JPWO2020241790A1 - - Google Patents

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Publication number
JPWO2020241790A1
JPWO2020241790A1 JP2021522885A JP2021522885A JPWO2020241790A1 JP WO2020241790 A1 JPWO2020241790 A1 JP WO2020241790A1 JP 2021522885 A JP2021522885 A JP 2021522885A JP 2021522885 A JP2021522885 A JP 2021522885A JP WO2020241790 A1 JPWO2020241790 A1 JP WO2020241790A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021522885A
Other versions
JP7283538B2 (ja
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Publication of JPWO2020241790A1 publication Critical patent/JPWO2020241790A1/ja
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Publication of JP7283538B2 publication Critical patent/JP7283538B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils
    • H03H9/13Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/132Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Electrophonic Musical Instruments (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
JP2021522885A 2019-05-31 2020-05-28 圧電振動板および圧電振動デバイス Active JP7283538B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2019102950 2019-05-31
JP2019102951 2019-05-31
JP2019102951 2019-05-31
JP2019102950 2019-05-31
JP2019115542 2019-06-21
JP2019115542 2019-06-21
PCT/JP2020/021219 WO2020241790A1 (ja) 2019-05-31 2020-05-28 圧電振動板および圧電振動デバイス

Publications (2)

Publication Number Publication Date
JPWO2020241790A1 true JPWO2020241790A1 (ja) 2020-12-03
JP7283538B2 JP7283538B2 (ja) 2023-05-30

Family

ID=73551911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021522885A Active JP7283538B2 (ja) 2019-05-31 2020-05-28 圧電振動板および圧電振動デバイス

Country Status (5)

Country Link
US (1) US20220294418A1 (ja)
JP (1) JP7283538B2 (ja)
CN (1) CN113812088A (ja)
TW (1) TWI784278B (ja)
WO (1) WO2020241790A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009020022A1 (ja) * 2007-08-03 2009-02-12 Daishinku Corporation 圧電振動子
JP2011160094A (ja) * 2010-01-29 2011-08-18 Daishinku Corp 圧電振動片
JP2017153033A (ja) * 2016-02-26 2017-08-31 株式会社大真空 水晶振動板、及び水晶振動デバイス
JP2018032944A (ja) * 2016-08-23 2018-03-01 株式会社大真空 水晶振動板、及び水晶振動デバイス
WO2018042994A1 (ja) * 2016-08-30 2018-03-08 株式会社大真空 水晶振動板、及び水晶振動デバイス
JP2019009716A (ja) * 2017-06-28 2019-01-17 株式会社大真空 水晶振動板および水晶振動デバイス

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS514867B2 (ja) * 1971-07-28 1976-02-16
JP5370371B2 (ja) * 2008-12-24 2013-12-18 株式会社大真空 圧電振動デバイスの製造方法、および圧電振動デバイスを構成する構成部材のエッチング方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009020022A1 (ja) * 2007-08-03 2009-02-12 Daishinku Corporation 圧電振動子
JP5104867B2 (ja) * 2007-08-03 2012-12-19 株式会社大真空 圧電振動子
JP2011160094A (ja) * 2010-01-29 2011-08-18 Daishinku Corp 圧電振動片
JP2017153033A (ja) * 2016-02-26 2017-08-31 株式会社大真空 水晶振動板、及び水晶振動デバイス
JP2018032944A (ja) * 2016-08-23 2018-03-01 株式会社大真空 水晶振動板、及び水晶振動デバイス
WO2018042994A1 (ja) * 2016-08-30 2018-03-08 株式会社大真空 水晶振動板、及び水晶振動デバイス
JP2019009716A (ja) * 2017-06-28 2019-01-17 株式会社大真空 水晶振動板および水晶振動デバイス

Also Published As

Publication number Publication date
TW202103444A (zh) 2021-01-16
WO2020241790A1 (ja) 2020-12-03
US20220294418A1 (en) 2022-09-15
CN113812088A (zh) 2021-12-17
JP7283538B2 (ja) 2023-05-30
TWI784278B (zh) 2022-11-21

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