JPWO2020202682A1 - - Google Patents

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Publication number
JPWO2020202682A1
JPWO2020202682A1 JP2021511115A JP2021511115A JPWO2020202682A1 JP WO2020202682 A1 JPWO2020202682 A1 JP WO2020202682A1 JP 2021511115 A JP2021511115 A JP 2021511115A JP 2021511115 A JP2021511115 A JP 2021511115A JP WO2020202682 A1 JPWO2020202682 A1 JP WO2020202682A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021511115A
Other versions
JP7259941B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020202682A1 publication Critical patent/JPWO2020202682A1/ja
Application granted granted Critical
Publication of JP7259941B2 publication Critical patent/JP7259941B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2021511115A 2019-04-05 2019-12-27 研磨ヘッド、研磨装置および半導体ウェーハの製造方法 Active JP7259941B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019072485 2019-04-05
JP2019072485 2019-04-05
PCT/JP2019/051501 WO2020202682A1 (ja) 2019-04-05 2019-12-27 研磨ヘッド、研磨装置および半導体ウェーハの製造方法

Publications (2)

Publication Number Publication Date
JPWO2020202682A1 true JPWO2020202682A1 (ja) 2020-10-08
JP7259941B2 JP7259941B2 (ja) 2023-04-18

Family

ID=72668666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021511115A Active JP7259941B2 (ja) 2019-04-05 2019-12-27 研磨ヘッド、研磨装置および半導体ウェーハの製造方法

Country Status (7)

Country Link
US (1) US20220161388A1 (ja)
JP (1) JP7259941B2 (ja)
KR (1) KR102592009B1 (ja)
CN (1) CN113613837B (ja)
DE (1) DE112019007165T5 (ja)
TW (1) TWI778338B (ja)
WO (1) WO2020202682A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022191609A (ja) 2021-06-16 2022-12-28 株式会社Sumco 研磨ヘッド、研磨装置及び半導体ウェーハの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008110407A (ja) * 2006-10-27 2008-05-15 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
JP2018032714A (ja) * 2016-08-24 2018-03-01 信越半導体株式会社 研磨装置及びウェーハの研磨方法
JP2018183820A (ja) * 2017-04-24 2018-11-22 株式会社荏原製作所 基板の研磨装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2758152B2 (ja) * 1995-04-10 1998-05-28 松下電器産業株式会社 被研磨基板の保持装置及び基板の研磨方法
JP3386651B2 (ja) * 1996-04-03 2003-03-17 株式会社東芝 半導体装置の製造方法および半導体製造装置
JP2003133277A (ja) * 2001-10-30 2003-05-09 Ebara Corp 研磨装置の研磨面洗浄装置
JP4107835B2 (ja) * 2001-12-06 2008-06-25 株式会社荏原製作所 基板保持装置及びポリッシング装置
KR100621629B1 (ko) * 2004-06-04 2006-09-19 삼성전자주식회사 화학적 기계적 연마 장치에 사용되는 연마 헤드 및 연마방법
KR100841094B1 (ko) * 2005-12-20 2008-06-25 주식회사 실트론 실리콘 웨이퍼 연마장치, 이에 이용되는 리테이닝어셈블리, 및 이를 이용한 실리콘 웨이퍼 평평도 보정방법
JP2009105144A (ja) * 2007-10-22 2009-05-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2009131920A (ja) * 2007-11-29 2009-06-18 Ebara Corp 研磨装置及び方法
DE112009002112B4 (de) * 2008-08-29 2023-01-05 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
JP5807580B2 (ja) * 2012-02-15 2015-11-10 信越半導体株式会社 研磨ヘッド及び研磨装置
JP6046752B2 (ja) * 2013-01-30 2016-12-21 京セラ株式会社 ガスノズルおよびこれを用いたプラズマ装置
JP6145342B2 (ja) * 2013-07-12 2017-06-07 株式会社荏原製作所 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置
TWI658899B (zh) * 2014-03-31 2019-05-11 日商荏原製作所股份有限公司 研磨裝置及研磨方法
JP6842858B2 (ja) * 2016-08-04 2021-03-17 三菱電機株式会社 換気装置および給気量調整方法
JP6828493B2 (ja) * 2017-02-15 2021-02-10 ウシオ電機株式会社 光照射装置および光照射方法
GB2567497A (en) 2017-10-16 2019-04-17 Dyson Technology Ltd A filter assembly for a vacuum cleaner
JP6891847B2 (ja) * 2018-04-05 2021-06-18 信越半導体株式会社 研磨ヘッド及びウェーハの研磨方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008110407A (ja) * 2006-10-27 2008-05-15 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
JP2018032714A (ja) * 2016-08-24 2018-03-01 信越半導体株式会社 研磨装置及びウェーハの研磨方法
JP2018183820A (ja) * 2017-04-24 2018-11-22 株式会社荏原製作所 基板の研磨装置

Also Published As

Publication number Publication date
TW202039153A (zh) 2020-11-01
KR102592009B1 (ko) 2023-10-19
KR20210126129A (ko) 2021-10-19
JP7259941B2 (ja) 2023-04-18
WO2020202682A1 (ja) 2020-10-08
US20220161388A1 (en) 2022-05-26
CN113613837B (zh) 2023-09-22
CN113613837A (zh) 2021-11-05
DE112019007165T5 (de) 2021-12-16
TWI778338B (zh) 2022-09-21

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