JP7204911B2 - 基板検査装置、基板検査システム及び基板検査方法 - Google Patents

基板検査装置、基板検査システム及び基板検査方法 Download PDF

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JP7204911B2
JP7204911B2 JP2021524803A JP2021524803A JP7204911B2 JP 7204911 B2 JP7204911 B2 JP 7204911B2 JP 2021524803 A JP2021524803 A JP 2021524803A JP 2021524803 A JP2021524803 A JP 2021524803A JP 7204911 B2 JP7204911 B2 JP 7204911B2
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substrate
image
captured image
processing
inspected
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JPWO2020246366A1 (https=
JPWO2020246366A5 (https=
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修児 岩永
直 西山
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/094—Adversarial learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Artificial Intelligence (AREA)
  • Computing Systems (AREA)
  • Biophysics (AREA)
  • Computational Linguistics (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Molecular Biology (AREA)
  • Biomedical Technology (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Image Processing (AREA)
JP2021524803A 2019-06-06 2020-05-28 基板検査装置、基板検査システム及び基板検査方法 Active JP7204911B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022211579A JP7471387B2 (ja) 2019-06-06 2022-12-28 モデル作成装置、モデル作成方法及びコンピュータプログラム
JP2024062566A JP7678183B2 (ja) 2019-06-06 2024-04-09 基板検査装置
JP2025076127A JP2025111766A (ja) 2019-06-06 2025-05-01 基板検査装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019106292 2019-06-06
JP2019106292 2019-06-06
JP2020074213 2020-04-17
JP2020074213 2020-04-17
PCT/JP2020/021160 WO2020246366A1 (ja) 2019-06-06 2020-05-28 基板検査装置、基板検査システム及び基板検査方法

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JPWO2020246366A1 JPWO2020246366A1 (https=) 2020-12-10
JPWO2020246366A5 JPWO2020246366A5 (https=) 2022-02-21
JP7204911B2 true JP7204911B2 (ja) 2023-01-16

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JP2021524803A Active JP7204911B2 (ja) 2019-06-06 2020-05-28 基板検査装置、基板検査システム及び基板検査方法
JP2022211579A Active JP7471387B2 (ja) 2019-06-06 2022-12-28 モデル作成装置、モデル作成方法及びコンピュータプログラム
JP2024062566A Active JP7678183B2 (ja) 2019-06-06 2024-04-09 基板検査装置
JP2025076127A Pending JP2025111766A (ja) 2019-06-06 2025-05-01 基板検査装置

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JP2022211579A Active JP7471387B2 (ja) 2019-06-06 2022-12-28 モデル作成装置、モデル作成方法及びコンピュータプログラム
JP2024062566A Active JP7678183B2 (ja) 2019-06-06 2024-04-09 基板検査装置
JP2025076127A Pending JP2025111766A (ja) 2019-06-06 2025-05-01 基板検査装置

Country Status (6)

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US (2) US12243213B2 (https=)
JP (4) JP7204911B2 (https=)
KR (1) KR20220019717A (https=)
CN (2) CN113994255B (https=)
TW (3) TWI845690B (https=)
WO (1) WO2020246366A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12106468B2 (en) * 2019-10-02 2024-10-01 Prospection Solutions, LLC Foreign material inspection system
JP7431694B2 (ja) * 2020-07-28 2024-02-15 キヤノン株式会社 情報処理装置、膜形成装置、物品の製造方法、およびプログラム
JP2022189284A (ja) 2021-06-11 2022-12-22 東京エレクトロン株式会社 基板検査装置、基板検査方法及び記憶媒体
US20220404716A1 (en) * 2021-06-17 2022-12-22 Taiwan Semiconductor Manufacturing Company, Ltd. Inspection tool for a semiconductor processing tool and methods of use
KR20240117592A (ko) * 2021-12-10 2024-08-01 도쿄엘렉트론가부시키가이샤 기판 검사 방법, 기판 검사 프로그램 및 기판 검사 장치
US20250045906A1 (en) * 2021-12-21 2025-02-06 Tokyo Electron Limited Information processing method, information processing apparatus, and storage medium
US12386340B2 (en) * 2022-02-25 2025-08-12 Globalwafers Co., Ltd. Systems and methods for generating post-polishing topography for enhanced wafer manufacturing
US20240230755A9 (en) * 2022-10-20 2024-07-11 Mediatek Inc. Outlier Integrated Circuit Detection Method and Outlier Integrated Circuit Detection System by Using Machine Learning Frameworks
JP2024110453A (ja) * 2023-02-03 2024-08-16 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法
WO2025041661A1 (ja) * 2023-08-23 2025-02-27 東京エレクトロン株式会社 基板検査装置、基板検査方法、及び記憶媒体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018211891A1 (ja) 2017-05-18 2018-11-22 住友電気工業株式会社 異変検出装置及び異変検出方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08136466A (ja) * 1994-11-10 1996-05-31 Dainippon Screen Mfg Co Ltd 画像パターン検査装置
US7860675B2 (en) * 2004-11-05 2010-12-28 Nec Corporation Pattern inspection apparatus, pattern inspection method, and pattern inspection program
JP2008002935A (ja) * 2006-06-22 2008-01-10 Tokyo Seimitsu Co Ltd 外観検査方法及び外観検査装置
JP4448181B2 (ja) 2008-03-18 2010-04-07 アドバンスド・マスク・インスペクション・テクノロジー株式会社 パターン検査方法、パターン検査装置及びプログラム
NL2003716A (en) * 2008-11-24 2010-05-26 Brion Tech Inc Harmonic resist model for use in a lithographic apparatus and a device manufacturing method.
JP6004956B2 (ja) * 2013-01-29 2016-10-12 株式会社日立ハイテクノロジーズ パターン評価装置、及び、パターン評価装置を備えた外観検査装置
KR101939288B1 (ko) * 2014-02-12 2019-01-16 에이에스엠엘 네델란즈 비.브이. 프로세스 윈도우를 최적화하는 방법
JP6251647B2 (ja) 2014-07-15 2017-12-20 株式会社ニューフレアテクノロジー マスク検査装置及びマスク検査方法
US10514614B2 (en) * 2015-02-13 2019-12-24 Asml Netherlands B.V. Process variability aware adaptive inspection and metrology
JP6244329B2 (ja) 2015-05-12 2017-12-06 東京エレクトロン株式会社 基板の検査方法、基板処理システム及びコンピュータ記憶媒体
US9915625B2 (en) * 2016-01-04 2018-03-13 Kla-Tencor Corp. Optical die to database inspection
US10043261B2 (en) * 2016-01-11 2018-08-07 Kla-Tencor Corp. Generating simulated output for a specimen
US10395356B2 (en) * 2016-05-25 2019-08-27 Kla-Tencor Corp. Generating simulated images from input images for semiconductor applications
US10395362B2 (en) * 2017-04-07 2019-08-27 Kla-Tencor Corp. Contour based defect detection
JP6423064B2 (ja) * 2017-11-13 2018-11-14 東京エレクトロン株式会社 基板処理システム
JP7002949B2 (ja) * 2018-01-22 2022-01-20 株式会社日立ハイテク 画像評価方法及び画像評価装置
KR102541743B1 (ko) * 2018-09-03 2023-06-13 가부시키가이샤 프리퍼드 네트웍스 학습 장치, 추론 장치 및 학습 완료 모델
CN109543720B (zh) * 2018-10-30 2023-10-27 东华大学 一种基于对抗生成网络的晶圆图缺陷模式识别方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018211891A1 (ja) 2017-05-18 2018-11-22 住友電気工業株式会社 異変検出装置及び異変検出方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
篠崎 隆志，深層学習周辺の最新動向，人工知能 第３３巻 第２号，日本，一般社団法人人工知能学会 JSAI(The Japanese Societ，2018年03月01日，181-188

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US20250045903A1 (en) 2025-02-06
JP2024096135A (ja) 2024-07-12
JP7471387B2 (ja) 2024-04-19
TW202530685A (zh) 2025-08-01
US12243213B2 (en) 2025-03-04
TWI845690B (zh) 2024-06-21
TW202115390A (zh) 2021-04-16
JP7678183B2 (ja) 2025-05-15
JPWO2020246366A1 (https=) 2020-12-10
TW202434878A (zh) 2024-09-01
CN113994255A (zh) 2022-01-28
CN121008443A (zh) 2025-11-25
JP2025111766A (ja) 2025-07-30
US20220237770A1 (en) 2022-07-28
JP2023052161A (ja) 2023-04-11
KR20220019717A (ko) 2022-02-17
WO2020246366A1 (ja) 2020-12-10
TWI882806B (zh) 2025-05-01
CN113994255B (zh) 2025-09-09

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