JPWO2020209359A1 - - Google Patents

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Publication number
JPWO2020209359A1
JPWO2020209359A1 JP2021513714A JP2021513714A JPWO2020209359A1 JP WO2020209359 A1 JPWO2020209359 A1 JP WO2020209359A1 JP 2021513714 A JP2021513714 A JP 2021513714A JP 2021513714 A JP2021513714 A JP 2021513714A JP WO2020209359 A1 JPWO2020209359 A1 JP WO2020209359A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021513714A
Other versions
JP7176622B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed filed Critical
Publication of JPWO2020209359A1 publication Critical patent/JPWO2020209359A1/ja
Application granted granted Critical
Publication of JP7176622B2 publication Critical patent/JP7176622B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02637—Details concerning reflective or coupling arrays
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2021513714A 2019-04-12 2020-04-10 弾性波装置 Active JP7176622B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019076446 2019-04-12
JP2019076446 2019-04-12
PCT/JP2020/016115 WO2020209359A1 (ja) 2019-04-12 2020-04-10 弾性波装置

Publications (2)

Publication Number Publication Date
JPWO2020209359A1 true JPWO2020209359A1 (ja) 2020-10-15
JP7176622B2 JP7176622B2 (ja) 2022-11-22

Family

ID=72751831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021513714A Active JP7176622B2 (ja) 2019-04-12 2020-04-10 弾性波装置

Country Status (4)

Country Link
US (1) US20220029601A1 (ja)
JP (1) JP7176622B2 (ja)
CN (1) CN113785489B (ja)
WO (1) WO2020209359A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022103405A1 (en) * 2020-11-16 2022-05-19 Qorvo Us, Inc. Piezoelectric layer arrangements in acoustic wave devices and related methods
KR20230091164A (ko) * 2020-12-18 2023-06-22 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치 및 래더형 필터
CN116830455A (zh) * 2021-01-13 2023-09-29 株式会社村田制作所 弹性波装置
US20220311409A1 (en) * 2021-03-29 2022-09-29 RF360 Europe GmbH Site-Selective Piezoelectric-Layer Trimming
JPWO2023013742A1 (ja) * 2021-08-04 2023-02-09

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013544041A (ja) * 2011-03-25 2013-12-09 パナソニック株式会社 高次横モード波を抑制した弾性波デバイス
WO2017086004A1 (ja) * 2015-11-17 2017-05-26 株式会社村田製作所 弾性波装置及びその製造方法
JP2017224890A (ja) * 2016-06-13 2017-12-21 株式会社村田製作所 弾性波装置
WO2018131454A1 (ja) * 2017-01-13 2018-07-19 株式会社村田製作所 弾性波装置
WO2018163860A1 (ja) * 2017-03-06 2018-09-13 株式会社村田製作所 弾性波装置、高周波フロントエンド回路、通信装置及び弾性波装置の製造方法
WO2018198654A1 (ja) * 2017-04-26 2018-11-01 株式会社村田製作所 弾性波装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5713025B2 (ja) * 2010-12-24 2015-05-07 株式会社村田製作所 弾性波装置及びその製造方法
CN105814794B (zh) * 2013-12-26 2019-05-17 株式会社村田制作所 弹性波装置以及滤波器装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013544041A (ja) * 2011-03-25 2013-12-09 パナソニック株式会社 高次横モード波を抑制した弾性波デバイス
WO2017086004A1 (ja) * 2015-11-17 2017-05-26 株式会社村田製作所 弾性波装置及びその製造方法
JP2017224890A (ja) * 2016-06-13 2017-12-21 株式会社村田製作所 弾性波装置
WO2018131454A1 (ja) * 2017-01-13 2018-07-19 株式会社村田製作所 弾性波装置
WO2018163860A1 (ja) * 2017-03-06 2018-09-13 株式会社村田製作所 弾性波装置、高周波フロントエンド回路、通信装置及び弾性波装置の製造方法
WO2018198654A1 (ja) * 2017-04-26 2018-11-01 株式会社村田製作所 弾性波装置

Also Published As

Publication number Publication date
CN113785489B (zh) 2023-11-21
CN113785489A (zh) 2021-12-10
WO2020209359A1 (ja) 2020-10-15
JP7176622B2 (ja) 2022-11-22
US20220029601A1 (en) 2022-01-27

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