CN113994255B - 基片检查装置、基片检查系统和基片检查方法 - Google Patents

基片检查装置、基片检查系统和基片检查方法

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Publication number
CN113994255B
CN113994255B CN202080039553.1A CN202080039553A CN113994255B CN 113994255 B CN113994255 B CN 113994255B CN 202080039553 A CN202080039553 A CN 202080039553A CN 113994255 B CN113994255 B CN 113994255B
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CN
China
Prior art keywords
image
substrate
captured image
wafer
processing
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CN202080039553.1A
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English (en)
Chinese (zh)
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CN113994255A (zh
Inventor
岩永修儿
西山直
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to CN202511182224.3A priority Critical patent/CN121008443A/zh
Publication of CN113994255A publication Critical patent/CN113994255A/zh
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/094—Adversarial learning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Artificial Intelligence (AREA)
  • Computing Systems (AREA)
  • Biophysics (AREA)
  • Computational Linguistics (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Molecular Biology (AREA)
  • Biomedical Technology (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Image Processing (AREA)
CN202080039553.1A 2019-06-06 2020-05-28 基片检查装置、基片检查系统和基片检查方法 Active CN113994255B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202511182224.3A CN121008443A (zh) 2019-06-06 2020-05-28 基片检查装置、基片检查系统和基片检查方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019-106292 2019-06-06
JP2019106292 2019-06-06
JP2020-074213 2020-04-17
JP2020074213 2020-04-17
PCT/JP2020/021160 WO2020246366A1 (ja) 2019-06-06 2020-05-28 基板検査装置、基板検査システム及び基板検査方法

Related Child Applications (1)

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CN113994255B true CN113994255B (zh) 2025-09-09

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Country Link
US (2) US12243213B2 (https=)
JP (4) JP7204911B2 (https=)
KR (1) KR20220019717A (https=)
CN (2) CN113994255B (https=)
TW (3) TWI845690B (https=)
WO (1) WO2020246366A1 (https=)

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US12106468B2 (en) * 2019-10-02 2024-10-01 Prospection Solutions, LLC Foreign material inspection system
JP7431694B2 (ja) * 2020-07-28 2024-02-15 キヤノン株式会社 情報処理装置、膜形成装置、物品の製造方法、およびプログラム
JP2022189284A (ja) 2021-06-11 2022-12-22 東京エレクトロン株式会社 基板検査装置、基板検査方法及び記憶媒体
US20220404716A1 (en) * 2021-06-17 2022-12-22 Taiwan Semiconductor Manufacturing Company, Ltd. Inspection tool for a semiconductor processing tool and methods of use
KR20240117592A (ko) * 2021-12-10 2024-08-01 도쿄엘렉트론가부시키가이샤 기판 검사 방법, 기판 검사 프로그램 및 기판 검사 장치
US20250045906A1 (en) * 2021-12-21 2025-02-06 Tokyo Electron Limited Information processing method, information processing apparatus, and storage medium
US12386340B2 (en) * 2022-02-25 2025-08-12 Globalwafers Co., Ltd. Systems and methods for generating post-polishing topography for enhanced wafer manufacturing
US20240230755A9 (en) * 2022-10-20 2024-07-11 Mediatek Inc. Outlier Integrated Circuit Detection Method and Outlier Integrated Circuit Detection System by Using Machine Learning Frameworks
JP2024110453A (ja) * 2023-02-03 2024-08-16 株式会社Ｓｃｒｅｅｎホールディングス 検査装置および検査方法
WO2025041661A1 (ja) * 2023-08-23 2025-02-27 東京エレクトロン株式会社 基板検査装置、基板検査方法、及び記憶媒体

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Also Published As

Publication number Publication date
US20250045903A1 (en) 2025-02-06
JP2024096135A (ja) 2024-07-12
JP7471387B2 (ja) 2024-04-19
TW202530685A (zh) 2025-08-01
US12243213B2 (en) 2025-03-04
TWI845690B (zh) 2024-06-21
TW202115390A (zh) 2021-04-16
JP7678183B2 (ja) 2025-05-15
JPWO2020246366A1 (https=) 2020-12-10
TW202434878A (zh) 2024-09-01
CN113994255A (zh) 2022-01-28
JP7204911B2 (ja) 2023-01-16
CN121008443A (zh) 2025-11-25
JP2025111766A (ja) 2025-07-30
US20220237770A1 (en) 2022-07-28
JP2023052161A (ja) 2023-04-11
KR20220019717A (ko) 2022-02-17
WO2020246366A1 (ja) 2020-12-10
TWI882806B (zh) 2025-05-01

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