JPWO2020203568A1 - - Google Patents

Info

Publication number
JPWO2020203568A1
JPWO2020203568A1 JP2021511874A JP2021511874A JPWO2020203568A1 JP WO2020203568 A1 JPWO2020203568 A1 JP WO2020203568A1 JP 2021511874 A JP2021511874 A JP 2021511874A JP 2021511874 A JP2021511874 A JP 2021511874A JP WO2020203568 A1 JPWO2020203568 A1 JP WO2020203568A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021511874A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020203568A1 publication Critical patent/JPWO2020203568A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2021511874A 2019-03-29 2020-03-25 Pending JPWO2020203568A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019066612 2019-03-29
PCT/JP2020/013390 WO2020203568A1 (ja) 2019-03-29 2020-03-25 研磨用組成物の製造方法および研磨方法

Publications (1)

Publication Number Publication Date
JPWO2020203568A1 true JPWO2020203568A1 (ja) 2020-10-08

Family

ID=72667674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021511874A Pending JPWO2020203568A1 (ja) 2019-03-29 2020-03-25

Country Status (2)

Country Link
JP (1) JPWO2020203568A1 (ja)
WO (1) WO2020203568A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4067449A1 (en) * 2021-04-02 2022-10-05 SKC Solmics Co., Ltd. Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001335319A (ja) * 2000-05-23 2001-12-04 Jsr Corp 酸化セリウムの水性分散体の製造方法
JP2008028232A (ja) * 2006-07-24 2008-02-07 Sharp Corp 半導体基板研磨装置および半導体基板研磨方法、半導体装置の製造方法
WO2013073025A1 (ja) * 2011-11-16 2013-05-23 日産化学工業株式会社 半導体ウェーハ用研磨液組成物
JP2014239228A (ja) * 2014-06-27 2014-12-18 日立化成株式会社 Ｃｍｐ研磨液
CN107002280B (zh) * 2014-11-27 2019-06-18 住友电气工业株式会社 碳化硅基板、其制造方法和制造碳化硅半导体装置的方法
JP6768717B2 (ja) * 2016-02-09 2020-10-14 三井金属鉱業株式会社 研摩スラリー及び研摩材
JP6304841B2 (ja) * 2016-10-25 2018-04-04 花王株式会社 研磨液組成物の製造方法

Also Published As

Publication number Publication date
WO2020203568A1 (ja) 2020-10-08

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