845690B/zh active
- 2020-05-26 TW TW113118287A patent/TWI882806B/zh active
- 2020-05-26 TW TW114113354A patent/TW202530685A/zh unknown
- 2020-05-28 JP JP2021524803A patent/JP7204911B2/ja active Active
- 2020-05-28 CN CN202080039553.1A patent/CN113994255B/zh active Active
- 2020-05-28 US US17/615,442 patent/US12243213B2/en active Active
- 2020-05-28 KR KR1020217042666A patent/KR20220019717A/ko active Pending
- 2020-05-28 WO PCT/JP2020/021160 patent/WO2020246366A1/ja not_active Ceased
- 2020-05-28 CN CN202511182224.3A patent/CN121008443A/zh active Pending
-
2022
- 2022-12-28 JP JP2022211579A patent/JP7471387B2/ja active Active
-
2024
- 2024-04-09 JP JP2024062566A patent/JP7678183B2/ja active Active
- 2024-10-23 US US18/924,338 patent/US20250045903A1/en active Pending
-
2025
- 2025-05-01 JP JP2025076127A patent/JP2025111766A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018211891A1 (ja) * | 2017-05-18 | 2018-11-22 | 住友電気工業株式会社 | 異変検出装置及び異変検出方法 |
| JP2018056575A (ja) * | 2017-11-13 | 2018-04-05 | 東京エレクトロン株式会社 | 基板処理システム |
| JPWO2020050072A1 (ja) * | 2018-09-03 | 2021-08-26 | 株式会社Preferred Networks | 推論方法、推論装置、モデルの生成方法及び学習装置 |
Non-Patent Citations (1)
| Title |
|---|
| 篠崎 隆志: "深層学習周辺の最新動向", 人工知能 第３３巻 第２号, JPN6020029937, 1 March 2018 (2018-03-01), JP, pages 181 - 188, ISSN: 0004939215 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20250045903A1 (en) | 2025-02-06 |
| JP2024096135A (ja) | 2024-07-12 |
| JP7471387B2 (ja) | 2024-04-19 |
| TW202530685A (zh) | 2025-08-01 |
| US12243213B2 (en) | 2025-03-04 |
| TWI845690B (zh) | 2024-06-21 |
| TW202115390A (zh) | 2021-04-16 |
| JP7678183B2 (ja) | 2025-05-15 |
| TW202434878A (zh) | 2024-09-01 |
| CN113994255A (zh) | 2022-01-28 |
| JP7204911B2 (ja) | 2023-01-16 |
| CN121008443A (zh) | 2025-11-25 |
| JP2025111766A (ja) | 2025-07-30 |
| US20220237770A1 (en) | 2022-07-28 |
| JP2023052161A (ja) | 2023-04-11 |
| KR20220019717A (ko) | 2022-02-17 |
| WO2020246366A1 (ja) | 2020-12-10 |
| TWI882806B (zh) | 2025-05-01 |
| CN113994255B (zh) | 2025-09-09 |
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