JPWO2020196542A1 - - Google Patents

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Publication number
JPWO2020196542A1
JPWO2020196542A1 JP2021509462A JP2021509462A JPWO2020196542A1 JP WO2020196542 A1 JPWO2020196542 A1 JP WO2020196542A1 JP 2021509462 A JP2021509462 A JP 2021509462A JP 2021509462 A JP2021509462 A JP 2021509462A JP WO2020196542 A1 JPWO2020196542 A1 JP WO2020196542A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021509462A
Other languages
Japanese (ja)
Other versions
JP7576023B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020196542A1 publication Critical patent/JPWO2020196542A1/ja
Application granted granted Critical
Publication of JP7576023B2 publication Critical patent/JP7576023B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/08—Planarisation of organic insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/092—Manufacture or treatment of dielectric parts thereof by smoothing the dielectric parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2021509462A 2019-03-27 2020-03-24 研磨用組成物、研磨方法および基板の製造方法 Active JP7576023B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019061636 2019-03-27
JP2019061636 2019-03-27
PCT/JP2020/013088 WO2020196542A1 (ja) 2019-03-27 2020-03-24 研磨用組成物、研磨方法および基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2020196542A1 true JPWO2020196542A1 (https=) 2020-10-01
JP7576023B2 JP7576023B2 (ja) 2024-10-30

Family

ID=72612030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509462A Active JP7576023B2 (ja) 2019-03-27 2020-03-24 研磨用組成物、研磨方法および基板の製造方法

Country Status (4)

Country Link
US (1) US11992914B2 (https=)
JP (1) JP7576023B2 (https=)
TW (1) TWI833935B (https=)
WO (1) WO2020196542A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7750652B2 (ja) * 2020-12-22 2025-10-07 ニッタ・デュポン株式会社 研磨用組成物
JP2023146033A (ja) * 2022-03-29 2023-10-12 株式会社フジミインコーポレーテッド スルホン酸変性コロイダルシリカ
JP2024018297A (ja) * 2022-07-29 2024-02-08 株式会社フジミインコーポレーテッド 研磨用組成物、研磨方法、及び半導体基板の製造方法
CN117430354A (zh) * 2023-11-14 2024-01-23 中建西部建设(广东)有限公司 一种新型水泥助磨剂及其制备方法
WO2026083515A1 (ja) * 2024-10-16 2026-04-23 株式会社レゾナック 研磨方法及びスラリ

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006026885A (ja) * 2004-06-14 2006-02-02 Kao Corp 研磨液組成物
JP2007150264A (ja) * 2005-10-27 2007-06-14 Hitachi Chem Co Ltd 有機絶縁材料膜及び銅膜複合材料用研磨材及び研磨方法
JP2007299942A (ja) * 2006-04-28 2007-11-15 Fujifilm Corp 金属研磨用組成物及びそれを用いた化学的機械的研磨方法
JP2014022511A (ja) * 2012-07-17 2014-02-03 Hitachi Chemical Co Ltd Ｃｍｐ用研磨液、ｃｍｐ用研磨液用貯蔵液、研磨方法、半導体基板及び電子機器
US20150114928A1 (en) * 2013-10-30 2015-04-30 Jia-Ni Chu Abrasive Particles for Chemical Mechanical Polishing
JP2015189898A (ja) * 2014-03-28 2015-11-02 株式会社フジミインコーポレーテッド 研磨用組成物
JP2017524767A (ja) * 2014-06-25 2017-08-31 キャボット マイクロエレクトロニクス コーポレイション タングステンの化学機械研磨組成物
WO2017200297A1 (ko) * 2016-05-19 2017-11-23 주식회사 동진쎄미켐 화학-기계적 연마용 슬러리 조성물
JP2018012752A (ja) * 2016-07-19 2018-01-25 日立化成株式会社 研磨剤、研磨剤用貯蔵液及び研磨方法
US20190085209A1 (en) * 2017-09-15 2019-03-21 Cabot Microelectronics Corporation Composition for tungsten cmp
JP2019157120A (ja) * 2018-03-13 2019-09-19 Jsr株式会社 化学機械研磨用組成物及び化学機械研磨方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005268666A (ja) 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
JP6730859B2 (ja) * 2015-07-15 2020-07-29 株式会社フジミインコーポレーテッド 研磨用組成物および磁気ディスク基板製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006026885A (ja) * 2004-06-14 2006-02-02 Kao Corp 研磨液組成物
JP2007150264A (ja) * 2005-10-27 2007-06-14 Hitachi Chem Co Ltd 有機絶縁材料膜及び銅膜複合材料用研磨材及び研磨方法
JP2007299942A (ja) * 2006-04-28 2007-11-15 Fujifilm Corp 金属研磨用組成物及びそれを用いた化学的機械的研磨方法
JP2014022511A (ja) * 2012-07-17 2014-02-03 Hitachi Chemical Co Ltd Ｃｍｐ用研磨液、ｃｍｐ用研磨液用貯蔵液、研磨方法、半導体基板及び電子機器
US20150114928A1 (en) * 2013-10-30 2015-04-30 Jia-Ni Chu Abrasive Particles for Chemical Mechanical Polishing
JP2015189898A (ja) * 2014-03-28 2015-11-02 株式会社フジミインコーポレーテッド 研磨用組成物
JP2017524767A (ja) * 2014-06-25 2017-08-31 キャボット マイクロエレクトロニクス コーポレイション タングステンの化学機械研磨組成物
WO2017200297A1 (ko) * 2016-05-19 2017-11-23 주식회사 동진쎄미켐 화학-기계적 연마용 슬러리 조성물
JP2018012752A (ja) * 2016-07-19 2018-01-25 日立化成株式会社 研磨剤、研磨剤用貯蔵液及び研磨方法
US20190085209A1 (en) * 2017-09-15 2019-03-21 Cabot Microelectronics Corporation Composition for tungsten cmp
JP2019157120A (ja) * 2018-03-13 2019-09-19 Jsr株式会社 化学機械研磨用組成物及び化学機械研磨方法

Also Published As

Publication number Publication date
WO2020196542A1 (ja) 2020-10-01
US11992914B2 (en) 2024-05-28
JP7576023B2 (ja) 2024-10-30
TWI833935B (zh) 2024-03-01
TW202100711A (zh) 2021-01-01
US20220055180A1 (en) 2022-02-24

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