JPWO2020240725A1 - - Google Patents

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Publication number
JPWO2020240725A1
JPWO2020240725A1 JP2021521646A JP2021521646A JPWO2020240725A1 JP WO2020240725 A1 JPWO2020240725 A1 JP WO2020240725A1 JP 2021521646 A JP2021521646 A JP 2021521646A JP 2021521646 A JP2021521646 A JP 2021521646A JP WO2020240725 A1 JPWO2020240725 A1 JP WO2020240725A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021521646A
Other languages
Japanese (ja)
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JP7147972B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2020240725A1 publication Critical patent/JPWO2020240725A1/ja
Application granted granted Critical
Publication of JP7147972B2 publication Critical patent/JP7147972B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/80Heterojunction BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503Nitride Group III-V materials, e.g. AlN or GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/01Manufacture or treatment
    • H10D10/021Manufacture or treatment of heterojunction BJTs [HBT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/80Heterojunction BJTs
    • H10D10/821Vertical heterojunction BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/133Emitter regions of BJTs
    • H10D62/136Emitter regions of BJTs of heterojunction BJTs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/137Collector regions of BJTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3416Nitrides

Landscapes

  • Bipolar Transistors (AREA)
JP2021521646A 2019-05-29 2019-05-29 ヘテロ接合バイポーラトランジスタおよびその作製方法 Active JP7147972B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/021213 WO2020240725A1 (ja) 2019-05-29 2019-05-29 ヘテロ接合バイポーラトランジスタおよびその作製方法

Publications (2)

Publication Number Publication Date
JPWO2020240725A1 true JPWO2020240725A1 (https=) 2020-12-03
JP7147972B2 JP7147972B2 (ja) 2022-10-05

Family

ID=73553593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021521646A Active JP7147972B2 (ja) 2019-05-29 2019-05-29 ヘテロ接合バイポーラトランジスタおよびその作製方法

Country Status (3)

Country Link
US (1) US12142672B2 (https=)
JP (1) JP7147972B2 (https=)
WO (1) WO2020240725A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020004051B4 (de) * 2020-07-06 2022-04-07 Azur Space Solar Power Gmbh Vertikaler hochsperrender III-V Bipolartransistor
JP7677448B2 (ja) * 2021-11-16 2025-05-15 日本電信電話株式会社 バイポーラトランジスタ
CN116313786B (zh) * 2021-12-21 2026-03-17 西安唐晶量子科技有限公司 一种界面极性偏转的InGaP/GaAs异质结双极型晶体管及其制备方法
JP7632774B1 (ja) * 2024-06-24 2025-02-19 三菱電機株式会社 半導体装置の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015618A1 (ja) * 2003-08-12 2005-02-17 Nippon Telegraph And Telephone Corporation 窒化物半導体成長用基板
JP2008016615A (ja) * 2006-07-05 2008-01-24 Matsushita Electric Ind Co Ltd バイポーラトランジスタ
JP2013191655A (ja) * 2012-03-13 2013-09-26 Nippon Telegr & Teleph Corp <Ntt> ヘテロ接合バイポーラトランジスタおよびその製造方法
JP2015211182A (ja) * 2014-04-30 2015-11-24 日本電信電話株式会社 ヘテロ接合バイポーラトランジスタおよびその製造方法
JP2017139338A (ja) * 2016-02-04 2017-08-10 株式会社パウデック ヘテロ接合バイポーラトランジスタおよび電気機器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005079417A (ja) * 2003-09-02 2005-03-24 Matsushita Electric Ind Co Ltd 半導体装置及びヘテロ接合バイポーラトランジスタ
JP5628681B2 (ja) * 2008-10-21 2014-11-19 ルネサスエレクトロニクス株式会社 バイポーラトランジスタ
CN105378904B (zh) * 2013-07-10 2017-09-05 株式会社村田制作所 半导体装置
JP2018010896A (ja) * 2016-07-11 2018-01-18 株式会社村田製作所 ヘテロ接合バイポーラトランジスタ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015618A1 (ja) * 2003-08-12 2005-02-17 Nippon Telegraph And Telephone Corporation 窒化物半導体成長用基板
JP2008016615A (ja) * 2006-07-05 2008-01-24 Matsushita Electric Ind Co Ltd バイポーラトランジスタ
JP2013191655A (ja) * 2012-03-13 2013-09-26 Nippon Telegr & Teleph Corp <Ntt> ヘテロ接合バイポーラトランジスタおよびその製造方法
JP2015211182A (ja) * 2014-04-30 2015-11-24 日本電信電話株式会社 ヘテロ接合バイポーラトランジスタおよびその製造方法
JP2017139338A (ja) * 2016-02-04 2017-08-10 株式会社パウデック ヘテロ接合バイポーラトランジスタおよび電気機器

Also Published As

Publication number Publication date
WO2020240725A1 (ja) 2020-12-03
JP7147972B2 (ja) 2022-10-05
US20220208998A1 (en) 2022-06-30
US12142672B2 (en) 2024-11-12

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