JPWO2020226095A1 - - Google Patents

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Publication number
JPWO2020226095A1
JPWO2020226095A1 JP2021518364A JP2021518364A JPWO2020226095A1 JP WO2020226095 A1 JPWO2020226095 A1 JP WO2020226095A1 JP 2021518364 A JP2021518364 A JP 2021518364A JP 2021518364 A JP2021518364 A JP 2021518364A JP WO2020226095 A1 JPWO2020226095 A1 JP WO2020226095A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021518364A
Other versions
JP7152602B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020226095A1 publication Critical patent/JPWO2020226095A1/ja
Priority to JP2022155825A priority Critical patent/JP7491973B2/ja
Application granted granted Critical
Publication of JP7152602B2 publication Critical patent/JP7152602B2/ja
Priority to JP2024079907A priority patent/JP2024096486A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021518364A 2019-05-08 2020-04-27 接合装置、接合システム及び接合方法 Active JP7152602B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022155825A JP7491973B2 (ja) 2019-05-08 2022-09-29 接合装置、接合システム及び接合方法
JP2024079907A JP2024096486A (ja) 2019-05-08 2024-05-16 接合装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019088100 2019-05-08
JP2019088100 2019-05-08
PCT/JP2020/018011 WO2020226095A1 (ja) 2019-05-08 2020-04-27 接合装置、接合システム及び接合方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022155825A Division JP7491973B2 (ja) 2019-05-08 2022-09-29 接合装置、接合システム及び接合方法

Publications (2)

Publication Number Publication Date
JPWO2020226095A1 true JPWO2020226095A1 (ja) 2020-11-12
JP7152602B2 JP7152602B2 (ja) 2022-10-12

Family

ID=73050981

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2021518364A Active JP7152602B2 (ja) 2019-05-08 2020-04-27 接合装置、接合システム及び接合方法
JP2022155825A Active JP7491973B2 (ja) 2019-05-08 2022-09-29 接合装置、接合システム及び接合方法
JP2024079907A Pending JP2024096486A (ja) 2019-05-08 2024-05-16 接合装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022155825A Active JP7491973B2 (ja) 2019-05-08 2022-09-29 接合装置、接合システム及び接合方法
JP2024079907A Pending JP2024096486A (ja) 2019-05-08 2024-05-16 接合装置

Country Status (6)

Country Link
US (1) US20220285196A1 (ja)
EP (1) EP3968359A4 (ja)
JP (3) JP7152602B2 (ja)
KR (1) KR20220006560A (ja)
CN (1) CN113795906A (ja)
WO (1) WO2020226095A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113784814B (zh) * 2019-05-08 2023-08-15 东京毅力科创株式会社 接合装置、接合系统以及接合方法
TW202111721A (zh) * 2019-05-22 2021-03-16 加拿大商弗瑞爾公司 用於傳送設置之對準方法
CN115312438A (zh) * 2022-03-21 2022-11-08 北京芯士联半导体科技有限公司 接合装置的推动销构造
CN117995730B (zh) * 2024-04-07 2024-07-12 芯联集成电路制造股份有限公司 键合装置、键合系统及键合方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004146528A (ja) * 2002-10-23 2004-05-20 Renesas Technology Corp 半導体装置の製造方法
JP2007095738A (ja) * 2005-09-27 2007-04-12 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2011071225A (ja) * 2009-09-24 2011-04-07 Bondtech Inc アライメント装置
JP2012049266A (ja) * 2010-08-25 2012-03-08 Tokyo Electron Ltd 接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP2012089696A (ja) * 2010-10-20 2012-05-10 Adwelds:Kk 接合装置
JP2018056507A (ja) * 2016-09-30 2018-04-05 ボンドテック株式会社 基板接合方法および基板接合装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070110917A1 (en) * 2003-12-02 2007-05-17 Bondtech, Inc Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit
JP3751972B2 (ja) * 2003-12-02 2006-03-08 有限会社ボンドテック 接合方法及びこの方法により作成されるデバイス並びに表面活性化装置及びこの装置を備えた接合装置
US7433038B2 (en) * 2006-04-27 2008-10-07 Asml Netherlands B.V. Alignment of substrates for bonding
JP5343326B2 (ja) * 2007-05-29 2013-11-13 株式会社ニコン 基板接合装置および基板接合方法
JP5353892B2 (ja) * 2008-10-01 2013-11-27 株式会社ニコン アラインメント装置およびアラインメント方法
JP5479253B2 (ja) * 2010-07-16 2014-04-23 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体
JP5843275B2 (ja) * 2011-05-13 2016-01-13 ボンドテック株式会社 アライメント装置およびアライメント方法
JP6045972B2 (ja) * 2013-04-25 2016-12-14 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
JP6037564B2 (ja) * 2013-06-24 2016-12-07 住友化学株式会社 光学表示デバイスの生産システム
JP2015018919A (ja) * 2013-07-10 2015-01-29 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
US20160001543A1 (en) * 2014-07-07 2016-01-07 Tokyo Electron Limited Bonding device, bonding system, and bonding method
JP6345605B2 (ja) 2015-01-16 2018-06-20 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
JP6562828B2 (ja) * 2015-12-11 2019-08-21 東京エレクトロン株式会社 検査装置、接合装置、接合システムおよび検査方法
WO2017155002A1 (ja) 2016-03-11 2017-09-14 ボンドテック株式会社 基板接合方法
CN109643674B (zh) * 2016-08-29 2023-01-10 Ev 集团 E·索尔纳有限责任公司 用于对准衬底的方法和设备
JP2018036235A (ja) * 2016-09-02 2018-03-08 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置、基板処理装置、基板検査方法および基板処理方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004146528A (ja) * 2002-10-23 2004-05-20 Renesas Technology Corp 半導体装置の製造方法
JP2007095738A (ja) * 2005-09-27 2007-04-12 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
JP2011071225A (ja) * 2009-09-24 2011-04-07 Bondtech Inc アライメント装置
JP2012049266A (ja) * 2010-08-25 2012-03-08 Tokyo Electron Ltd 接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP2012089696A (ja) * 2010-10-20 2012-05-10 Adwelds:Kk 接合装置
JP2018056507A (ja) * 2016-09-30 2018-04-05 ボンドテック株式会社 基板接合方法および基板接合装置

Also Published As

Publication number Publication date
KR20220006560A (ko) 2022-01-17
EP3968359A4 (en) 2023-01-25
US20220285196A1 (en) 2022-09-08
JP7152602B2 (ja) 2022-10-12
EP3968359A1 (en) 2022-03-16
JP2024096486A (ja) 2024-07-12
CN113795906A (zh) 2021-12-14
JP7491973B2 (ja) 2024-05-28
JP2022177274A (ja) 2022-11-30
WO2020226095A1 (ja) 2020-11-12

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