JPWO2020234987A1 - - Google Patents

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Publication number
JPWO2020234987A1
JPWO2020234987A1 JP2021519929A JP2021519929A JPWO2020234987A1 JP WO2020234987 A1 JPWO2020234987 A1 JP WO2020234987A1 JP 2021519929 A JP2021519929 A JP 2021519929A JP 2021519929 A JP2021519929 A JP 2021519929A JP WO2020234987 A1 JPWO2020234987 A1 JP WO2020234987A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021519929A
Other languages
Japanese (ja)
Other versions
JP7108788B2 (ja
JPWO2020234987A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020234987A1 publication Critical patent/JPWO2020234987A1/ja
Publication of JPWO2020234987A5 publication Critical patent/JPWO2020234987A5/ja
Application granted granted Critical
Publication of JP7108788B2 publication Critical patent/JP7108788B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical, image processing or photographic arrangements associated with the tube
    • H01J37/226Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
    • H01J37/228Optical arrangements for illuminating the object; optical arrangements for collecting light from the object whereby illumination or light collection take place in the same area of the discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical, image processing or photographic arrangements associated with the tube
    • H01J37/222Image processing arrangements associated with the tube
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/05Electron or ion-optical arrangements for separating electrons or ions according to their energy or mass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/22Optical, image processing or photographic arrangements associated with the tube
    • H01J37/226Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/244Detectors; Associated components or circuits therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/248Components associated with the control of the tube
    • H01J2237/2482Optical means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
JP2021519929A 2019-05-21 2019-05-21 荷電粒子線装置 Active JP7108788B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/020065 WO2020234987A1 (ja) 2019-05-21 2019-05-21 荷電粒子線装置

Publications (3)

Publication Number Publication Date
JPWO2020234987A1 true JPWO2020234987A1 (https=) 2020-11-26
JPWO2020234987A5 JPWO2020234987A5 (https=) 2022-01-18
JP7108788B2 JP7108788B2 (ja) 2022-07-28

Family

ID=73459313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021519929A Active JP7108788B2 (ja) 2019-05-21 2019-05-21 荷電粒子線装置

Country Status (6)

Country Link
US (2) US20220216032A1 (https=)
JP (1) JP7108788B2 (https=)
KR (1) KR102640025B1 (https=)
DE (1) DE112019007206B4 (https=)
TW (1) TWI748404B (https=)
WO (1) WO2020234987A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023145015A1 (ja) * 2022-01-28 2023-08-03 株式会社日立ハイテク 検査装置および膜質検査方法
WO2024069737A1 (ja) * 2022-09-27 2024-04-04 株式会社日立ハイテク 検査方法および荷電粒子線装置
KR20250090336A (ko) * 2022-12-20 2025-06-19 주식회사 히타치하이테크 시료의 특징량 도출 방법, 신호 처리 시스템을 조정하는 조정 방법 및 계측 시스템
JP2024173322A (ja) * 2023-06-02 2024-12-12 国立研究開発法人産業技術総合研究所 観察装置及び観察方法
WO2025069195A1 (ja) * 2023-09-26 2025-04-03 株式会社日立ハイテク 荷電粒子ビーム装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003151483A (ja) * 2001-11-19 2003-05-23 Hitachi Ltd 荷電粒子線を用いた回路パターン用基板検査装置および基板検査方法
JP2006352026A (ja) * 2005-06-20 2006-12-28 Sony Corp 半導体レーザ装置及び半導体レーザ装置の製造方法
JP2012009247A (ja) * 2010-06-24 2012-01-12 Topcon Corp 電子顕微鏡装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3805565B2 (ja) * 1999-06-11 2006-08-02 株式会社日立製作所 電子線画像に基づく検査または計測方法およびその装置
JP2007531876A (ja) * 2004-04-02 2007-11-08 カリフォルニア インスティテュート オブ テクノロジー 超高速光電子顕微鏡のための方法およびシステム
DE102007041496B3 (de) 2007-08-31 2009-02-26 Johnson Controls Gmbh Kopfstütze für ein Fahrzeug
JP5744629B2 (ja) * 2011-06-03 2015-07-08 株式会社日立ハイテクノロジーズ 電子顕微鏡及び電子線を用いた撮像方法
JP6289339B2 (ja) * 2014-10-28 2018-03-07 株式会社日立ハイテクノロジーズ 荷電粒子線装置及び情報処理装置
WO2016143450A1 (ja) * 2015-03-10 2016-09-15 株式会社荏原製作所 検査装置
CN108603851B (zh) * 2016-03-16 2021-01-01 株式会社日立高新技术 缺陷检查装置
JP6957641B2 (ja) * 2017-11-27 2021-11-02 株式会社日立ハイテク 荷電粒子線装置およびそれを用いた試料観察方法
US11393657B2 (en) * 2018-09-11 2022-07-19 Hitachi High-Tech Corporation Electron beam device
JP7105368B2 (ja) * 2019-03-27 2022-07-22 株式会社日立ハイテク 荷電粒子線装置
JP7189103B2 (ja) * 2019-08-30 2022-12-13 株式会社日立ハイテク 荷電粒子線装置
JP7148467B2 (ja) * 2019-08-30 2022-10-05 株式会社日立ハイテク 荷電粒子線装置
US12609274B2 (en) * 2020-09-28 2026-04-21 Hitachi High-Tech Corporation Charged particle beam device
US12196802B2 (en) * 2020-09-29 2025-01-14 Hitachi High-Tech Corporation Semiconductor inspection device and method for inspecting semiconductor sample

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003151483A (ja) * 2001-11-19 2003-05-23 Hitachi Ltd 荷電粒子線を用いた回路パターン用基板検査装置および基板検査方法
JP2006352026A (ja) * 2005-06-20 2006-12-28 Sony Corp 半導体レーザ装置及び半導体レーザ装置の製造方法
JP2012009247A (ja) * 2010-06-24 2012-01-12 Topcon Corp 電子顕微鏡装置

Also Published As

Publication number Publication date
TW202044311A (zh) 2020-12-01
KR102640025B1 (ko) 2024-02-27
JP7108788B2 (ja) 2022-07-28
DE112019007206B4 (de) 2026-01-22
TWI748404B (zh) 2021-12-01
DE112019007206T5 (de) 2022-01-05
US20240363306A1 (en) 2024-10-31
WO2020234987A1 (ja) 2020-11-26
US20220216032A1 (en) 2022-07-07
KR20210142703A (ko) 2021-11-25

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